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21. 发明授权

US06551973B1 Stable metal-safe stripper for removing cured negative-tone novolak and acrylic photoresists and post-etch residue 失效
标题翻译：用于去除固化的负色调酚醛清漆和丙烯酸类光刻胶和蚀刻后残留物的稳定的金属安全剥离器
公开(公告)号：US06551973B1
公开(公告)日：2003-04-22
申请号：US09974704
申请日：2001-10-09
申请人： John Cleaon Moore
发明人： John Cleaon Moore
IPC分类号： C11D732
CPC分类号： C11D7/5009 , C11D7/32 , C11D7/34 , G03F7/425 , G03F7/426
摘要： A stripping composition is provided for removing polymeric organic substances from an inorganic substrate. The stripping composition comprises about 3 to about 15 weight percent aromatic quaternary ammonium hydroxide, preferably benzyltrimethylammonium hydroxide (BTMAH), about 50 to about 87.5 weight percent alkylsulfoxide, a co-solvent preferably a glycol, and, desirably, a suitable corrosion inhibitor and a non-ionic surfactant. Also provided is a method for stripping polymeric organic substances (i.e., negative-tone novolak and acrylic photoresists and post-etch residue) from inorganic substrates by contacting the polymeric organic substance with the organic stripping the BTMAH composition for a period of time sufficient to remove said polymeric substances.
摘要翻译：提供了一种用于从无机基质中除去聚合有机物质的汽提组合物。汽提组合物包含约3至约15重量％的芳族季铵氢氧化物，优选苄基三甲基氢氧化铵（BTMAH），约50至约87.5重量％的烷基亚砜，共溶剂优选为二醇，以及理想的合适的防腐剂和非离子表面活性剂。还提供了通过使聚合有机物质与有机汽提BTMAH组合物接触一段足以除去的时间的方法，从无机底物中剥离聚合有机物质（即负色调酚醛清漆和丙烯酸类光刻胶和蚀刻后残留物）所述聚合物质。

22. 发明授权

US10696874B2 Adhesive with tunable porosity and methods to support temporary bonding applications 有权
公开(公告)号：US10696874B2
公开(公告)日：2020-06-30
申请号：US16256471
申请日：2019-01-24
申请人： John Cleaon Moore , Jared Michael Pettit
发明人： John Cleaon Moore , Jared Michael Pettit
IPC分类号： C09J9/00 , C09J11/08 , C09J11/04 , H01L23/00 , H01L21/683 , B32B7/06 , B32B38/10 , B32B38/00 , C09J5/00 , C08K3/013
摘要： Methods and compositions are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 1.0, more preferably greater than 2.0, and most preferably greater than 3.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.

23. 发明申请

US20190169471A1 Adhesive with Tunable Porosity and Methods to Support Temporary Bonding Applications 审中-公开
公开(公告)号：US20190169471A1
公开(公告)日：2019-06-06
申请号：US16256471
申请日：2019-01-24
申请人： John Cleaon Moore , Jared Michael Pettit
发明人： John Cleaon Moore , Jared Michael Pettit
IPC分类号： C09J9/00 , C09J11/08 , C09J11/04 , H01L21/683 , H01L23/00
摘要： Methods and compositions are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 1.0, more preferably greater than 2.0, and most preferably greater than 3.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.

24. 发明授权

US10147630B2 Sectional porous carrier forming a temporary impervious support 有权
公开(公告)号：US10147630B2
公开(公告)日：2018-12-04
申请号：US14737184
申请日：2015-06-11
申请人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
发明人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
IPC分类号： H01L21/683 , B32B17/06 , B32B7/12 , B32B37/12 , B32B37/18 , H01L21/56 , B32B15/02 , B32B37/14 , B32B38/18 , B32B37/00
摘要： Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.

25. 发明授权

US09929025B2 Cassette fixture for holding film frames with affixed thin substrates during liquid chemical batch removal of carriers 有权
公开(公告)号：US09929025B2
公开(公告)日：2018-03-27
申请号：US14894115
申请日：2014-06-05
申请人： John Cleaon Moore
发明人： John Cleaon Moore
IPC分类号： B32B38/10 , H01L21/67 , H01L21/673 , B32B43/00
CPC分类号： H01L21/67092 , B32B38/10 , B32B43/006 , H01L21/67132 , H01L21/67313 , H01L21/67346 , Y10T156/1111 , Y10T156/1116
摘要： The invention describes the ability to conduct multiple carrier substrate removal practices simultaneously. The fixture design is slotted in a manner to hold film frame rings and has the bottom region open without interference to the passage of the released carrier substrate. Slots in the fixture are arranged on two sides at top and bottom to support the film frame, however, the distance between the slots and the area of the open region is sufficient to allow the carrier substrate to travel downwards under gravity force, once it has been released from the device wafer. The method describes a batch process whereby a fixture design supports multiple film frames with taped adhered device wafers enable exposure to a chemical medium that either acts upon the interface between the device wafer and carrier substrate or digests the carrier substrate in a manner that results in removal.

26. 发明申请

US20150364356A1 SECTIONAL POROUS CARRIER FORMING A TEMPORARY IMPERVIOUS SUPPORT 审中-公开
标题翻译：部分多孔载体形成暂时的不利支持
公开(公告)号：US20150364356A1
公开(公告)日：2015-12-17
申请号：US14737184
申请日：2015-06-11
申请人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
发明人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
IPC分类号： H01L21/683 , B32B17/06 , B32B15/04 , B32B7/12 , B32B5/02 , B32B37/18 , B32B38/08 , B32B38/18 , B32B43/00 , C09J5/00 , B32B37/12
CPC分类号： H01L21/6835 , B32B7/12 , B32B15/02 , B32B17/061 , B32B17/067 , B32B37/025 , B32B37/12 , B32B37/144 , B32B37/18 , B32B37/187 , B32B2038/1891 , B32B2305/026 , B32B2307/202 , B32B2457/14 , B32B2457/20 , H01L21/568 , H01L2221/68318 , H01L2221/68322 , H01L2221/68327 , H01L2221/68381
摘要： Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.
摘要翻译：描述了用于处理微电子学的部分多孔载体的组成和设计，其中薄的器件衬底通过粘合剂固定到载体上并形成在加工过程中耐受热和化学产物的不可渗透的结合叠层，并且易于由衬底处理真空处理机器人，并且随后允许通过选择性液体方向穿透到截面多孔区域中的批量操作中的快速去除（脱粘），其将载体从装置晶片释放而不受损害。具有多孔区域的本发明载体用于临时支撑具有选择性穿透化学液体以通过多孔区域，进入和击穿粘合粘合剂并且允许其释放而不损坏器件基板的薄且易碎的器件基板。载体的截面多孔性质允许化学液体的被动扩散，与机械，热或辐射方法相反的方式被认为是更高的产量实践，并且使得能够在制造环境中使用高的实践进行批处理吞吐量低廉。优选的设计包括使用多孔金属形式，包括层压材料，以及多孔区域的表面处理以促进排除原理并在器件制造阶段期间实现惰性支撑机构。这些优点允许设计灵活性和低成本批量处理，当选择在半导体和其他微电子器件的制造中处理薄化器件衬底的实践时。

27. 发明申请

US20080163893A1 Substrate cleaning processes through the use of solvents and systems 有权
标题翻译：通过使用溶剂和系统的底物清洗过程
公开(公告)号：US20080163893A1
公开(公告)日：2008-07-10
申请号：US11649600
申请日：2007-01-04
申请人： Michael W. Quillen , L. Palmer Holbrook , John Cleaon Moore
发明人： Michael W. Quillen , L. Palmer Holbrook , John Cleaon Moore
IPC分类号： C23F1/00
CPC分类号： H01L21/02052 , C11D3/2017 , C11D3/2093 , C11D3/43 , C11D7/261 , C11D7/266 , C11D7/5022 , C11D11/0047 , H01L21/02057 , Y10S134/902
摘要： A method for removing common contaminates or residues which include but are not limited to ionic residues, particulate residues and moisture from semiconductor wafers used in the manufacture of IC (integrated circuits), liquid crystal displays and flat panel displays. The process includes the use of certain esters or certain esters combined with particular co-solvents. The cleaning method may be utilized in a variety of cleaning processes or process steps and offers economic and performance advantages.
摘要翻译：用于去除常规污染物或残留物的方法，其包括但不限于用于制造IC（集成电路），液晶显示器和平板显示器的半导体晶片的离子残余物，颗粒残余物和水分。该方法包括使用某些酯或某些酯与特定的共溶剂组合。清洁方法可以用于各种清洁过程或工艺步骤，并且提供经济和性能优点。

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