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    • 24. 发明授权
    • Method of integrating volatile and non-volatile memory cells on the same substrate and a semiconductor memory device thereof
    • 将易失性和非易失性存储单元集成在同一衬底上的方法及其半导体存储器件
    • US06670234B2
    • 2003-12-30
    • US09887403
    • 2001-06-22
    • Louis L. HsuCarl J. RadensLi-Kong Wang
    • Louis L. HsuCarl J. RadensLi-Kong Wang
    • H01L2100
    • H01L27/11526H01L27/105H01L27/1052H01L27/10861H01L27/10894H01L27/11546
    • A method for fabricating DRAM and flash memory cells on a single chip includes providing a silicon substrate, forming a trench capacitor for each of the DRAM cells in the silicon substrate, forming isolation regions in the silicon substrate which are electrically isolated from each other, forming first type wells for DRAM and flash memory cells at first predetermined regions of the silicon substrate by implanting a first type impurity in the first predetermined regions, forming second type wells for DRAM and flash memory cells at second predetermined regions in the first type wells by implanting a second type impurity in the second predetermined regions, forming oxide layers for DRAM and flash memory cells on the second type wells, forming gate electrodes for DRAM and flash memory cells on the oxide layers for DRAM and flash memory cells, and forming source and drain regions for DRAM and flash memory cells in the respective second type wells for DRAM and flash memory cells, in which the source and drain regions are associated with each of the gate electrodes for DRAM and flash memory cells.
    • 在单个芯片上制造DRAM和闪存单元的方法包括提供硅衬底,为硅衬底中的每个DRAM单元形成沟槽电容器,形成硅衬底中彼此电隔离的隔离区域,形成 通过在第一预定区域中注入第一种类型的杂质,在第一种类型的阱中的第二预定区域形成用于DRAM和闪速存储单元的第二类型阱,通过植入 在第二预定区域中形成第二类型杂质,在第二类型阱上形成用于DRAM和闪存单元的氧化物层,在DRAM和闪存单元的氧化物层上形成用于DRAM的闪存存储单元的栅电极,以及形成源极和漏极 用于DRAM和闪速存储器单元的相应的第二类型阱中的用于DRAM和闪存单元的区域 e源极和漏极区域与用于DRAM和闪存单元的每个栅电极相关联。
    • 26. 发明授权
    • High-density dual-cell flash memory structure
    • 高密度双单元闪存结构
    • US06541815B1
    • 2003-04-01
    • US09974968
    • 2001-10-11
    • Jack A. MandelmanLouis L. HsuChung H. LamCarl J. Radens
    • Jack A. MandelmanLouis L. HsuChung H. LamCarl J. Radens
    • H01L29788
    • H01L29/66825H01L21/28273H01L27/115H01L27/11556H01L29/7885
    • A 2F2 flash memory cell structure and a method of fabricating the same are provided. The 2F2 flash memory cell structure includes a Si-containing substrate having a plurality of trenches formed therein. Each trench has sidewalls that extend to a bottom wall, a length and individual segments that include two memory cell elements per segment. Each memory cell element comprises (i) a floating gate region having L-shaped gates formed on a portion of each trench sidewall; (ii) a program line overlapping one side of the L-shaped gates present at the bottom wall of each trench and extending along the entire length of the plurality of trenches; and (iii) a control gate region overlying the floating gate region. The control gate region includes gates formed on portions of the sidewalls of the trenches that are coupled to the floating gate regions. The memory cell structure further includes bitline diffusion regions formed in the Si-containing semiconductor substrate abutting each trench segment; and wordlines that lay orthogonal to the trenches. The wordlines are in contact with a top surface of each control gate region.
    • 提供了一种2F2闪存单元结构及其制造方法。 2F2闪存单元结构包括其中形成有多个沟槽的含Si衬底。 每个沟槽具有延伸到底壁,长度和包括每个段的两个存储单元元件的单独段的侧壁。 每个存储单元元件包括(i)具有形成在每个沟槽侧壁的一部分上的L形栅极的浮栅区域; (ii)重叠在每个沟槽的底壁处的L形门的一侧并沿多个沟槽的整个长度延伸的程序线; 和(iii)覆盖浮栅区域的控制栅极区域。 控制栅极区域包括形成在沟槽的侧壁的与浮动栅极区域耦合的部分上的栅极。 所述存储单元结构还包括形成在所述含Si半导体衬底中的位线邻接每个沟槽段的位线扩散区; 和与沟槽正交的字线。 字线与每个控制栅极区域的顶表面接触。
    • 28. 发明授权
    • Patterning microelectronic features without using photoresists
    • 图案化微电子特征,而不使用光致抗蚀剂
    • US06452110B1
    • 2002-09-17
    • US09897889
    • 2001-07-05
    • Lawrence A. ClevengerLouis L. HsuCarl J. RadensLi-Kong WangKeith Kwong Hon Wong
    • Lawrence A. ClevengerLouis L. HsuCarl J. RadensLi-Kong WangKeith Kwong Hon Wong
    • H05K109
    • H05K3/02H01L21/288H01L21/32134H01L21/76885Y10T29/49155Y10T29/49156
    • A method and structure for producing metallic polymer conductor lines comprising of an alternative methodology to a traditional damascene approach, called a cloisonne or inverse damascene approach. The cloisonne approach comprises the steps of coating a photosensitive polymer such as pyrrole or aniline with a silver salt on a semiconductor substrate. Using standard photolithography and resist developing techniques, the conducting polymer is exposed to a wet chemical developer, removing a portion of the exposed conducting polymer region, leaving only conducting polymer lines on top of the substrate. Next, an insulating dielectric layer is deposited over the entire structure and a chemical mechanical polish planarization of the insulator is performed creating the conducting polymer lines. Included in another aspect of the invention is a method and structure for a self-planarizing interconnect material comprising a conductive polymer thereby reducing the number of processing steps relative to the prior art.
    • 一种用于生产金属聚合物导体线的方法和结构,其包括传统大马士革方法的替代方法,称为景泰蓝或逆大马士革方法。 景泰蓝方法包括在半导体衬底上用银盐将光敏聚合物如吡咯或苯胺涂覆的步骤。 使用标准光刻和抗蚀显影技术,将导电聚合物暴露于湿化学显影剂,除去暴露的导电聚合物区域的一部分,仅在基底顶部留下导电聚合物线。 接下来,在整个结构上沉积绝缘电介质层,并进行绝缘体的化学机械抛光平面化,产生导电聚合物线。 包括在本发明的另一方面中的是一种用于自平坦化互连材料的方法和结构,其包括导电聚合物,从而减少相对于现有技术的加工步骤的数量。