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21. 发明授权

US07118679B2 Method of fabricating a sharp protrusion 失效
标题翻译：制造锋利突起的方法
公开(公告)号：US07118679B2
公开(公告)日：2006-10-10
申请号：US10902762
申请日：2004-07-30
申请人： Peter G. Hartwell , Uija Yoon
发明人： Peter G. Hartwell , Uija Yoon
IPC分类号： B44C1/22 , H01L21/00
CPC分类号： H01J9/025 , G01Q70/16 , G01Q80/00 , H01J2201/30407 , H01J2329/00
摘要： A method of fabricating a sharp protrusion on an underlayer is disclosed. A tip layer is deposited on an underlayer and then a mask layer is deposited on the tip layer. The mask layer is patterned with a beam-and-hat pattern that is used to form a beam-and-hat mask in the mask layer. Portions of the tip layer that are not covered by the beam-and-hat mask are isotropically etched to form a tip including a vertex. Beam portions of the beam-and-hat mask support the hat portion and prevent a release of the hat portion during the isotropic etching process. An anisotropic etch process can be used prior to the isotropic etching process to change a character of the tip. The underlayer can be patterned and etched to form a cantilever that includes the sharp protrusion extending outward of a surface of the cantilever.
摘要翻译：公开了一种在底层上制造尖锐突起的方法。尖端层沉积在底层上，然后掩模层沉积在尖端层上。使用用于在掩模层中形成光束和帽子掩模的光束和帽子图案来对掩模层进行图案化。尖端层的未被束帽掩模覆盖的部分被各向同性蚀刻以形成包括顶点的尖端。梁和帽子面罩的梁部分支撑帽部分并且防止在各向同性蚀刻过程期间帽部分的释放。在各向同性蚀刻工艺之前可以使用各向异性蚀刻工艺来改变尖端的特性。底层可以被图案化和蚀刻以形成悬臂，其包括从悬臂的表面向外延伸的尖锐突起。

22. 发明授权

US07042105B2 Methods for dicing wafer stacks to provide access to interior structures 有权
标题翻译：用于切割晶片堆叠以提供对内部结构的通路的方法
公开(公告)号：US07042105B2
公开(公告)日：2006-05-09
申请号：US11078458
申请日：2005-03-11
申请人： Peter G. Hartwell , David Horsley , Storrs T. Hoen , Jonah A. Harley
发明人： Peter G. Hartwell , David Horsley , Storrs T. Hoen , Jonah A. Harley
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , B81C1/00873 , H01L21/78 , H01L25/0657 , H01L2225/06513 , H01L2225/06555 , H01L2924/0002 , H01L2924/00
摘要： Methods for dicing water stacks are provided. Preferably, the method includes the steps of: (1) providing a wafer stack having a first wafer and a second wafer; (2) exposing a portion of the first wafer by removing a portion of the second wafer; and (3) dicing the exposed portion of the first wafer such that a first die assembly is at least partially separated from the wafer stack. Wafer stacks and die assemblies also are provided.
摘要翻译：提供了切割水堆的方法。优选地，该方法包括以下步骤：（1）提供具有第一晶片和第二晶片的晶片叠层; （2）通过去除第二晶片的一部分来暴露第一晶片的一部分; 和（3）切割第一晶片的暴露部分，使得第一模具组件至少部分地与晶片堆叠分离。还提供了晶片堆叠和模具组件。

23. 发明授权

US06955976B2 Method for dicing wafer stacks to provide access to interior structures 失效
标题翻译：用于切割晶片堆叠以提供对内部结构的通路的方法
公开(公告)号：US06955976B2
公开(公告)日：2005-10-18
申请号：US10066213
申请日：2002-02-01
申请人： Peter G. Hartwell , David Horsley , Storrs T. Hoen , Jonah A. Harley
发明人： Peter G. Hartwell , David Horsley , Storrs T. Hoen , Jonah A. Harley
IPC分类号： H01L21/301 , B81C1/00 , H01L21/78 , H01L21/98 , H01L25/065 , H01L21/30
CPC分类号： H01L25/50 , B81C1/00873 , H01L21/78 , H01L25/0657 , H01L2225/06513 , H01L2225/06555 , H01L2924/0002 , H01L2924/00
摘要： Methods for dicing wafer stacks are provided. Preferably, the method includes the steps of: (1) providing a wafer stack having a first wafer and a second wafer; (2) exposing a portion of the first wafer by removing a portion of the second wafer; and (3) dicing the exposed portion of the first wafer such that a first die assembly is at least partially separated from the wafer stack. Wafer stacks and die assemblies also are provided.
摘要翻译：提供了切割晶片叠层的方法。优选地，该方法包括以下步骤：（1）提供具有第一晶片和第二晶片的晶片叠层; （2）通过去除第二晶片的一部分来暴露第一晶片的一部分; 和（3）切割第一晶片的暴露部分，使得第一模具组件至少部分地与晶片堆叠分离。还提供了晶片堆叠和模具组件。

24. 发明授权

US06798392B2 Smart helmet 失效
标题翻译：智能头盔
公开(公告)号：US06798392B2
公开(公告)日：2004-09-28
申请号：US09977689
申请日：2001-10-16
申请人： Peter G. Hartwell , James A. Brug
发明人： Peter G. Hartwell , James A. Brug
IPC分类号： G09G500
CPC分类号： A42B3/30 , A42B3/046
摘要： A smart helmet included integrated electronics providing safety and convenience features. Helmet features includes a global locating system, an environmental interaction sensor, a mobile communications network device, a small display panel, a microphone and at least one speaker. The helmet is aware of the user's location and interactions with the environment. The helmet can provide data to a user, monitor the user's actions and condition, and send information to others about user's location and condition.
摘要翻译：智能头盔包括提供安全和便利功能的集成电子产品。头盔特征包括全球定位系统，环境交互传感器，移动通信网络设备，小型显示面板，麦克风和至少一个扬声器。头盔知道用户的位置和与环境的交互。头盔可以向用户提供数据，监视用户的行为和状况，并向他人发送有关用户位置和状况的信息。

25. 发明授权

US06784593B2 Use of standoffs to protect atomic resolution storage mover for out-of-plane motion 失效
公开(公告)号：US06784593B2
公开(公告)日：2004-08-31
申请号：US10289805
申请日：2002-11-06
申请人： Peter G. Hartwell
发明人： Peter G. Hartwell
IPC分类号： H02N100
CPC分类号： H02N1/006
摘要： A micro-machined actuator for use in, among other things, sensors and data storage devices. The actuator includes a stator wafer and a micro-mover positioned adjacent to the stator wafer. Between the stator wafer and the micro-mover are electrodes that are set to specified voltages and that emanate electric fields that position the micro-mover relative to the stator wafer. Also between stator wafer and the micro-mover are bumpers that prevent the electrodes from coming into contact with each other.

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