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21. 发明申请

US20080100326A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 有权
标题翻译：用于接触电子元件的悬臂式微孔和制造这种探针的方法
公开(公告)号：US20080100326A1
公开(公告)日：2008-05-01
申请号：US11929666
申请日：2007-10-30
申请人： Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
发明人： Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
IPC分类号： G01R1/067
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
摘要翻译：本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。具体地，实施例涉及悬臂式探针结构的各种设计。一些实施例涉及制造这种悬臂结构的方法。在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗能力和/或类似物。

22. 发明申请

US20060109016A1 Microprobe tips and methods for making 有权
标题翻译：微型笔尖和制作方法
公开(公告)号：US20060109016A1
公开(公告)日：2006-05-25
申请号：US11244817
申请日：2005-10-06
申请人： Vacit Arat , Adam Cohen , Dennis Smalley , Ezekiel Kruglick , Richard Chen , Kieun Kim
发明人： Vacit Arat , Adam Cohen , Dennis Smalley , Ezekiel Kruglick , Richard Chen , Kieun Kim
IPC分类号： G01R31/02
CPC分类号： G01R1/06711 , G01R1/06716 , G01R1/06733 , G01R1/06744 , G01R3/00
摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.
摘要翻译：多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如，当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在方向垂直于IC的表面的平面。在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

23. 发明申请

US20060006888A1 Electrochemically fabricated microprobes 审中-公开
标题翻译：电化学制造的微型纺织品
公开(公告)号：US20060006888A1
公开(公告)日：2006-01-12
申请号：US10949738
申请日：2004-09-24
申请人： Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Dennis Smalley , Kieun Kim , Richard Chen , Gang Zhang
发明人： Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Dennis Smalley , Kieun Kim , Richard Chen , Gang Zhang
IPC分类号： G01R31/02
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06733 , G01R1/06744 , G01R1/07357 , G01R31/2886
摘要： Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.
摘要翻译：用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。在一些实施例中，提供了多个探针的阵列。

24. 发明申请

US20060108678A1 Probe arrays and method for making 审中-公开
标题翻译：探针阵列和制作方法
公开(公告)号：US20060108678A1
公开(公告)日：2006-05-25
申请号：US11173241
申请日：2005-06-30
申请人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
发明人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
IPC分类号： H01L23/48
CPC分类号： B23K35/0222 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/12 , G01R1/06744 , G01R1/07307 , G01R1/07314 , G01R3/00 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2221/68363 , H01L2224/0401 , H01L2224/05568 , H01L2224/10126 , H01L2224/1147 , H01L2224/11831 , H01L2224/1184 , H01L2224/1191 , H01L2224/13017 , H01L2224/13018 , H01L2224/13076 , H01L2224/131 , H01L2224/1403 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/8121 , H01L2224/8181 , H01L2224/81815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , H01L2924/3841 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
摘要翻译：本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。保留材料可以用作焊接掩模材料。

25. 发明申请

US20080093424A1 Probe Arrays and Method for Making 有权
公开(公告)号：US20080093424A1
公开(公告)日：2008-04-24
申请号：US11929539
申请日：2007-10-30
申请人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
发明人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
IPC分类号： B29C65/00 , B23K35/12
CPC分类号： B23K35/0222 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/12 , G01R1/06744 , G01R1/07307 , G01R1/07314 , G01R3/00 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2221/68363 , H01L2224/0401 , H01L2224/05568 , H01L2224/10126 , H01L2224/1147 , H01L2224/11831 , H01L2224/1184 , H01L2224/1191 , H01L2224/13017 , H01L2224/13018 , H01L2224/13076 , H01L2224/131 , H01L2224/1403 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/8121 , H01L2224/8181 , H01L2224/81815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , H01L2924/3841 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

26. 发明申请

US20080105355A1 Probe Arrays and Method for Making 审中-公开
标题翻译：探针阵列和制作方法
公开(公告)号：US20080105355A1
公开(公告)日：2008-05-08
申请号：US11929597
申请日：2007-10-30
申请人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
发明人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
IPC分类号： B32B37/00 , B23K31/02
CPC分类号： G01R3/00 , G01R1/06761 , G01R1/07307 , Y10T29/49002 , Y10T156/10
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
摘要翻译：本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。保留材料可以用作焊接掩模材料。

27. 发明授权

US09392564B2 Apparatus and method for merging beacon transmission and reception 有权
标题翻译：用于合并信标发射和接收的装置和方法
公开(公告)号：US09392564B2
公开(公告)日：2016-07-12
申请号：US12522957
申请日：2008-01-15
申请人： Chun-Ting Chou , Hong Zhai , Richard Chen
发明人： Chun-Ting Chou , Hong Zhai , Richard Chen
IPC分类号： H04W56/00 , H04W48/16
CPC分类号： H04W56/002 , H04W48/16
摘要： A method and wireless device merge multiple unsynchronized beacon groups in a wireless network, each beacon group including at least one wireless device. A first beacon is received from at least one first wireless device in a first beacon group (S514), the first wireless device having a first directional antenna. A second beacon is received from at least one second wireless device in a second beacon group that is not synchronized with the first beacon group (S516), the second wireless device having a second directional antenna. A first response beacon is relocated (S520) and sent (S522) to the first wireless device in the first beacon group. The relocated first response beacon instructs the first wireless device to relocate the first beacon. Accordingly, the second beacon, the relocated first response beacon, and the relocated first beacon are synchronized.
摘要翻译：方法和无线设备合并无线网络中的多个不同步的信标组，每个信标组包括至少一个无线设备。从第一信标组中的至少一个第一无线设备接收第一信标（S514），第一无线设备具有第一定向天线。从与第一信标组不同步的第二信标组中的至少一个第二无线设备接收第二信标（S516），第二无线设备具有第二定向天线。第一响应信标被重定位（S520）并发送（S522）到第一信标组中的第一无线设备。重新定位的第一响应信标指示第一无线设备重定位第一信标。因此，第二信标，重新定位的第一响应信标和重新定位的第一信标被同步。

28. 发明授权

US08902832B2 Techniques for supporting harmonized co-existence of multiple co-located body area networks 有权
标题翻译：支持协调共存的多个共址机构网络的技术
公开(公告)号：US08902832B2
公开(公告)日：2014-12-02
申请号：US13058006
申请日：2009-08-07
申请人： Maulin D. Patel , Richard Chen
发明人： Maulin D. Patel , Richard Chen
IPC分类号： H04W72/04 , H04W56/00 , H04B13/00 , H04W16/14
CPC分类号： H04W16/14 , H04B13/005 , H04W56/0015 , H04W56/0045
摘要： A method (400) for coordinating access to a wireless medium among multiple co-located body area networks (BANs). The method comprises detecting, by a master device of a first BAN, at least one alien BAN using beacons received from at least one co-located BAN, wherein an alien BAN is a BAN having its round start time (RST) misaligned with a RST of the first BAN (S410); recording a RST offset between the first BAN and the at least one alien BAN (S420); based on the RST offset determining which of the first BAN and the at least one alien BAN is an initiator BAN and which is a target BAN (S430); and realigning the RST of the initiator BAN with the RST of the target BAN (S460).
摘要翻译：一种用于协调对多个同位置身体区域网络（BAN）中的无线介质的访问的方法（400）。所述方法包括由主设备检测第一BAN，使用从至少一个同位置BAN接收的信标来检测至少一个外来BAN，其中外来BAN是具有与RST不一致的圆形开始时间（RST）的BAN 的第一班（S410）; 记录第一个BAN和至少一个外来BAN之间的RST偏移量（S420）; 基于所述RST偏移来确定所述第一BAN和所述至少一个外来BAN中的哪一个是发起者BAN并且其是目标BAN（S430）; 并使用目标BAN的RST重新调整启动器BAN的RST（S460）。

29. 发明授权

US08767743B2 Techniques for efficient data transfers in a body area network 有权
标题翻译：用于身体区域网络中高效数据传输的技术
公开(公告)号：US08767743B2
公开(公告)日：2014-07-01
申请号：US13058004
申请日：2009-08-07
申请人： Maulin D. Patel , Richard Chen
发明人： Maulin D. Patel , Richard Chen
IPC分类号： H04L12/28
CPC分类号： H04W74/04 , H04B13/005 , H04W16/14 , H04W56/00 , H04W84/10
摘要： A method for transferring data among devices in a body area network (BAN). The method comprises dividing an access time to a wireless medium of the BAN into at least a contention-based period (510) and a contention-free reservation period (520); allowing devices to transfer data during the contention-based period using a local prioritized contention access (LPCA) mechanism; and allowing only devices having reserved time slots to transfer data during the contention-free reservation period (520).
摘要翻译：一种用于在体区域网络（BAN）中的设备之间传送数据的方法。该方法包括将访问时间与BAN的无线介质划分为至少基于争用的时段（510）和无竞争的预留时段（520）; 允许设备使用本地优先竞争访问（LPCA）机制在基于争用的期间内传送数据; 并且仅允许具有保留时隙的设备在无竞争保留期间（520）中传送数据。

30. 发明授权

US08737423B2 Method for pre-empting data transmission in a discovery channel 有权
标题翻译：在发现通道中预先消除数据传输的方法
公开(公告)号：US08737423B2
公开(公告)日：2014-05-27
申请号：US12937004
申请日：2009-04-07
申请人： Richard Chen
发明人： Richard Chen
IPC分类号： H04L12/42 , H04L12/403
CPC分类号： H04W74/0816
摘要： A method (300) for pre-empting data transmissions in a discovery channel. The method comprises scanning the discovery channel to detect at least one data beacon transmitted in beacon slots (230) of a superframe (S310); determining if at least one data beacon was detected (S320); and transmitting a pre-empt beacon if the at least one data beacon was detected (S330).
摘要翻译：一种用于在发现信道中预先消除数据传输的方法（300）。该方法包括扫描发现信道以检测在超帧的信标时隙（230）中发送的至少一个数据信标（S310）; 确定是否检测到至少一个数据信标（S320）; 以及如果检测到所述至少一个数据信标，则发送先占信标（S330）。

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