专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20050173259A1 Endpoint system for electro-chemical mechanical polishing 审中-公开
标题翻译：电化学机械抛光端点系统
公开(公告)号：US20050173259A1
公开(公告)日：2005-08-11
申请号：US10773868
申请日：2004-02-06
申请人： Rashid Mavliev , Boguslaw Swedek , Andreas Wiswesser , Manoocher Birang
发明人： Rashid Mavliev , Boguslaw Swedek , Andreas Wiswesser , Manoocher Birang
IPC分类号： B23H5/08 , B24B37/04 , C25F7/00 , B24B49/00 , B23H7/00 , B23H11/00 , C25B9/04
CPC分类号： B24B37/013 , B23H5/08 , B24B49/105 , C25F7/00
摘要： An electrochemical mechanical polishing apparatus has a rotatable platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, and multiple sensors, e.g., optical sensors or eddy current sensors, spaced at different angular positions about the axis of rotation of the platen. Each of the sensors can be substantially identical. A processor receives the signal from each of the sensors to determines a polishing endpoint.
摘要翻译：电化学机械抛光装置具有可旋转压板以支撑抛光垫，用于将基板保持在抛光垫上的载体头以及围绕旋转轴线在不同角度位置间隔开的多个传感器，例如光学传感器或涡流传感器的压板。每个传感器可以是基本相同的。处理器从每个传感器接收信号以确定抛光端点。

22. 发明申请

US20050170751A1 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations 有权
公开(公告)号：US20050170751A1
公开(公告)日：2005-08-04
申请号：US11099789
申请日：2005-04-05
申请人： Manoocher Birang , Nils Johansson , Allan Gleason
发明人： Manoocher Birang , Nils Johansson , Allan Gleason
IPC分类号： B24B37/04 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , B24D7/12 , B24D13/14 , G01B11/06 , B24B49/00
CPC分类号： H01L22/12 , B24B37/013 , B24B37/205 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , G01B11/0683
摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

23. 发明授权

US06811466B1 System and method for in-line metal profile measurement 有权
标题翻译：在线金属型材测量的系统和方法
公开(公告)号：US06811466B1
公开(公告)日：2004-11-02
申请号：US10330685
申请日：2002-12-27
申请人： Boguslaw A Swedek , Nils Johansson , Andreas Norbert Wiswesser , Manoocher Birang
发明人： Boguslaw A Swedek , Nils Johansson , Andreas Norbert Wiswesser , Manoocher Birang
IPC分类号： B24B4900
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
摘要翻译：一种系统包括用于将涡流探针靠近衬底保持器中的衬底定位的测量站。探针可以产生时变磁场，以便在抛光之前或之后在衬底的一个或多个导电区域中引起涡流。检测涡流信号，并可用于更新化学机械抛光系统的一个或多个抛光参数。衬底保持器可以位于多个位置; 例如，在基板传送系统，工厂接口模块，清洁器或化学机械抛光系统的远离抛光站的一部分中。可以使用附加的探针。

24. 发明授权

US06719818B1 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations 失效
公开(公告)号：US06719818B1
公开(公告)日：2004-04-13
申请号：US09028412
申请日：1998-02-24
申请人： Manoocher Birang , Nils Johansson , Allan Gleason
发明人： Manoocher Birang , Nils Johansson , Allan Gleason
IPC分类号： B24B100
CPC分类号： B24B37/205 , B24B37/013 , B24B37/22 , B24B49/12 , B24D7/12 , Y10T428/24273 , Y10T428/24289 , Y10T428/249978
摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

25. 发明授权

US06592439B1 Platen for retaining polishing material 有权
标题翻译：压板用于保留抛光材料
公开(公告)号：US06592439B1
公开(公告)日：2003-07-15
申请号：US09709769
申请日：2000-11-10
申请人： Shijian Li , Manoocher Birang , Ramin Emami , Andrew Nagengast , Douglas Orcutt Brown , Shi-Ping Wang , Martin Scales , John White
发明人： Shijian Li , Manoocher Birang , Ramin Emami , Andrew Nagengast , Douglas Orcutt Brown , Shi-Ping Wang , Martin Scales , John White
IPC分类号： B24B2900
CPC分类号： B25B11/005 , B24B21/04 , B24B37/16 , H01L21/30625
摘要： Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are formed in a polishing area of the top surface. The vacuum ports are disposed in the platen and at least one port is in communication with at least one of the channels. Upon application of a vacuum to the ports, the channels remove fluids under the polishing material while securing the polishing material to the top surface.
摘要翻译：通常，提供了用于保持抛光材料的方法和装置。在一个实施例中，该装置包括具有顶表面，多个通道和一个或多个真空端口的压板。顶表面适于支撑抛光材料。多个通道形成在顶表面的抛光区域中。真空端口设置在压板中，并且至少一个端口与至少一个通道连通。当向端口施加真空时，通道在将抛光材料固定到顶表面的同时移除抛光材料下面的流体。

26. 发明授权

US06585563B1 In-situ monitoring of linear substrate polishing operations 失效
标题翻译：线性衬底抛光操作的原位监控
公开(公告)号：US06585563B1
公开(公告)日：2003-07-01
申请号：US09724846
申请日：2000-11-28
申请人： Fred C. Redeker , Manoocher Birang , Shijian Li , Sasson Somekh
发明人： Fred C. Redeker , Manoocher Birang , Shijian Li , Sasson Somekh
IPC分类号： B24B100
CPC分类号： B24B37/005 , B24B21/04 , B24B49/04 , B24B49/12 , H01L21/30625
摘要： A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.
摘要翻译：描述了基板抛光方案（装置和方法），根据该基板抛光方案，研磨片的抛光表面通过驱动机构在大致线性方向上被驱动，基板的表面通过一个抛光头，并且通过监视系统通过抛光片探测基板。

27. 发明授权

US06557248B1 Method of fabricating an electrostatic chuck 失效
标题翻译：制造静电卡盘的方法
公开(公告)号：US06557248B1
公开(公告)日：2003-05-06
申请号：US09087332
申请日：1998-05-29
申请人： Shamouil Shamouilian , Manoocher Birang , John F. Cameron , Chandra Deshpandey , Alfred Goldspeil , Ron Northrup , Semyon Sherstinsky , Sasson Someth
发明人： Shamouil Shamouilian , Manoocher Birang , John F. Cameron , Chandra Deshpandey , Alfred Goldspeil , Ron Northrup , Semyon Sherstinsky , Sasson Someth
IPC分类号： H01R4300
CPC分类号： C23C16/45521 , C23C16/4586 , H01L21/67103 , H01L21/6831 , H01L21/6833 , H02N13/00 , Y10T29/49117 , Y10T279/23
摘要： A method of fabricating an electrostatic member 33 for holding a substrate 45 in a process chamber 80 containing erosive process gas. The method comprises the steps of forming an electrostatic member 33 comprising an insulator or dielectric layer 35 covering an electrically conductive layer, and shaping the electrostatic member 33 to form a dielectric covered electrode and an electrical connector 55 attached to the dielectric covered electrode 50 to conduct charge to the dielectric covered electrode 50.
摘要翻译：一种制造静电部件33的方法，用于将基板45保持在包含腐蚀性处理气体的处理室80中。该方法包括以下步骤：形成包括覆盖导电层的绝缘体或电介质层35的静电部件33，并且使静电部件33成形以形成介电覆盖电极和连接到电介质被覆电极50的电连接器55 充电到介电覆盖电极50。

28. 发明授权

US06554003B1 Method and apparatus for cleaning a thin disc 失效
标题翻译：清洁薄盘的方法和装置
公开(公告)号：US06554003B1
公开(公告)日：2003-04-29
申请号：US09698819
申请日：2000-10-26
申请人： Manoocher Birang , Bruno Strul
发明人： Manoocher Birang , Bruno Strul
IPC分类号： B08B600
CPC分类号： H01L21/67253 , B08B3/048 , B08B3/12 , H01L21/67057
摘要： Methods and apparatus are provided for cleaning a thin disc. In accordance with a first aspect, an apparatus is provided that includes a tank adapted to contain a fluid, and at least one support mechanism adapted to support a thin disc such that the thin disc is at least partially submerged in the fluid. The apparatus further includes a plurality of transducers each adapted to produce energy waves in the fluid, and a controller adapted to adjust the energy waves produced by each transducer so as to scan an energy wave maximum along a surface of a thin disc supported by the at least one support mechanism.
摘要翻译：提供了用于清洁薄盘的方法和装置。根据第一方面，提供了一种装置，其包括适于容纳流体的罐和适于支撑薄盘的至少一个支撑机构，使得所述薄盘至少部分地浸没在所述流体中。该装置还包括多个换能器，每个换能器适于在流体中产生能量波，以及控制器，其适于调节由每个换能器产生的能量波，以便沿着由at支撑的薄盘的表面扫描能量波最大值至少一个支持机制。

29. 发明授权

US06540594B2 Carrier head with a flexible membrane for a chemical mechanical polishing system 有权
公开(公告)号：US06540594B2
公开(公告)日：2003-04-01
申请号：US10071745
申请日：2002-02-08
申请人： Steven M. Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
发明人： Steven M. Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
IPC分类号： B24B500
CPC分类号： B24B37/30 , B24B37/32
摘要： A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

30. 发明授权

US06537133B1 Method for in-situ endpoint detection for chemical mechanical polishing operations 有权
标题翻译：化学机械抛光操作的原位终点检测方法
公开(公告)号：US06537133B1
公开(公告)日：2003-03-25
申请号：US09672549
申请日：2000-09-28
申请人： Manoocher Birang , Nils Johansson , Allan Gleason
发明人： Manoocher Birang , Nils Johansson , Allan Gleason
IPC分类号： B24B4900
CPC分类号： B24B47/12 , B24B37/013 , B24B37/205 , B24B49/04 , B24B49/12 , B24B51/00 , G01B11/0683
摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
摘要翻译：使用用于在CMP处理期间原地确定终止该过程的端点的装置的晶片的化学机械抛光（CMP）的装置和方法。该装置包括能够产生朝向晶片的激光束并检测从晶片反射的光的激光干涉仪，以及邻近通过压板形成的孔布置的窗口。该窗口在晶片覆盖窗口的至少部分时间内为激光束提供通路。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式