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    • 28. 发明申请
    • NITRIDE SEMICONDUCTOR STACKED STRUCTURE AND METHOD FOR MANUFACTURING SAME AND NITRIDE SEMICONDUCTOR DEVICE
    • 氮化物半导体堆叠结构及其制造方法和氮化物半导体器件
    • US20120211784A1
    • 2012-08-23
    • US13223853
    • 2011-09-01
    • Hideto Sugawara
    • Hideto Sugawara
    • H01L33/32H01L21/20H01L29/66
    • H01L33/20H01L21/0237H01L21/02458H01L21/02505H01L21/0254H01L21/02579H01L21/0262H01L21/02639H01L33/007
    • According to one embodiment, a nitride semiconductor stacked structure having a first surface includes a substrate, a first buffer layer, a first crystal layer, a second buffer layer and a second crystal layer. A step portion is provided in the substrate and includes an upper surface, a lower surface, and a side surface between the upper surface and the lower surface. The first buffer layer includes InsAltGa1-s-tN (0≦s≦0.05, 0≦t≦1) and covers the lower surface and the side surface. The first crystal layer is provided on the first buffer layer, includes InsAltGa1-s-tN (0≦s≦0.05, 0≦t≦0.05), and has an upper surface provided above the upper surface of the substrate. The second buffer layer includes InsAltGa1-s-tN (0≦s≦0.05, 0≦t≦1) and continuously covers the upper surface of the first crystal layer and the upper surface of the substrate. The second crystal layer covers the second buffer layer, includes InsAltGa1-s-tN (0≦s≦0.05, 0≦t≦0.05), and has the first surface.
    • 根据一个实施例,具有第一表面的氮化物半导体层叠结构包括基板,第一缓冲层,第一晶体层,第二缓冲层和第二晶体层。 台阶部设置在基板中,并且包括上表面,下表面和上表面与下表面之间的侧表面。 第一缓冲层包括InsAltGa1-s-tN(0≦̸ s≦̸ 0.05,0≦̸ t≦̸ 1)并且覆盖下表面和侧表面。 第一晶体层设置在第一缓冲层上,包括InsAltGa1-s-tN(0≦̸ s≦̸ 0.05,0和nlE; t≦̸ 0.05),并且在衬底的上表面上方设置上表面。 第二缓冲层包括InsAltGa1-s-tN(0≦̸ s≦̸ 0.05,0≦̸ t≦̸ 1),并连续地覆盖第一晶体层的上表面和衬底的上表面。 第二晶体层覆盖第二缓冲层,包括InsAltGa1-s-tN(0≦̸ s≦̸ 0.05,0和nlE; t≦̸ 0.05),并具有第一表面。