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21. 发明授权

US5827605A Ceramic multilayer substrate and method of producing the same 失效
标题翻译：陶瓷多层基板及其制造方法
公开(公告)号：US5827605A
公开(公告)日：1998-10-27
申请号：US576440
申请日：1995-12-21
申请人： Mitsuyoshi Nishide , Hiroji Tani
发明人： Mitsuyoshi Nishide , Hiroji Tani
IPC分类号： B32B17/00 , B32B17/06 , B32B18/00 , H05K1/03 , H05K3/46 , B32B9/00
CPC分类号： B32B17/06 , B32B17/00 , B32B18/00 , C04B37/005 , H05K3/4614 , H05K3/4629 , C04B2237/10 , C04B2237/34 , C04B2237/346 , C04B2237/62 , C04B2237/64 , C04B2237/68 , C04B2237/70 , C04B2237/72 , H05K1/0306 , H05K2201/0195 , H05K2201/068 , H05K3/4626 , H05K3/4688 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/24926 , Y10T428/24983
摘要： The present invention provides a multilayer ceramic substrate and a method of producing the same which can prevent occurrence of cracks when laminating different ceramic substrates or due to subsequent heat shock, and which has excellent moisture resistance and insulation properties and high reliability. The ceramic multilayer substrate has two ceramic substrates of different thermal expansion coefficients laminated by at least two glass layers of different thermal expansion coefficients which are between the thermal expansion coefficients of the ceramic substrates so that the thermal expansion coefficient changes stepwise between the ceramic substrates. The differences in thermal expansion coefficient between the ceramic substrate and the glass layer which are adjacent to each other, and between the adjacent glass layers are preferably not more than 1.times.10.sup.-6 /.degree. C.
摘要翻译：本发明提供一种多层陶瓷基板及其制造方法，其能够防止在层叠不同的陶瓷基板时或由于后续的热冲击而产生裂纹，并且具有优异的耐湿性和绝缘性能以及高可靠性。陶瓷多层基板具有通过在陶瓷基板的热膨胀系数之间的不同热膨胀系数的至少两个玻璃层层叠不同热膨胀系数的两个陶瓷基板，使得热膨胀系数在陶瓷基板之间逐步变化。彼此相邻的陶瓷基板和玻璃层之间以及相邻玻璃层之间的热膨胀系数的差异优选为1×10-6 /℃以下。

22. 发明授权

US5514326A Copper paste for internal conductor of multilayer ceramic electronic component 失效
公开(公告)号：US5514326A
公开(公告)日：1996-05-07
申请号：US339495
申请日：1994-11-14
申请人： Hiroji Tani , Kazuhito Ohshita , Mitsuyoshi Nishide
发明人： Hiroji Tani , Kazuhito Ohshita , Mitsuyoshi Nishide
IPC分类号： C04B41/90 , B22F1/00 , H01B1/16 , H01B1/22 , H01G4/008 , H01G4/12 , H05K1/09 , H05K3/46 , B22F7/02
CPC分类号： H01G4/0085 , B22F1/0003 , H05K1/092 , Y10T428/12014 , Y10T428/12028 , Y10T428/12049 , Y10T428/12146
摘要： In order to form internal conductors of a multilayer ceramic electronic component such as a multilayer ceramic capacitor, copper paste containing copper powder having a mean particle size of 0.3 to 2 .mu.m in a particle size range of 0.1 to 4 .mu.m and ceramic powder having a main component which is common to that of a ceramic material contained in the multilayer ceramic electronic component and being in a particle size range of 0.5 to 8 .mu.m, as well as an organic vehicle and a solvent with the contents of the copper powder and the ceramic powder and the total content of the organic vehicle and the solvent in ranges of 40 to 70 percent by weight, 1 to 15 percent by weight and 25 to 60 percent by weight respectively is applied onto ceramic green sheets. The ceramic green sheets provided with such copper paste films are stacked and fired so that occurrence of voids in the laminate and deformation of the laminate are suppressed in the as-obtained multilayer ceramic electronic component.

23. 发明授权

US07009114B2 Wiring substrate, method of producing the same, and electronic device using the same 有权
公开(公告)号：US07009114B2
公开(公告)日：2006-03-07
申请号：US09789454
申请日：2001-02-21
申请人： Jun Urakawa , Mitsuyoshi Nishide , Isao Kato , Norio Yoshida , Tomonori Ito
发明人： Jun Urakawa , Mitsuyoshi Nishide , Isao Kato , Norio Yoshida , Tomonori Ito
IPC分类号： H05K1/00
CPC分类号： H01L24/16 , H01L23/49838 , H01L24/81 , H01L2224/10165 , H01L2224/10175 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/81136 , H01L2224/8114 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01061 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/01094 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K1/0306 , H05K3/3452 , H05K3/4629 , H05K2201/017 , H05K2201/09909 , Y10T29/49155 , H01L2924/00
摘要： A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.

24. 发明授权

US06228196B1 Method of producing a multi-layer ceramic substrate 有权
标题翻译：多层陶瓷基板的制造方法
公开(公告)号：US06228196B1
公开(公告)日：2001-05-08
申请号：US09316770
申请日：1999-05-21
申请人： Sadaaki Sakamoto , Hirofumi Sunahara , Mitsuyoshi Nishide
发明人： Sadaaki Sakamoto , Hirofumi Sunahara , Mitsuyoshi Nishide
IPC分类号： B32B3126
CPC分类号： H05K1/186 , H01L21/4857 , H05K1/0306 , H05K1/16 , H05K3/4629 , H05K2201/10636 , Y02P70/611
摘要： The invention provides a method of producing a multi-layer ceramic substrate comprising a laminated member having a plurality of ceramic layers made of a ceramic insulating material and a wiring conductor, comprising the steps of: preparing a raw compact having the plurality of the laminated ceramic green sheets containing the ceramic insulating material and the wiring conductor; providing raw sheet type bases on the principal plane at both ends with respect to the lamination direction of the raw compact, the raw sheet type bases containing a ceramic not to be sintered at the baking temperature of the raw compact; baking the raw compact in the state interposed between the sheet type bases so as to obtain the laminated member; and eliminating the unsintered sheet type bases; wherein the heat expansion coefficient difference of the sheet type bases and the laminated member after baking is 2.5×10−6 degK−1 or more.
摘要翻译：本发明提供一种制造多层陶瓷基板的方法，该多层陶瓷基板包括具有由陶瓷绝缘材料和布线导体制成的多个陶瓷层的层叠构件，包括以下步骤：制备具有多个层叠陶瓷包含陶瓷绝缘材料和布线导体的生片; 相对于原料的层叠方向在两端的主面上设置原料片型基材，在原料的烧成温度下含有不要烧结的陶瓷的原料片型基材; 在插入在片状基底之间的状态下烘烤原料，以获得层压构件; 消除未烧结的片状基材; 其特征在于，所述片状基材和所述层叠体的烘焙后的热膨胀系数差为2.5×10 -6 degK -1以上。

25. 发明授权

US5896650A Method of making ceramic multilayer 失效
标题翻译：陶瓷多层陶瓷的制作方法
公开(公告)号：US5896650A
公开(公告)日：1999-04-27
申请号：US891049
申请日：1997-07-10
申请人： Mitsuyoshi Nishide , Hiroji Tani
发明人： Mitsuyoshi Nishide , Hiroji Tani
IPC分类号： B32B17/00 , B32B17/06 , B32B18/00 , H05K1/03 , H05K3/46 , H05K3/36
CPC分类号： B32B17/06 , B32B17/00 , B32B18/00 , C04B37/005 , H05K3/4614 , H05K3/4629 , C04B2237/10 , C04B2237/34 , C04B2237/346 , C04B2237/62 , C04B2237/64 , C04B2237/68 , C04B2237/70 , C04B2237/72 , H05K1/0306 , H05K2201/0195 , H05K2201/068 , H05K3/4626 , H05K3/4688 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/24926 , Y10T428/24983
摘要： The present invention provides a multilayer ceramic substrate and a method of producing the same which can prevent occurrence of cracks when laminating different ceramic substrates or due to subsequent heat shock, and which has excellent moisture resistance and insulation properties and high reliability. The ceramic multilayer substrate has two ceramic substrates of different thermal expansion coefficients laminated by at least two glass layers of different thermal expansion coefficients which are between the thermal expansion coefficients of the ceramic substrates so that the thermal expansion coefficient changes stepwise between the ceramic substrates. The differences in thermal expansion coefficient between the ceramic substrate and the glass layer which are adjacent to each other, and between the adjacent glass layers are preferably not more than 1.times.10.sup.-6 /.degree.C.
摘要翻译：本发明提供一种多层陶瓷基板及其制造方法，其能够防止在层叠不同的陶瓷基板时或由于后续的热冲击而产生裂纹，并且具有优异的耐湿性和绝缘性能以及高可靠性。陶瓷多层基板具有通过在陶瓷基板的热膨胀系数之间的不同热膨胀系数的至少两个玻璃层层叠不同热膨胀系数的两个陶瓷基板，使得热膨胀系数在陶瓷基板之间逐步变化。彼此相邻的陶瓷基板和玻璃层之间以及相邻玻璃层之间的热膨胀系数的差异优选为1×10-6 /℃以下。

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