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    • 24. 发明申请
    • Semiconductor devices
    • 半导体器件
    • US20070287243A1
    • 2007-12-13
    • US11422690
    • 2006-06-07
    • Xuefeng LiuRobert M. RasselSteven H. Voldman
    • Xuefeng LiuRobert M. RasselSteven H. Voldman
    • H01L21/8238
    • H01L29/7436H01L27/0262H01L29/7378
    • A device comprises a first sub-collector formed in an upper portion of a substrate and a lower portion of a first epitaxial layer and a second sub-collector formed in an upper portion of the first epitaxial layer and a lower portion of a second epitaxial layer. The device further comprises a reach-through structure connecting the first and second sub-collectors and an N-well formed in a portion of the second epitaxial layer and in contact with the second sub-collector and the reach-through structure. The device further comprises N+ diffusion regions in contact with the N-well, a P+ diffusion region in contact with the N-well, and shallow trench isolation structures between the N+ and P+ diffusion regions.
    • 一种器件包括形成在衬底的上部中的第一子集电极和形成在第一外延层的上部中的第一外延层和第二子集电极的下部,以及第二外延层的下部 。 该装置还包括连接第一和第二子集电器的连通结构和形成在第二外延层的一部分中并与第二子集电器和达到通孔结构接触的N阱。 该装置还包括与N阱接触的N +扩散区,与N阱接触的P +扩散区,以及N +和P +扩散区之间的浅沟槽隔离结构。
    • 25. 发明授权
    • Method, apparatus and circuit for latchup suppression in a gate-array ASIC environment
    • 在门阵列ASIC环境中用于闭锁抑制的方法,装置和电路
    • US07102867B2
    • 2006-09-05
    • US10604176
    • 2003-06-30
    • Steven H. Voldman
    • Steven H. Voldman
    • H02H9/02H02H3/08
    • H01L27/0921H01L27/11807
    • An integrated circuit having a substrate (10), a power rail (18, 20), a sea of gates (12), and a latchup control isolation network electrically coupled to substrate (10). The latchup control isolation network electrically isolates sea of gates (12) from power rail (18, 20). In another embodiment, an active clamp network may be utilized to electrically isolate sea of gates (12) from power rail (18, 20). Substrate (10) includes a voltage potential. When the voltage potential is equal to or greater than a first predetermined value or the voltage potential is equal to or less than a second predetermined value, either the latchup control isolation network turns off or the active clamp network turns on thereby isolating sea of gates (12) from power rail (18, 20).
    • 具有基板(10),电力轨道(18,20),大海(12)以及电耦合到基板(10)的闭锁控制隔离网络的集成电路。 闭锁控制隔离网络将闸门(12)与电力轨道(18,20)电隔离。 在另一个实施例中,可以利用有源钳位网络将闸门(12)的海电与电力轨道(18,20)电隔离。 基板(10)包括电压电位。 当电压电位等于或大于第一预定值或电压电位等于或小于第二预定值时,闭锁控制隔离网络关闭或有源钳位网络导通,从而隔离大门( 12)从电力轨道(18,20)。
    • 27. 发明授权
    • Automated hierarchical parameterized ESD network design and checking system
    • 自动分层参数化ESD网络设计和检查系统
    • US06704179B2
    • 2004-03-09
    • US09683970
    • 2002-03-07
    • Steven H. Voldman
    • Steven H. Voldman
    • H02H900
    • G06F17/5045
    • A computerized method for designing electrostatic discharge (ESD) protection circuits uses a hierarchical system of parametrized cells (p-cells) which are constructed into higher level ESD networks. Lowest order p-cells pass user defined parameters to higher order p-cells to form an ESD protection circuit meeting the design criteria. Ones of the p-cells are “growable” such that they can form repetition groups of the underlying p-cell element to accommodate the design parameters. This allows for change of circuit topology as well as structure size in an automated fashion. Layout and circuit schematics are auto-generated with the user varying the number of elements in the circuit by adjusting the input parameters. The circuit topology automation allows for the customer to autogenerate new ESD circuits and ESD power clamps without additional design work. Interconnects and wiring between the circuit elements are also autogenerated.
    • 用于设计静电放电(ESD)保护电路的计算机化方法使用构建到更高级ESD网络中的参数化单元(p-cell)的分层系统。 最低阶p单元将用户定义的参数传递到高阶p单元,以形成满足设计标准的ESD保护电路。 p细胞的一部分是“可生长的”,使得它们可以形成下面的p细胞元件的重复组以适应设计参数。 这允许以自动化的方式改变电路拓扑结构以及结构尺寸。 布局和电路原理图是通过用户通过调整输入参数来改变电路中的元件数量而自动生成的。 电路拓扑自动化允许客户自动生成新的ESD电路和ESD电源钳位,无需额外的设计工作。 电路元件之间的互连和接线也是自动生成的。
    • 28. 发明授权
    • Semiconductor structure having heterogenous silicide regions having titanium and molybdenum
    • 具有异质硅化物区域的具有钛和钼的半导体结构
    • US06512296B1
    • 2003-01-28
    • US09636325
    • 2000-08-10
    • Robert J. Gauthier, Jr.Randy W. MannSteven H. Voldman
    • Robert J. Gauthier, Jr.Randy W. MannSteven H. Voldman
    • H01L2348
    • H01L29/4933H01L21/28052H01L21/28518H01L21/28568H01L21/823418H01L21/823443H01L29/456
    • A process for forming heterogeneous silicide structures on a semiconductor substrate (10) includes implanting molybdenum ions into selective areas of the semiconductor substrate (10) to form molybdenum regions (73, 74, 75, 76). Titanium is then deposited over the semiconductor substrate (10). The semiconductor substrate (10) is annealed at a temperature between approximately 600° C. and approximately 700° C. During the annealing process, the titanium deposited in areas outside the molybdenum regions (73, 74, 75, 76) interacts with silicon on the substrate to form titanium silicide in a high resistivity C49 crystal phase. The titanium deposited in areas within the molybdenum regions (73, 74, 75, 76) interacts with silicon to form titanium silicide in a low resistivity C54 crystal phase because the presence of molybdenum ions in silicon lowers the energy barrier for crystal phase transformation between the C49 phase and the C54 phase.
    • 在半导体衬底(10)上形成异质硅化物结构的方法包括将钼离子注入到半导体衬底(10)的选择区域中以形成钼区(73,74,75,76)。 然后将钛沉积在半导体衬底(10)上。 半导体衬底(10)在大约600℃和大约700℃之间的温度下退火。在退火过程中,沉积在钼区域(73,74,75,76)之外的区域中的钛与硅 该基板在高电阻率C49晶相中形成硅化钛。 在钼区域(73,74,75,76)中的区域中沉积的钛与硅相互作用以在低电阻率C54晶体相中形成硅化钛,因为硅中的钼离子的存在降低了能量势垒以进行晶体相变 C49相和C54相。
    • 29. 发明授权
    • Double-gate low power SOI active clamp network for single power supply and multiple power supply applications
    • 双门低功耗SOI有源钳位网络,用于单电源和多电源应用
    • US06433609B1
    • 2002-08-13
    • US09683105
    • 2001-11-19
    • Steven H. Voldman
    • Steven H. Voldman
    • H03K508
    • H03K5/08H01L27/0266H01L29/785
    • A double-gated low power active clamp circuit for digital circuits includes a first double-gated MOSFET serially connected between an upper power supply voltage and an input terminal to be clamped, and a second double-gated MOSFET serially connected between a lower voltage power supply and the input terminal. The voltages at the gates of the first and second double-gated MOSFETs are held at constant reference voltages by a single or double reference circuits. The clamping action can be switched on or off. The double-gated active clamping network can be implemented with a single power supply voltage, or with multiple power supply voltages. The use of the back gates of the double-gated active clamping network enables additional clamping and ESD protection for smaller generations of transistors, such as, those having dimensions below 0.1 micron. The device is particularly suited for use with dynamic threshold double-gated silicon-on-insulator, FINFET, and bulk triple well technologies.
    • 用于数字电路的双门控低功率有源钳位电路包括串联连接在上电源电压和要钳位的输入端之间的第一双门控MOSFET,以及串联连接在较低电压电源 和输入端子。 第一和第二双栅控MOSFET的栅极处的电压通过单个或双参考电路保持在恒定的参考电压。 可以打开或关闭夹紧动作。 双门控有源钳位网络可以使用单个电源电压或多个电源电压来实现。 使用双门控有源钳位网络的后门可以为较小代的晶体管(例如尺寸小于0.1微米的晶体管)提供额外的钳位和ESD保护。 该器件特别适用于动态阈值双门绝缘体硅,FINFET和批量三阱技术。