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21. 发明申请

US20120034437A1 MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING 有权
标题翻译：多层结合层用于薄膜处理
公开(公告)号：US20120034437A1
公开(公告)日：2012-02-09
申请号：US13198294
申请日：2011-08-04
申请人： Rama Puligadda , Xing-Fu Zhong , Tony D. Flaim , Jeremy McCutcheon
发明人： Rama Puligadda , Xing-Fu Zhong , Tony D. Flaim , Jeremy McCutcheon
IPC分类号： B32B27/32 , B32B7/02 , B32B27/40 , B32B27/36 , B32B27/00 , H01L21/30 , B32B27/38
CPC分类号： H01L21/6835 , B32B38/0008 , B32B38/10 , B32B43/006 , H01L21/2007 , H01L21/6836 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/351 , Y10T156/10 , Y10T156/11 , Y10T156/1126 , Y10T428/24942 , Y10T428/26 , Y10T428/31511 , Y10T428/31551 , Y10T428/31663 , Y10T428/31721 , Y10T428/31725 , Y10T428/31935 , Y10T428/31938 , H01L2924/00
摘要： Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.
摘要翻译：提供临时连接半导体衬底的多个结合层方案。在本发明的接合方案中，至少一个层直接与半导体衬底接触，且该方案中的至少两个层彼此直接接触。本发明提供了多个处理选择，因为多层结构内的不同层执行特定的功能。更重要的是，它将通过提供更高的热稳定性，与苛刻的背面处理步骤的更大兼容性，通过封装保护晶片正面的凸块，在脱粘步骤中降低应力和减少剥离步骤来提高薄晶片处理解决方案的性能正面的缺陷。

22. 发明授权

US08092628B2 Cyclic olefin compositions for temporary wafer bonding 有权
标题翻译：用于临时晶圆键合的环状烯烃组合物
公开(公告)号：US08092628B2
公开(公告)日：2012-01-10
申请号：US12263120
申请日：2008-10-31
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： B32B37/00
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译：提供了使用这些组合物作为粘合组合物的新组合物和方法。组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。

23. 发明申请

US20110086955A1 CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING 有权
标题翻译：用于临时波形粘结的循环烯烃组合物
公开(公告)号：US20110086955A1
公开(公告)日：2011-04-14
申请号：US12969367
申请日：2010-12-15
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： C08K5/5393 , C09J147/00
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译：提供了使用这些组合物作为粘合组合物的新组合物和方法。组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。

24. 发明申请

US20100112305A1 CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING 有权
标题翻译：用于临时波形粘结的循环烯烃组合物
公开(公告)号：US20100112305A1
公开(公告)日：2010-05-06
申请号：US12263120
申请日：2008-10-31
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： B32B5/00 , C08L65/00 , C08L93/00 , C08L93/04 , C08K5/51 , C08K5/13 , B29C63/00 , B32B37/00
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译：提供了使用这些组合物作为粘合组合物的新组合物和方法。组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。

25. 发明授权

US07364835B2 Developer-soluble materials and methods of using the same in via-first dual damascene applications 有权
标题翻译：显影剂可溶性材料及其在通孔 - 第一双镶嵌应用中的使用方法
公开(公告)号：US07364835B2
公开(公告)日：2008-04-29
申请号：US10966909
申请日：2004-10-15
申请人： Mandar Bhave , Carlton A. Washburn , Rama Puligadda , Kevin Edwards
发明人： Mandar Bhave , Carlton A. Washburn , Rama Puligadda , Kevin Edwards
IPC分类号： G03C5/00 , G03F7/00
CPC分类号： H01L21/02118 , G03F7/091 , H01L21/312 , H01L21/76808
摘要： Wet-recess (develop) gap-fill and bottom anti-reflective coatings based on a polyamic acid or polyester platform are provided. The polyamic acid platform allows imidization to form a polyimide when supplied with thermal energy. The gap-fill and bottom anti-reflective coatings are soluble in standard aqueous developers, and are useful for patterning via holes and trenches on semiconductor substrates in a dual damascene patterning scheme. In one embodiment, compositions composed of polyamic acids can be used as gap-filling (via-filling) materials having no anti-reflective function in a copper dual damascene process to improve iso-dense fill bias across different via arrays. In another embodiment, the same composition can be used for anti-reflective purposes, wherein the photoresist can be directly coated over the recessed surface, while it also acts as a fill material to planarize via holes on the substrate. The compositions described here are particularly suitable for use at exposure wavelengths of less than about 370 nm.
摘要翻译：提供了基于聚酰胺酸或聚酯平台的湿式凹陷（开发）间隙填充和底部抗反射涂层。当提供热能时，聚酰胺酸平台允许酰亚胺化形成聚酰亚胺。间隙填充和底部抗反射涂层可溶于标准含水显影剂，并且可用于在双镶嵌图案化方案中图案化半导体衬底上的通孔和沟槽。在一个实施方案中，由聚酰胺酸组成的组合物可用作在铜双镶嵌工艺中不具有抗反射功能的间隙填充（通孔填充）材料，以改善穿过不同通孔阵列的等密度填充偏压。在另一个实施方案中，相同的组合物可以用于抗反射目的，其中光致抗蚀剂可以直接涂覆在凹陷表面上，同时它也用作平坦化基底上的通孔的填充材料。这里描述的组合物特别适用于小于约370nm的曝光波长。

26. 发明授权

US07038328B2 Anti-reflective compositions comprising triazine compounds 有权
标题翻译：包含三嗪化合物的抗反射组合物
公开(公告)号：US07038328B2
公开(公告)日：2006-05-02
申请号：US10271646
申请日：2002-10-15
申请人： Tomoyuki Enomoto , Keisuke Nakayama , Rama Puligadda
发明人： Tomoyuki Enomoto , Keisuke Nakayama , Rama Puligadda
IPC分类号： H01L23/29 , B32B27/32
CPC分类号： G03F7/091 , Y10T428/31938
摘要： The present invention relates to an anti-reflective coating composition characterized by comprising a resin made from triazine compounds having at least two nitrogen atoms substituted a hydroxymethyl group and/or an alkoxymethyl group, and a light absorbing compound and/or a light absorbing resin. The present invention offers an anti-reflective coating composition for the anti-reflective coating having high light absorption property of the light used for the lithography process in the preparation of semiconductor device, showing high reflective light preventing effect, being used at thinner film thickness more than before, and having greater dry etching rate in comparison to photoresist layer.
摘要翻译：本发明涉及一种抗反射涂料组合物，其特征在于包含由具有至少两个氮原子取代羟甲基和/或烷氧基甲基的三嗪化合物制成的树脂，以及光吸收化合物和/或光吸收树脂。本发明提供了一种用于抗反射涂层的抗反射涂层组合物，其在制备半导体器件时用于光刻工艺的光具有高的光吸收特性，显示出高的防反射光效果，在更薄的膜厚度下使用并且与光致抗蚀剂层相比具有更大的干蚀刻速率。

27. 发明授权

US06653411B2 Anti-reflective coating compositions comprising polymerized aminoplasts 有权
公开(公告)号：US06653411B2
公开(公告)日：2003-11-25
申请号：US10003558
申请日：2001-10-24
申请人： Rama Puligadda , Runhui Huang
发明人： Rama Puligadda , Runhui Huang
IPC分类号： C08L6700
CPC分类号： H04B1/403 , C08L61/28 , G02B1/111 , H04B1/30
摘要： Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values and can be formulated for both conformal and planar applications.

28. 发明授权

US06432611B1 Anti-reflective coating compositions comprising polymerized aminoplasts 有权
公开(公告)号：US06432611B1
公开(公告)日：2002-08-13
申请号：US09691780
申请日：2000-10-18
申请人： Rama Puligadda , Runhui Huang
发明人： Rama Puligadda , Runhui Huang
IPC分类号： G03C1492
CPC分类号： G02B1/111 , C08L61/28 , Y10T428/31504 , Y10T428/31667 , Y10T428/31862 , Y10T428/31942
摘要： Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values and can be formulated for both conformal and planar applications.

29. 发明授权

US06399686B1 Anti-reflective coating compositions comprising polymerized aminoplasts 有权
标题翻译：包含聚合的氨基塑料的抗反射涂料组合物
公开(公告)号：US06399686B1
公开(公告)日：2002-06-04
申请号：US09691774
申请日：2000-10-18
申请人： Rama Puligadda , Runhui Huang
发明人： Rama Puligadda , Runhui Huang
IPC分类号： B05D302
CPC分类号： G02B1/111 , C08L61/28 , Y10T428/31504 , Y10T428/31667 , Y10T428/31862 , Y10T428/31942
摘要： Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—,—CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values and can be formulated for both conformal and planar applications.
摘要翻译：提供用于集成电路制造工艺的改进的抗反射涂料组合物和形成这些组合物的方法。广泛地，通过在酸性条件下加热包含特定化合物（例如，烷氧基烷基三聚氰胺，烷氧基烷基苯胍胺）的化合物的溶液来形成组合物，以便使化合物聚合并形成平均分子量为至少约1,000道尔顿的聚合物。所得聚合物的单体通过与各单体上的氮原子键合的连接基团（例如-CH 2 - ， - CH 2 -O-CH 2 - ）彼此连接。将聚合的化合物与溶剂混合并施加到基材表面，然后将其烘焙以形成抗反射层。所得到的层具有高k值，并且可以适用于共形和平面应用。

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