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    • 21. 发明授权
    • Positive resist composition
    • 正抗蚀剂组成
    • US6030741A
    • 2000-02-29
    • US919368
    • 1997-08-28
    • Kousuke DoiTakako SuzukiHidekatsu KoharaToshimasa Nakayama
    • Kousuke DoiTakako SuzukiHidekatsu KoharaToshimasa Nakayama
    • G03F7/004G03F7/022G03F7/039G03F7/20G03F7/30H01L21/027G03F7/023
    • G03F7/0048G03F7/0226
    • The present invention provides a positive resist composition and method capable of achieving a resist pattern whose photosensitivity is less variable relative to its thickness, which exhibits small thickness reduction even when the pattern is fine, is capable of coping with irregularities in the exposure value since it has a wide focal-depth range, and exhibits reduced size-deviation from the mask size. The positive resist composition comprises (A) an alkali-soluble resin, (B) a quinonediazide-group-containing compound, and (C) an organic solvent, wherein the ingredient (C) is a mixture solvent containing (i) 2-heptanone, (ii) ethyl lactate, and (iii) a high-boiling organic solvent having a boiling point of 200 to 350.degree. C. The above-described resist pattern can be formed by using the positive resist composition.
    • 本发明提供一种能够实现光敏性相对于其厚度变化较小的抗蚀剂图案的正型抗蚀剂组合物和方法,即使图案细小也能显示小的厚度减小,因此可以应对曝光值的不规则性 具有宽的焦深​​范围,并且显示出与面罩尺寸的尺寸偏差的减小。 正型抗蚀剂组合物包含(A)碱溶性树脂,(B)含醌二叠氮化物基团的化合物和(C)有机溶剂,其中成分(C)是含有(i)2-庚酮 ,(ii)乳酸乙酯,和(iii)沸点为200〜350℃的高沸点有机溶剂。上述抗蚀剂图案可以通过使用正性抗蚀剂组合物形成。