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21. 发明授权

US08643762B2 Optical device, solid-state image apparatus, portable information terminal, and display apparatus 有权
标题翻译：光学装置，固态图像装置，便携式信息终端和显示装置
公开(公告)号：US08643762B2
公开(公告)日：2014-02-04
申请号：US13221195
申请日：2011-08-30
申请人： Kazuhiro Suzuki , Risako Ueno , Hideyuki Funaki
发明人： Kazuhiro Suzuki , Risako Ueno , Hideyuki Funaki
IPC分类号： H04N5/225 , G02B17/00
CPC分类号： G02B13/0015 , G02B26/08 , G02B27/22 , G03B25/02 , G03B35/24 , H04N13/356
摘要： An optical element according to an embodiment includes: a lens array including a plurality of convex shaped lenses provided on a first surface thereof and taking a flat shape at a second surface which is opposite from the first surface; a lens holder comprising concave portions formed to correspond to respective lenses in the lens array, at a surface opposed to the lens array, each of the concave portions having a size which makes it possible for one of the convex shaped lenses corresponding to the concave portion to fit therein; and a drive unit configured to drive at least one of the lens array and the lens holder to bring the convex shaped lenses in the lens array and the concave portions in the lens holder into an isolation state or a contact state.
摘要翻译：根据实施例的光学元件包括：透镜阵列，包括设置在其第一表面上的多个凸形透镜，并且在与第一表面相对的第二表面处呈平坦形状; 透镜架，其包括形成为与透镜阵列中的各个透镜相对应的凹部，在与透镜阵列相对的表面处，每个凹部具有使得可以使一个凸形透镜对应于凹部适合其中以及驱动单元，被配置为驱动所述透镜阵列和所述透镜保持器中的至少一个，以将所述凸形透镜置于所述透镜阵列中，并且所述透镜保持器中的所述凹部处于隔离状态或接触状态。

22. 发明授权

US08466529B2 Imaging device, imaging module and method for manufacturing imaging device 有权
标题翻译：成像装置，成像模块和制造成像装置的方法
公开(公告)号：US08466529B2
公开(公告)日：2013-06-18
申请号：US13051413
申请日：2011-03-18
申请人： Kazuhiro Suzuki , Risako Ueno , Honam Kwon , Koichi Ishii , Hideyuki Funaki
发明人： Kazuhiro Suzuki , Risako Ueno , Honam Kwon , Koichi Ishii , Hideyuki Funaki
IPC分类号： H01L31/0232
CPC分类号： H01L27/14618 , H01L27/14649 , H01L2224/13
摘要： According to one embodiment, an imaging device includes a substrate, a photodetecting portion, a circuit portion and a through interconnect. The substrate has a first major surface, a second major surface on a side opposite to the first major surface, a recess portion provided on the first major surface and retreated in a first direction going from the first major surface to the second major surface, and a through hole communicating with the first major surface and the second major surface and extending in the first direction. The photodetecting portion is provided above the recess portion and away from the substrate. The circuit portion is electrically connected to the photodetecting portion and provided on the first major surface. The through interconnect is electrically connected to the circuit portion and provided inside the through hole. The recess portion has a first inclined surface. The through hole has a second inclined surface.
摘要翻译：根据一个实施例，成像装置包括基板，光电检测部分，电路部分和通孔互连。基板具有第一主表面，与第一主表面相对的一侧的第二主表面，设置在第一主表面上并沿着从第一主表面到第二主表面的第一方向退回的凹部，以及与所述第一主表面和所述第二主表面连通并且沿所述第一方向延伸的通孔。光电检测部分设置在凹部的上方并远离基板。电路部分电连接到光电检测部分并设置在第一主表面上。通孔互连电连接到电路部分并设置在通孔的内部。凹部具有第一倾斜面。通孔具有第二倾斜面。

23. 发明申请

US20130075586A1 SOLID IMAGING DEVICE AND PORTABLE INFORMATION TERMINAL DEVICE 有权
标题翻译：固体成像装置和便携式信息终端装置
公开(公告)号：US20130075586A1
公开(公告)日：2013-03-28
申请号：US13361321
申请日：2012-01-30
申请人： Risako UENO , Hideyuki Funaki , Kazuhiro Suzuki , Mitsuyoshi Kobayashi , Honam Kwon
发明人： Risako UENO , Hideyuki Funaki , Kazuhiro Suzuki , Mitsuyoshi Kobayashi , Honam Kwon
IPC分类号： H01L27/148 , H01L27/146
CPC分类号： H01L27/14623 , H01L27/14632 , H01L27/14634
摘要： According to one embodiment, a solid imaging device includes an imaging substrate, a light-shielding member and a AD conversion circuits. The imaging substrate is two-dimensionally arranged with a plurality of pixels. The plurality of pixels have a top face formed with an optoelectronic conversion element for converting incident light into an electric charge and storing it and a back face opposite to the top faces. The imaging substrate is formed with a top face by the top face of the plurality of pixels and formed with a back face by the back face of the plurality of pixels. The light-shielding member is provided on the top face side of the imaging substrate. The AD conversion circuits is formed on the back face of the pixels shielded from the light.
摘要翻译：根据一个实施例，固体成像装置包括成像基板，遮光部件和AD转换电路。成像基板二维排列有多个像素。多个像素具有形成有光电转换元件的顶面，用于将入射光转换成电荷并将其存储，并且与顶面相反的背面。成像基板由多个像素的顶面形成有顶面，并且由多个像素的背面形成有背面。遮光构件设置在成像基板的顶面侧。 AD转换电路形成在屏蔽光的像素的背面上。

24. 发明申请

US20130075585A1 SOLID IMAGING DEVICE 审中-公开
标题翻译：固体成像装置
公开(公告)号：US20130075585A1
公开(公告)日：2013-03-28
申请号：US13361293
申请日：2012-01-30
申请人： Mitsuyoshi Kobayashi , Hideyuki Funaki , Risako Ueno , Kazuhiro Suzuki
发明人： Mitsuyoshi Kobayashi , Hideyuki Funaki , Risako Ueno , Kazuhiro Suzuki
IPC分类号： H01L27/146
CPC分类号： G01J1/0411 , G01J1/0242 , G01J1/0429 , G01J1/4228 , G01J4/04 , G01N21/21 , G02B5/3025 , G02B27/0075 , H01L27/14627 , H01L27/14629
摘要： According to one embodiment, a solid imaging device includes an imaging substrate, an imaging lens, a microlens array substrate and a polarizing plate array substrate. The imaging substrate has a plurality of pixels formed on an upper side thereof. The imaging lens is provided above the imaging substrate. The optical axis in the imaging lens intersects with the upper side of the imaging substrate. The microlens array substrate is provided between the imaging substrate and the imaging lens. A surface in the microlens array substrate has a plurality of microlenses arranged two-dimensionally. The surface of the microlens array intersects with the optical axis. The polarizing plate array substrate is provided between the imaging substrate and the imaging lens. The plurality of kinds of polarizing plates in the polarizing plate array substrate having polarization axes in mutually different directions are arranged two dimensionally.
摘要翻译：根据一个实施例，固体成像装置包括成像基板，成像透镜，微透镜阵列基板和偏振板阵列基板。成像基板在其上侧形成有多个像素。成像透镜设置在成像基板的上方。成像透镜中的光轴与成像基板的上侧相交。微透镜阵列基板设置在成像基板和成像透镜之间。微透镜阵列基板中的表面具有二维布置的多个微透镜。微透镜阵列的表面与光轴相交。偏振板阵列基板设置在成像基板和成像透镜之间。偏振板阵列基板中的偏振板在相互不同的方向上具有偏振轴的多种偏振片被二维排列。

25. 发明授权

US08304848B2 Infrared imaging device and method of manufacturing the same 有权
标题翻译：红外成像装置及其制造方法
公开(公告)号：US08304848B2
公开(公告)日：2012-11-06
申请号：US12883732
申请日：2010-09-16
申请人： Kazuhiro Suzuki , Ikuo Fujiwara , Keita Sasaki , Honam Kwon , Hitoshi Yagi , Hiroto Honda , Koichi Ishii , Masako Ogata , Risako Ueno , Hideyuki Funaki
发明人： Kazuhiro Suzuki , Ikuo Fujiwara , Keita Sasaki , Honam Kwon , Hitoshi Yagi , Hiroto Honda , Koichi Ishii , Masako Ogata , Risako Ueno , Hideyuki Funaki
IPC分类号： H01L31/00 , H01L31/04
CPC分类号： G01J5/02 , G01J5/023 , G01J5/024 , H04N5/33
摘要： Certain embodiments provide an infrared imaging device including: an SOI structure that is placed at a distance from a substrate, and includes: heat-sensitive diodes that detect infrared rays and convert the infrared rays into heat; and STI regions that separate the heat-sensitive diodes from one another; an interlayer insulating film that is stacked on the SOI structure; and supporting legs that are connected to the heat-sensitive diodes and vertical signal lines provided in outer peripheral regions of the heat-sensitive diodes. Each of the supporting legs includes: an interconnect unit that transmit signals to the vertical signal lines; and interlayer insulating layers that sandwich the interconnect unit, each bottom side of the interlayer insulating layers being located in a higher position than the SOI structure.
摘要翻译：某些实施例提供了一种红外成像装置，包括：SOI结构，其被放置在离基板一定距离处，并且包括：热敏二极管，其检测红外线并将红外线转换成热; 以及将热敏二极管彼此分离的STI区域; 堆叠在SOI结构上的层间绝缘膜; 以及连接到热敏二极管的支撑腿和设置在热敏二极管的外周区域中的垂直信号线。每个支撑腿包括：将信号传输到垂直信号线的互连单元; 以及层叠绝缘层，夹着所述互连单元，所述层间绝缘层的每个底侧位于比所述SOI结构更高的位置。

26. 发明申请

US20090127639A1 SEMICONDUCTOR APPARATUS 审中-公开
公开(公告)号：US20090127639A1
公开(公告)日：2009-05-21
申请号：US12206101
申请日：2008-09-08
申请人： Kazuhiro Suzuki , Yoshinori Iida , Hideyuki Funaki
发明人： Kazuhiro Suzuki , Yoshinori Iida , Hideyuki Funaki
IPC分类号： H01L25/00
CPC分类号： G01C19/5719 , B81C1/00238 , B81C2203/0109 , B81C2203/019
摘要： A semiconductor apparatus includes: a first chip including a MEMS device which has a structure supported in midair therein, and having first pads and a first joining region electrically connected to the MEMS device on a top face thereof; a second chip including a circuit having a semiconductor device electrically connected to the MEMS device therein, and having second pads and a second joining region electrically connected to the semiconductor device on a top face thereof, the second chip being disposed in opposition to the first chip so as to oppose the second pads and the second joining region respectively to the first pads and the first joining region; electrical connection parts which electrically connect the first pads to the second pads, respectively; and joining parts provided between the first joining region and the second joining region opposed to the first joining region to join the first chip and the second chip to each other.
摘要翻译：半导体装置包括：第一芯片，其包括具有支撑在其中空间的结构的MEMS器件，并且具有第一焊盘和在其顶面上电连接到MEMS器件的第一接合区域; 第二芯片，包括具有与其中的MEMS器件电连接的半导体器件的电路，并且具有在其顶面上与半导体器件电连接的第二焊盘和第二接合区域，第二芯片设置成与第一芯片相对以便分别将第二焊盘和第二接合区域与第一焊盘和第一接合区域相对; 分别将第一焊盘电连接到第二焊盘的电连接部分; 以及设置在第一接合区域和与第一接合区域相对的第二接合区域之间的接合部分，以将第一芯片和第二芯片彼此接合。

27. 发明申请

US20050241398A1 Acoustoelectric conversion device 失效
标题翻译：声电转换装置
公开(公告)号：US20050241398A1
公开(公告)日：2005-11-03
申请号：US11116273
申请日：2005-04-28
申请人： Kazuhiro Suzuki , Hideyuki Funaki , Yoshinori Iida , Yujiro Naruse
发明人： Kazuhiro Suzuki , Hideyuki Funaki , Yoshinori Iida , Yujiro Naruse
IPC分类号： H04R7/02 , G01H9/00 , G01N29/04 , G01N29/24 , H04R7/04 , H04R19/04
CPC分类号： G01N29/2418 , G01H9/00
摘要： In an acoustoelectric converter element, a light wave from a light source is introduced into a first optical waveguide of a vibration substrate, and diffracted by a diffraction grating disposed on the first optical waveguide. The diffracted light is directed to and detected by a photo detector. Here, the vibration substrate is so supported as to vibrate with respect to an acoustic wave. Therefore, the diffracted light detected by the photo detector is modulated by the acoustic wave, and a signal is output from the detector in accordance with the acoustic wave.
摘要翻译：在声电转换元件中，来自光源的光波被引入到振动基板的第一光波导中，并且被设置在第一光波导上的衍射光栅衍射。衍射光被光检测器导向并检测。这里，振动基板被支撑为相对于声波振动。因此，由光检测器检测的衍射光被声波调制，并且根据声波从检测器输出信号。

28. 发明授权

US07293463B2 Acoustoelectric conversion device 失效
标题翻译：声电转换装置
公开(公告)号：US07293463B2
公开(公告)日：2007-11-13
申请号：US11116273
申请日：2005-04-28
申请人： Kazuhiro Suzuki , Hideyuki Funaki , Yoshinori Iida , Yujiro Naruse
发明人： Kazuhiro Suzuki , Hideyuki Funaki , Yoshinori Iida , Yujiro Naruse
IPC分类号： G01H9/00 , G01B11/16
CPC分类号： G01N29/2418 , G01H9/00
摘要： In an acoustoelectric converter element, a light wave from a light source is introduced into a first optical waveguide of a vibration substrate, and diffracted by a diffraction grating disposed on the first optical waveguide. The diffracted light is directed to and detected by a photo detector. Here, the vibration substrate is so supported as to vibrate with respect to an acoustic wave. Therefore, the diffracted light detected by the photo detector is modulated by the acoustic wave, and a signal is output from the detector in accordance with the acoustic wave.
摘要翻译：在声电转换元件中，来自光源的光波被引入到振动基板的第一光波导中，并且被设置在第一光波导上的衍射光栅衍射。衍射光被光检测器导向并检测。这里，振动基板被支撑为相对于声波振动。因此，由光检测器检测的衍射光被声波调制，并且根据声波从检测器输出信号。

29. 发明申请

US20050052724A1 Opto-acoustoelectric device and methods for analyzing mechanical vibration and sound 失效
标题翻译：光电装置及分析机械振动和声音的方法
公开(公告)号：US20050052724A1
公开(公告)日：2005-03-10
申请号：US10895049
申请日：2004-07-21
申请人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
发明人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
IPC分类号： H04R1/38 , G01H9/00 , G02F1/33
CPC分类号： G01H9/00
摘要： An opto-acoustoelectric device encompasses a diaphragm having a diffraction grating, the diaphragm is susceptible to a vibration driven by an external force; a light source oriented to irradiate the diffraction grating; and a photo detector configured to detect the light diffracted by the diffraction grating and to convert the detected light into an electric signal. The electric signal corresponds to a displacement of the vibration in the diaphragm.
摘要翻译：光声装置包括具有衍射光栅的光阑，所述光阑易受外力驱动的振动; 定向成照射衍射光栅的光源; 以及光检测器，被配置为检测由衍射光栅衍射的光并将检测到的光转换成电信号。电信号对应于隔膜中振动的位移。

30. 发明申请

US20070028695A1 OPTO-ACOUSTOELECTRIC DEVICE AND METHODS FOR ANALYZING MECHANICAL VIBRATION AND SOUND 审中-公开
标题翻译：用于分析机械振动和声音的光电装置和方法
公开(公告)号：US20070028695A1
公开(公告)日：2007-02-08
申请号：US11534541
申请日：2006-09-22
申请人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
发明人： Kazuhiro Suzuki , Hideyuki Funaki , Keitaro Shigenaka , Tomio Ono , Tadashi Sakai , Yujiro Naruse , Yoshinori Iida , Ikuo Fujiwara
IPC分类号： G01H9/00
CPC分类号： G01H9/00
摘要： An opto-acoustoelectric device encompasses a diaphragm having a diffraction grating, the diaphragm is susceptible to a vibration driven by an external force; a light source oriented to irradiate the diffraction grating; and a photo detector configured to detect the light diffracted by the diffraction grating and to convert the detected light into an electric signal. The electric signal corresponds to a displacement of the vibration in the diaphragm.
摘要翻译：光声装置包括具有衍射光栅的光阑，所述光阑易受外力驱动的振动; 定向成照射衍射光栅的光源; 以及光检测器，被配置为检测由衍射光栅衍射的光并将检测到的光转换成电信号。电信号对应于隔膜中振动的位移。

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