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    • 21. 发明授权
    • Method and apparatus for removing heat from a component
    • 从部件去除热量的方法和装置
    • US06538884B1
    • 2003-03-25
    • US09960017
    • 2001-09-21
    • Henry WongThomas J. Bertram
    • Henry WongThomas J. Bertram
    • H05K720
    • H01L23/427H01L23/367H01L2924/0002H01L2924/00
    • An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)
    • 一种用于从位于电子模块(100)的表面(104)上的部件(102)去除热(118)的装置。 该设备包括一个安装到远离部件(102)的径向距离(110)的电子模块(100)的散热装置(108)和具有耦合到部件(102)的第一部分(115)的热导体(112) 耦合到除热装置(108)的第二部分(117)。 用于从电子模块(100)的表面(104)上的部件(102)去除热量(118)的方法包括产生热量(118),通过热导体(102)传送来自部件(102)的热量 112)并将热量(118)沉积到安装到电子模块(100)的散热装置中,
    • 29. 发明授权
    • Latching apparatus for mounting a computer module
    • 用于安装计算机模块的锁存装置
    • US06961249B2
    • 2005-11-01
    • US10426484
    • 2003-04-30
    • Henry Wong
    • Henry Wong
    • H05K7/14H05K7/18
    • H05K7/1414H05K7/1409
    • A latching apparatus (208, 408) for mounting a computer module (202, 402) in a holding fixture (103) is disclosed, where the computer module comprises a baseboard (204, 404) and a faceplate (206, 406). The latching apparatus includes a handle (210, 410) rotatably coupled to the baseboard, where the handle has an outer portion (214, 414) and an inner portion (216, 416), where the outer portion includes a locking pin (218, 418) substantially parallel to the faceplate, and where the handle is movable between a latched position (220, 420) and an unlatched position (221, 421). A retention spring mechanism (222, 422) having a latching portion (224, 424) and a positional portion (226, 426), where the latching portion springably retains the handle in the latched position by engaging the locking pin, and where the positional portion frictionally interfaces with the inner portion of the handle to engage the handle in any of a plurality of positions. Latching apparatus can also include a handle stop (240, 440) coupled to prevent the handle from opening past the unlatched position.
    • 公开了一种用于将计算机模块(202,402)安装在保持夹具(103)中的锁定装置(208,408),其中所述计算机模块包括基板(204,404)和面板(206,406)。 闩锁装置包括可旋转地联接到基板的手柄(210,410),其中手柄具有外部部分(214,414)和内部部分(216,416),其中外部部分包括锁定销(218, 418),其基本上平行于所述面板,并且所述手柄可在锁定位置(220,420)和解锁位置(221,421)之间移动。 具有闩锁部分(224,424)和位置部分(226,426)的保持弹簧机构(222,422),其中所述闩锁部分通过接合所述锁定销将所述手柄弹性地保持在所述锁定位置,并且其中所述位置 部分与手柄的内部部分摩擦地接合以在多个位置中的任一个中接合手柄。 锁定装置还可以包括联接以防止手柄打开超过解锁位置的手柄止动件(240,440)。
    • 30. 发明申请
    • Connector coupled to board module
    • 连接器连接到电路板模块
    • US20050164531A1
    • 2005-07-28
    • US10764898
    • 2004-01-26
    • Henry Wong
    • Henry Wong
    • H01R12/00H01R12/71H05K1/14H05K3/30
    • H05K3/308H01R12/724H05K1/141H05K2201/09409H05K2201/10189H05K2201/10446H05K2201/10515
    • A board module (401) can include a board module surface (420) and a connector (403) coupled to the board module surface, wherein the connector is coupled to provide at least one signal (112, 114) to the board module. The connector can include a connector lead surface (419) substantially perpendicular to the board module surface (420); a first row of leads (430) substantially parallel to and a first distance (451) from the board module surface extending substantially perpendicular from the connector lead surface (419) and shaped to connect substantially perpendicular to the board module surface at a second distance (452) from the connector lead surface; and a second row of leads (440) substantially parallel to and a third distance (453) from the board module surface extending substantially perpendicular from the connector lead surface (419) and shaped to connect substantially perpendicular to the board module surface (420) at a fourth distance (454) from the connector lead surface. The first distance is greater than the third distance, the second distance is less than the fourth distance, and each of the second row leads are offset from each of the first row of leads.
    • 板模块(401)可以包括耦合到板模块表面的板模块表面(420)和连接器(403),其中连接器被耦合以向板模块提供至少一个信号(112,114)。 连接器可以包括基本上垂直于板模块表面(420)的连接器引线表面(419)。 基本上平行于第一排引线(430)并且离开板模块表面的第一距离(451),该第一距离基本上垂直于连接器引线表面(419)延伸并成形为在第二距离(基本上垂直于基板垂直于板模块表面) 452)从连接器引线表面; 以及基本上平行于所述板模块表面延伸的第二排引线(440)和从所述连接器引线表面(419)基本上垂直延伸的第三距离(453),并且被成形为基本垂直于所述板模块表面(420)连接 与连接器引线表面的第四距离(454)。 所述第一距离大于所述第三距离,所述第二距离小于所述第四距离,并且所述第二行引线中的每一个从所述第一排引线偏移。