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    • 21. 发明申请
    • Injection molded microoptics
    • 注塑微光学
    • US20070029277A1
    • 2007-02-08
    • US11195147
    • 2005-08-02
    • Lawrence JacobowitzStephen BuchwalterCasimer DeCusatisPeter GruberDa-Yuan Shih
    • Lawrence JacobowitzStephen BuchwalterCasimer DeCusatisPeter GruberDa-Yuan Shih
    • B29D11/00B29C35/08B29C45/00
    • H01L27/14685B29D11/00365B29D11/00461B82Y30/00G02B3/0018G02B3/0056G02F1/137G02F1/29H01L27/14627H01L31/02327H01L33/58
    • A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.
    • 描述了用于在半导体和其他图像显示装置,背板,光电板和集成光学系统上形成,对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中,由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成,任选地涂覆有释放材料层,并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器,波导管,光纤模式变压器,衍射光栅,折射透镜,衍射透镜/菲涅耳带片,反射器以及元件和器件的组合,包括微机电系统(MEMS)和液晶器件 (LCD)矩阵,用于自适应,可调元素。 教导界面层性质和附着工艺实施例的制备。
    • 29. 发明授权
    • Substrate-embedded pluggable receptacles for connecting clustered
optical cables to a module
    • 用于将集群光缆连接到模块的基板嵌入式可插拔插座
    • US5333225A
    • 1994-07-26
    • US101119
    • 1993-08-03
    • Lawrence JacobowitzMario E. EckerCasimer M. DeCusatis
    • Lawrence JacobowitzMario E. EckerCasimer M. DeCusatis
    • G02B6/38G02B6/42G02B6/00G02B6/36
    • G02B6/4292G02B6/423G02B6/4249G02B6/3839G02B6/421G02B6/4214G02B6/4232
    • Obtains a large increase in the number of fiber optic inputs/output (I/O) lines connectable to a module by enabling edge connection of multiple clusters of optical fibers to be connected around a module. Each connector connects a cluster of optical fibers in a small dimension of space on the module. Many distinct pluggable connectors may be provided along one or more edges of a module. The optical-fiber cluster connectors are embedded in indentations around the edges of a multilayer glass/ceramic (MLGC) multi-chip module (MCM), which may be a thermal conduction module (TCM), containing an integrated photonic receiver and/or transmitter for each fiber. Each connector supports a large number of fibers from a single cable, and a large number of connectors may be provided in a single module. Easy plugging and unplugging is obtained for each connector without interferring with any existing cooling apparatus or I/O pins of the module. Receptacle and plug assemblies which hold the fibers in respective key V-grooves etched in silicon members which carry and interlock each fiber in each receptacle. Alignment and locking means is provided in each connector for aligning a plug's array of fibers with corresponding receptacle fibers in one or more angled groove(s) in a receiving receptacle. Thermal coefficients of expansion match between the silicon receptacle and the glass-ceramic substrate to guarantee the preservation of opto-mechanical alignments.
    • 通过使多个光纤集群的边缘连接能够连接到模块上,可以大幅度增加可连接到模块的光纤输入/输出(I / O)线路数量。 每个连接器在模块的一小部分空间中连接一束光纤。 可以沿着模块的一个或多个边缘设置许多不同的可插拔连接器。 光纤簇连接器嵌入在多层玻璃/陶瓷(MLGC)多芯片模块(MCM)的边缘周围的凹陷中,多层玻璃/陶瓷(MLGC)多芯片模块(MCM)可以是导热模块(TCM),其包含集成的光子接收器和/或发射器 对于每根纤维 每个连接器支持来自单个电缆的大量光纤,并且可以在单个模块中提供大量连接器。 每个连接器都可以轻松插拔插头,而不会干扰任何现有的冷却设备或模块的I / O引脚。 插座和插头组件,其将纤维保持在硅构件中蚀刻的相应的键V形槽中,所述硅构件在每个容座中承载和互锁每个纤维。 对准和锁定装置设置在每个连接器中,用于将插头的光纤阵列与在接收容座中的一个或多个成角度的凹槽中的对应插座光纤对准。 硅插座和玻璃陶瓷基板之间的热膨胀系数匹配,以保证光机械对准的保存。