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21. 发明申请

US20050225824A1 High efficiency micro-display system 有权
标题翻译：高效率微显示系统
公开(公告)号：US20050225824A1
公开(公告)日：2005-10-13
申请号：US10815412
申请日：2004-03-31
申请人： Cynthia Bell , Kenneth Salsman , Henning Braunisch
发明人： Cynthia Bell , Kenneth Salsman , Henning Braunisch
IPC分类号： G02B3/00 , G02B26/08 , H04N9/31 , G02F1/00 , G02B26/00
CPC分类号： G02B3/0056 , G02B3/0006 , G02B3/0062 , G02B26/0841 , H04N9/3152
摘要： Micro-displays used for front or rear projection systems as well as near-eye viewing systems may be enhanced using embodiments of the present invention. In one embodiment, the invention may include an array of micromechanical optical modulators, an electronic control system for operating the optical modulators in accordance with a received video signal, and an overlayer for the array of modulators to modify the fill factor for incident light on the array of modulators, the incident light corresponding to at least one color constituent of a video signal.
摘要翻译：可以使用本发明的实施例来增强用于前投影系统或后投影系统以及近眼观察系统的微显示器。在一个实施例中，本发明可以包括微机械光学调制器的阵列，用于根据接收到的视频信号来操作光调制器的电子控制系统，以及用于调制器阵列的覆盖层，用于修改入射光的填充因子调制器阵列，入射光对应于视频信号的至少一种颜色成分。

22. 发明授权

US07989946B2 Multimode signaling on decoupled input/output and power channels 有权
标题翻译：解耦输入/输出和电源通道上的多模信号
公开(公告)号：US07989946B2
公开(公告)日：2011-08-02
申请号：US12882322
申请日：2010-09-15
申请人： Henning Braunisch , Kemal Aygun
发明人： Henning Braunisch , Kemal Aygun
IPC分类号： H01L23/48
CPC分类号： H05K1/0243 , H01L23/367 , H01L23/66 , H01L24/16 , H01L25/0657 , H01L25/16 , H01L2223/6622 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2225/06517 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H05K1/182 , H05K3/222 , H05K2201/10356 , H05K2201/10492 , H05K2201/10704 , Y10T29/49002 , H01L2924/00 , H01L2224/0401
摘要： A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages at each end point. Each end point may include a processor die package coupled to a socket. The socket may also receive a connector that couples the cable to the package. Power supply signals and input/output signals may be decoupled at each end point.
摘要翻译：具有至少两个端点的多模系统可以包括在一些实施例中是多模电缆或多模板并且可插拔地连接到每个端点处的封装的多模信令路径。每个端点可以包括耦合到插座的处理器管芯封装。插座还可以接收将电缆耦合到封装的连接器。电源信号和输入/输出信号可以在每个端点解耦。

23. 发明授权

US07507604B2 Breakable interconnects and structures formed thereby 有权
标题翻译：可破坏的互连和由此形成的结构
公开(公告)号：US07507604B2
公开(公告)日：2009-03-24
申请号：US12044239
申请日：2008-03-07
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： H01L21/50 , H01L21/48 , H01L23/52 , H01L23/48
CPC分类号： H01L23/49827 , H01L21/485 , H01L23/5382 , H01L24/28 , H01L24/83 , H01L2224/2919 , H01L2224/838 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H05K3/323 , H05K3/365 , H05K2201/0221 , H05K2201/0233 , H05K2201/0314 , H01L2924/00
摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.
摘要翻译：描述形成微电子结构的方法。这些方法的实施例包括将包括至少一个顺应性导电球的各向异性导电层放置在设置在第一衬底上的至少一个互连结构上，施加压力以使柔性导电球接触至少一个互连结构，各向异性导电层以暴露柔性导电球体中的至少一个; 然后将第二基板附着到各向异性导电层。

24. 发明授权

US07280024B2 Integrated transformer structure and method of fabrication 有权
标题翻译：集成变压器结构及其制造方法
公开(公告)号：US07280024B2
公开(公告)日：2007-10-09
申请号：US11050379
申请日：2005-02-02
申请人： Henning Braunisch
发明人： Henning Braunisch
IPC分类号： H01F5/00
CPC分类号： H01L23/49822 , H01F17/0006 , H01F19/04 , H01F27/2804 , H01F41/046 , H01L23/49833 , H01L23/49838 , H01L23/645 , H01L2224/16 , H01L2224/16235 , H01L2224/16265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/15312 , H01L2924/3011 , H01L2224/0401
摘要： A microelectronic assembly including a die substrate, a plurality of electronic components formed in and on the die substrate and connected to one another to form an integrated circuit, a first and a second single-turn inductor, and a magnetic material electro-magnetically coupling the first and the second single-turn inductor to one another to form a transformer, the transformer being connected to the integrated circuit.
摘要翻译：一种微电子组件，包括管芯基板，形成在管芯基板中和管芯基板上并且彼此连接以形成集成电路的多个电子部件，第一和第二单匝电感器以及磁 - 电耦合第一和第二单匝电感器彼此形成变压器，变压器连接到集成电路。

25. 发明申请

US20070069333A1 INTEGRATED INDUCTOR STRUCTURE AND METHOD OF FABRICATION 审中-公开
标题翻译：综合电感结构与制造方法
公开(公告)号：US20070069333A1
公开(公告)日：2007-03-29
申请号：US11554567
申请日：2006-10-30
申请人： Ankur Crawford , Henning Braunisch , Rajendran Nair , Gilroy Vandentop , Shan Wang
发明人： Ankur Crawford , Henning Braunisch , Rajendran Nair , Gilroy Vandentop , Shan Wang
IPC分类号： H01L29/00
CPC分类号： H01L23/645 , H01F17/0033 , H01F41/046 , H01L23/49822 , H01L28/10 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01077 , H01L2924/01078 , H01L2924/15311 , H01L2924/15312 , H01L2924/3011 , H05K1/0373 , H05K1/165 , H05K3/4644 , H05K2201/086 , H05K2201/09563 , H01L2224/0401
摘要： An inductor structure comprised of a magnetic section and a single turn solenoid The single turn solenoid to contain within a portion of the magnetic section and circumscribed by the magnetic section.
摘要翻译：由磁性部分和单匝螺线管组成的电感器结构单转螺线管包含在磁性部分的一部分内并由磁性部分限定。

26. 发明申请

US20060251360A1 Flip-chip mountable optical connector for chip-to-chip optical interconnectability 失效
标题翻译：用于芯片到芯片光学互连的倒装芯片安装光学连接器
公开(公告)号：US20060251360A1
公开(公告)日：2006-11-09
申请号：US11124033
申请日：2005-05-06
申请人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
发明人： Daoqiang Lu , Gilroy Vandentop , Henning Braunisch
IPC分类号： G02B6/36
CPC分类号： G02B6/4232 , G02B6/4214 , G02B6/4292 , G02B6/43 , H01L2224/16225 , H05K1/0274 , H05K3/3436
摘要： An optical connector comprises a housing having a cavity extending there through to accept a mating connector. The connector comprises no optical components. Dummy solder bonding pads positioned on the connector allow the connector to be automated flip-chip bonded over a substrate waveguide.
摘要翻译：光学连接器包括壳体，该壳体具有在其上延伸以容纳匹配连接器的空腔。连接器不包括光学部件。定位在连接器上的虚拟焊接焊盘允许连接器在衬底波导上自动倒装芯片结合。

27. 发明申请

US20050036728A1 Curved surface for improved optical coupling between optoelectronic device and waveguide 审中-公开
标题翻译：弯曲表面，用于改善光电器件和波导之间的光耦合
公开(公告)号：US20050036728A1
公开(公告)日：2005-02-17
申请号：US10640212
申请日：2003-08-12
申请人： Henning Braunisch
发明人： Henning Braunisch
IPC分类号： G02B6/00 , G02B6/42 , G02B6/26
CPC分类号： G02B6/42 , G02B6/00 , G02B6/262 , G02B6/4203 , H01L2224/16225
摘要： A waveguide has a curved surface to redirect light from a first significant axis to a second significant axis. The curved surface may comprise multiple distinct angled segments or facets or may comprise a graduated curve.
摘要翻译：波导具有弯曲表面以将来自第一有效轴线的光重定向到第二有效轴线。曲面可以包括多个不同的成角度的段或小平面，或者可以包括刻度曲线。

28. 发明授权

US6151378A Method and device for processing of medical image data 失效
标题翻译：用于处理医学图像数据的方法和装置
公开(公告)号：US6151378A
公开(公告)日：2000-11-21
申请号：US274390
申请日：1999-03-23
申请人： Volker Rasche , Michael Grass , Henning Braunisch
发明人： Volker Rasche , Michael Grass , Henning Braunisch
IPC分类号： G06T1/00 , G06T11/00 , A61B6/03
CPC分类号： G06T11/006 , Y10S378/901
摘要： The invention relates to a method and a device for the processing of medical image data so as to determine output function data (S(k)), situated at grid points (8) of a selected grid, from input function data (I.sub.c (r)) situated at grid points (2, 7) of a Cartesian grid (1, 6). A method of this kind is used, for example in magnetic resonance tomography or computer tomography, so as to calculate arbitrary projections from given function data. The method of the invention includes the following steps: determination of modified input function data (I.sub.c '(r)) by division of the input function data (I.sub.c (r)) by the Fourier transform (c(r)) of a convolution kernel (C(k)), determination of the Fourier transform (S.sub.c '(k)) of the modified input function data (I.sub.c '(r)), and determination of the output function data (S(k)) by convolution of the Fourier transform (S.sub.c '(k)) of the modified input function data with the convolution kernel (C(k)), the convolution kernel (C(k)) being a weighting function for weighting the grid points (2, 7) of the Cartesian grid (1, 6) in conformity with their distance from grid points (8) of the selected grid. The method according to the invention offers essentially a substantial reduction of the calculation time required.
摘要翻译：本发明涉及一种用于处理医学图像数据的方法和装置，以便根据输入函数数据（Ic（r（k））确定位于所选网格的网格点（8）处的输出函数数据））位于笛卡尔网格（1,6）的网格点（2,7）处。使用这种方法，例如在磁共振断层摄影或计算机断层摄影中，以便从给定的功能数据计算任意的投影。本发明的方法包括以下步骤：通过将输入函数数据（Ic（r））除以卷积核的傅立叶变换（c（r））来确定修改后的输入函数数据（Ic'（r））（C（k）），修正输入函数数据（Ic'（r））的傅里叶变换（Sc'（k））的确定以及输出函数数据（S（k））的确定，通过卷积核（C（k））的修正输入函数数据的傅立叶变换（Sc'（k）），卷积核（C（k））是用于对网格点（2,7）进行加权的加权函数笛卡尔网格（1,6）与其与所选网格的网格点（8）的距离。根据本发明的方法基本上提供了所需的计算时间的显着减少。

29. 发明申请

US20190252322A1 HIGH DENSITY INTERCONNECT STRUCTURES CONFIGURED FOR MANUFACTURING AND PERFORMANCE 审中-公开
公开(公告)号：US20190252322A1
公开(公告)日：2019-08-15
申请号：US16305752
申请日：2016-06-30
申请人： Henning Braunisch , Kemel Aygun , Ajay Jain , Zhiguo Qian
发明人： Henning Braunisch , Kemel Aygun , Ajay Jain , Zhiguo Qian
IPC分类号： H01L23/538 , H01L21/48 , H01L23/00
摘要： Discussed generally herein are methods and devices including or providing a high density interconnect structure. A high density interconnect structure can include a stack of alternating dielectric layers and metallization layers comprising at least three metallization layers including conductive material with low k dielectric material between the conductive material, and at least two dielectric layers including first medium k dielectric material with one or more first vias extending therethrough, the at least two dielectric layers situated between two metallization layers of the at least three metallization layers, a second medium k dielectric material directly on a top surface of the stack, a second via extending through the second medium k dielectric material, the second via electrically connected to conductive material in a metallization layer of the three or more metallization layers, and a pad over the second medium k dielectric material and electrically connected to the second via.

30. 发明申请

US20150077157A1 MATRIX MATCHING CROSSTALK REDUCTION DEVICE AND METHOD 有权
标题翻译：矩阵匹配CROSSTALK还原装置及方法
公开(公告)号：US20150077157A1
公开(公告)日：2015-03-19
申请号：US14031438
申请日：2013-09-19
申请人： Henning Braunisch
发明人： Henning Braunisch
IPC分类号： H03K3/013 , H03K19/00
CPC分类号： H03K3/013 , H03K19/0005
摘要： This disclosure relates generally to devices, systems, and methods that include conductive lines configured to transmit electrical signals between a first electronic component and a second electronic component between which the conductive lines are coupled. The devices, systems, and methods further include a transmitter, configured to generate the electrical signals, the transmitter including a source impedance based, at least in part, on a resistive coupling between individual ones of the conductive lines, a source impedance matrix of the source impedance being substantially proportional to the characteristic impedance matrix of the plurality of conductive lines.
摘要翻译：本公开一般涉及包括被配置为在第一电子部件和第二电子部件之间传输电信号的导线的装置，系统和方法，在该第二电子部件与第二电子部件之间连接有导线。所述装置，系统和方法还包括被配置为产生电信号的发射器，所述发射器至少部分地基于所述导线中各导体之间的电阻耦合，所述发射器包括源阻抗，所述源阻抗矩阵源阻抗基本上与多条导线的特性阻抗矩阵成比例。

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