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21. 发明申请

US20100109016A1 POWER SEMICONDUCTOR MODULE 审中-公开
标题翻译：功率半导体模块
公开(公告)号：US20100109016A1
公开(公告)日：2010-05-06
申请号：US12596382
申请日：2008-04-17
申请人： Yuji Yagi , Yasushi Yamada , Ikuo Nakagawa , Takashi Atsumi , Mikio Shirai , Ikuo Ohnuma , Kiyohito Ishida , Yoshikazu Takaku
发明人： Yuji Yagi , Yasushi Yamada , Ikuo Nakagawa , Takashi Atsumi , Mikio Shirai , Ikuo Ohnuma , Kiyohito Ishida , Yoshikazu Takaku
IPC分类号： H01L23/488 , H01L29/12
CPC分类号： H01L23/3735 , H01L23/473 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83447 , H01L2224/838 , H01L2224/83805 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/1579 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2224/83205
摘要： Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.
摘要翻译：提供了一种功率半导体模块，其中两个部件通过Bi基焊料材料接合。在其表面上设置有Cu层，以通过Bi基焊料材料粘接在双组分上。两个部件，即待接合的部件，是半导体元件和绝缘部件的组合，或绝缘部件和散热器板的组合。绝缘部由Cu / SiNx / Cu层叠体构成。

22. 发明授权

US08283783B2 Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same 有权
标题翻译：焊料，其制造方法，接合体，其制造方法，功率半导体模块及其制造方法
公开(公告)号：US08283783B2
公开(公告)日：2012-10-09
申请号：US12669346
申请日：2008-11-19
申请人： Yasushi Yamada , Yuji Yagi , Yoshikazu Takaku , Ikuo Ohnuma , Kiyohito Ishida , Takashi Atsumi , Ikuo Nakagawa , Mikio Shirai
发明人： Yasushi Yamada , Yuji Yagi , Yoshikazu Takaku , Ikuo Ohnuma , Kiyohito Ishida , Takashi Atsumi , Ikuo Nakagawa , Mikio Shirai
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： C22C18/04 , B23K35/282 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/26175 , H01L2224/27013 , H01L2224/29 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29118 , H01L2224/29298 , H01L2224/32014 , H01L2224/83051 , H01L2224/83101 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/1579 , H01L2924/19042 , H01L2924/351 , Y10T428/12222 , H01L2924/00 , H01L2924/01049 , H01L2924/01028 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要： A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.
摘要翻译：本发明的锌基焊料55通过在其上除去氧化膜501或不存在氧化膜501的锌基材料50的表面上设置涂覆层51来制备，该涂层51包含主要是氧化物比氧化膜501更容易还原的金属。在本发明的接合体和功率半导体模块中，在接合部使用锌基焊料55，在接合后，涂层51 不存在。

23. 发明申请

US20130333812A1 COPPER ALLOY AND PROCESS FOR PRODUCING COPPER ALLOY 审中-公开
标题翻译：铜合金和铜合金生产工艺
公开(公告)号：US20130333812A1
公开(公告)日：2013-12-19
申请号：US13993642
申请日：2011-12-13
申请人： Kiyohito Ishida , Rysuke Kainuma , Ikuo Ohnuma , Toshihiro Omori , Takashi Miyamoto , Hiroki Sato
发明人： Kiyohito Ishida , Rysuke Kainuma , Ikuo Ohnuma , Toshihiro Omori , Takashi Miyamoto , Hiroki Sato
IPC分类号： C22C9/06 , C22C9/05 , C22C9/02 , C22C9/04 , C22F1/08 , C22C9/01
CPC分类号： C22C9/02 , C22C9/01 , C22C9/04 , C22C9/05 , C22C9/06 , C22F1/08 , H01B1/026
摘要： To provide a copper alloy of the FCC structure containing Ni: 3.0 to 29.5 mass %, Al: 0.5 to 7.0 mass %, and Si: 0.1 to 1.5 mass %, with the remainder consisting of Cu and incidental impurities, wherein the copper alloy is of the high strength, but is excellent in workability, and has high electrical conductivity, and can control property thereof, by precipitating a γ′ phase of the L12 structure including Si at an average particle diameter of 100 nm or less in a parent phase of the copper alloy.
摘要翻译：为了提供含有Ni：3.0〜29.5质量％，Al：0.5〜7.0质量％，Si：0.1〜1.5质量％的FCC结构的铜合金，其余由Cu和杂质构成，其中，铜合金为的高强度，但是具有优异的可加工性，并且具有高导电性，并且可以通过使包含平均粒径为100nm以下的Si的L12结构的γ相析出在母体相中铜合金。

24. 发明授权

US09605334B2 Highly heat-resistant and high-strength Rh-based alloy and method for manufacturing the same 有权
公开(公告)号：US09605334B2
公开(公告)日：2017-03-28
申请号：US14345424
申请日：2012-04-16
申请人： Kiyohito Ishida , Yoshikazu Takaku , Toshihiro Omori
发明人： Kiyohito Ishida , Yoshikazu Takaku , Toshihiro Omori
IPC分类号： C22C5/04 , C22F1/14
CPC分类号： C22F1/14 , C22C5/04
摘要： The present invention is a heat-resistant material comprising a Rh-based alloy, wherein the Rh-based alloy is a high heat-resistant and high strength alloy comprising a Rh-based alloy where Al and W as essential additive elements are added to Rh (0.2 to 15.0 mass % of Al, 15.0 to 45.0 mass % of W and Rh as the remainder), and a γ′ phase (Rh3 (Al, W)) having an L12 structure is dispersed as a strengthening phase in a matrix. The Rh-based alloy of the present invention can be further improved in workability and high temperature oxidation characteristics by optionally adding B, C, Mg, Ca, Y, La or misch metals, Ni, Co, Cr, Fe, Mo, Ti, Nb, Ta, V, Zr, Hf, Ir, Re, Pd, Pt or Ru as an additive element. The Rh-based alloy of the present invention is a heat-resistant material having excellent high-temperature-resistant characteristics and a good balance of factors such as weight.

25. 发明申请

US20140345758A1 HIGHLY HEAT-RESISTANT AND HIGH-STRENGTH Rh-BASED ALLOY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：高耐热和高强度的Rh基合金及其制造方法
公开(公告)号：US20140345758A1
公开(公告)日：2014-11-27
申请号：US14345424
申请日：2012-04-16
申请人： Kiyohito Ishida , Yoshikazu Takaku , Toshihiro Omori
发明人： Kiyohito Ishida , Yoshikazu Takaku , Toshihiro Omori
IPC分类号： C22F1/14 , C22C5/04
CPC分类号： C22F1/14 , C22C5/04
摘要： The present invention is a heat-resistant material comprising a Rh-based alloy, wherein the Rh-based alloy is a high heat-resistant and high strength alloy comprising a Rh-based alloy where Al and W as essential additive elements are added to Rh (0.2 to 15.0 mass % of Al, 15.0 to 45.0 mass % of W and Rh as the remainder), and a γ′ phase (Rh3 (Al, W)) having an L12 structure is dispersed as a strengthening phase in a matrix. The Rh-based alloy of the present invention can be further improved in workability and high temperature oxidation characteristics by optionally adding B, C, Mg, Ca, Y, La or misch metals, Ni, Co, Cr, Fe, Mo, Ti, Nb, Ta, V, Zr, Hf, Ir, Re, Pd, Pt or Ru as an additive element. The Rh-based alloy of the present invention is a heat-resistant material having excellent high-temperature-resistant characteristics and a good balance of factors such as weight.
摘要翻译：本发明是一种包含Rh基合金的耐热材料，其中Rh基合金是一种高耐热和高强度的合金，其中Al和W作为必需添加元素加入Rh中的Rh基合金（Al为0.2〜15.0质量％，W为15.0〜45.0质量％，Rh为余量），具有L12结构的γ'相（Rh 3（Al，W））作为强化相分散在基体中。通过任意添加B，C，Mg，Ca，Y，La或混合稀土金属，Ni，Co，Cr，Fe，Mo，Ti等，能够进一步提高本发明的Rh系合金的加工性和高温氧化特性， Nb，Ta，V，Zr，Hf，Ir，Re，Pd，Pt或Ru作为添加元素。本发明的Rh系合金是具有优异的耐高温特性和重量等因素的良好平衡的耐热材料。

26. 发明申请

US20100156579A1 FERROMAGNETIC SHAPE MEMORY ALLOY AND ITS USE 有权
标题翻译： FERROMAGNETIC SHAPE MEMORY合金及其使用
公开(公告)号：US20100156579A1
公开(公告)日：2010-06-24
申请号：US11993812
申请日：2006-06-27
申请人： Kiyohito Ishida , Katsunari Oikawa , Ryosuke Kainuma , Takeshi Kanomata , Yuji Sutou
发明人： Kiyohito Ishida , Katsunari Oikawa , Ryosuke Kainuma , Takeshi Kanomata , Yuji Sutou
IPC分类号： H01F1/00 , H01F1/01
CPC分类号： C22C19/03 , C22C19/058 , C22F1/10 , H01F1/0009 , H01F1/0308
摘要： A ferromagnetic shape memory alloy comprising 25-50 atomic % of Mn, 5-18 atomic % in total of at least one metal selected from the group consisting of In, Sn and Sb, and 0.1-15 atomic % of Co and/or Fe, the balance being Ni and inevitable impurities, which has excellent shape memory characteristics in a practical temperature range, thereby recovering its shape by a magnetic change caused by a magnetic-field-induced reverse transformation in a practical temperature range.
摘要翻译：一种铁磁形状记忆合金，其包含25-50原子％的Mn，5-18原子％的总共至少一种选自In，Sn和Sb的金属和0.1-15原子％的Co和/或Fe 余量为Ni和不可避免的杂质，其在实际温度范围内具有优异的形状记忆特性，从而在实际温度范围内由磁场诱导的反向转变引起的磁变化恢复其形状。

27. 发明授权

US07371295B2 Shape memory alloy and method for producing same 失效
标题翻译：形状记忆合金及其制造方法
公开(公告)号：US07371295B2
公开(公告)日：2008-05-13
申请号：US10804244
申请日：2004-03-18
申请人： Katsunari Oikawa , Kiyohito Ishida , Ryosuke Kainuma , Yuuki Tanaka , Masahiro Ohta , Toru Sukigara
发明人： Katsunari Oikawa , Kiyohito Ishida , Ryosuke Kainuma , Yuuki Tanaka , Masahiro Ohta , Toru Sukigara
IPC分类号： C22C30/00
CPC分类号： C22C19/07 , C22C19/00 , C22F1/10
摘要： A shape memory alloy comprises Co, Ni and Al with a two-phase structure comprising a β-phase having a B2 structure and a γ-phase having an fcc structure, at least 40% by area of crystal grain boundaries of the β-phase being occupied by the γ-phase. The shape memory alloy can be produced by a first heat treatment step comprising heating at 1200 to 1350° C. for 0.1 to 50 hours and cooling at 0.1 to 1000° C./minute, and a second heat treatment step comprising heating at 1000 to 1320° C. for 0.1 to 50 hours and cooling at 10 to 10000° C./minute.
摘要翻译：形状记忆合金包括具有包含具有B2结构的β相和具有fcc结构的γ相的两相结构的Co，Ni和Al，所述β相的晶粒边界的面积至少为40％被γ相占据。形状记忆合金可以通过第一热处理步骤来制造，所述第一热处理步骤包括在1200至1350℃下加热0.1至50小时并在0.1至1000℃/分钟下冷却，以及第二热处理步骤，包括在1000℃加热至 1320℃0.1至50小时，并在10至10000℃/分钟冷却。

28. 发明授权

US08083990B2 Iron-based alloy having shape memory properties and superelasticity and its production method 有权
标题翻译：具有形状记忆性和超弹性的铁基合金及其制造方法
公开(公告)号：US08083990B2
公开(公告)日：2011-12-27
申请号：US12092022
申请日：2006-11-02
申请人： Kiyohito Ishida , Ryosuke Kainuma , Yuji Sutou , Yuuki Tanaka
发明人： Kiyohito Ishida , Ryosuke Kainuma , Yuji Sutou , Yuuki Tanaka
IPC分类号： C22C38/06 , C22C38/08 , C22C38/10
CPC分类号： C21D8/0205 , C22C38/06 , C22C38/105 , H01F1/0308
摘要： An iron-based alloy having shape memory properties and superelasticity, which has a composition comprising 25-35% by mass of Ni, 13-25% by mass of Co, 2-8% by mass of Al, and 1-20% by mass in total of at least one selected from the group consisting of 1-5% by mass of Ti, 2-10% by mass of Nb and 3-20% by mass of Ta, the balance being substantially Fe and inevitable impurities, and a recrystallization texture substantially comprising a γ phase and a γ′ phase, particular crystal orientations of the γ phase being aligned, and the difference between a reverse transformation-finishing temperature and a martensitic transformation-starting temperature being 100° C. or less in the thermal hysteresis of martensitic transformation and reverse transformation.
摘要翻译：具有形状记忆性和超弹性的铁基合金，其具有25〜35质量％的Ni，13〜25质量％的Co，2-8质量％的Al和1-20质量％总共含有选自1-5质量％的Ti，2-10质量％的Nb和3-20质量％的Ta中的至少一种，余量基本上为Fe和不可避免的杂质，以及基本上包含γ相和γ'相的再结晶织构，γ相的特定晶体取向对准，逆相变终轧温度与马氏体相变起始温度之间的差为100℃以下马氏体转变和反向转变的热滞后。

29. 发明授权

US08016952B2 Ferromagnetic shape memory alloy and its use 有权
标题翻译：铁磁形状记忆合金及其用途
公开(公告)号：US08016952B2
公开(公告)日：2011-09-13
申请号：US11993812
申请日：2006-06-27
申请人： Kiyohito Ishida , Katsunari Oikawa , Ryosuke Kainuma , Takeshi Kanomata , Yuji Sutou
发明人： Kiyohito Ishida , Katsunari Oikawa , Ryosuke Kainuma , Takeshi Kanomata , Yuji Sutou
IPC分类号： H01F1/047 , C22C19/03
CPC分类号： C22C19/03 , C22C19/058 , C22F1/10 , H01F1/0009 , H01F1/0308
摘要： A ferromagnetic shape memory alloy comprising 25-50 atomic % of Mn, 5-18 atomic % in total of at least one metal selected from the group consisting of In, Sn and Sb, and 0.1-15 atomic % of Co and/or Fe, the balance being Ni and inevitable impurities, which has excellent shape memory characteristics in a practical temperature range, thereby recovering its shape by a magnetic change caused by a magnetic-field-induced reverse transformation in a practical temperature range.
摘要翻译：一种铁磁形状记忆合金，其包含25-50原子％的Mn，5-18原子％的总共至少一种选自In，Sn和Sb的金属和0.1-15原子％的Co和/或Fe 余量为Ni和不可避免的杂质，其在实际温度范围内具有优异的形状记忆特性，从而在实际温度范围内由磁场诱导的反向转变引起的磁变化恢复其形状。

30. 发明申请

US20090242083A1 IRON-BASED ALLOY HAVING SHAPE MEMORY PROPERTIES AND SUPERELASTICITY AND ITS PRODUCTION METHOD 有权
标题翻译：具有形状记忆性能和超磁性的铁基合金及其生产方法
公开(公告)号：US20090242083A1
公开(公告)日：2009-10-01
申请号：US12092022
申请日：2006-11-02
申请人： Kiyohito Ishida , Ryosuke Kainuma , Yuji Sutou , Yuuki Tanaka
发明人： Kiyohito Ishida , Ryosuke Kainuma , Yuji Sutou , Yuuki Tanaka
IPC分类号： C21D1/00 , C21D6/00
CPC分类号： C21D8/0205 , C22C38/06 , C22C38/105 , H01F1/0308
摘要： An iron-based alloy having shape memory properties and superelasticity, which has a composition comprising 25-35% by mass of Ni, 13-25% by mass of Co, 2-8% by mass of Al, and 1-20% by mass in total of at least one selected from the group consisting of 1-5% by mass of Ti, 2-10% by mass of Nb and 3-20% by mass of Ta, the balance being substantially Fe and inevitable impurities, and a recrystallization texture substantially comprising a γ phase and a γ′ phase, particular crystal orientations of the γ phase being aligned, and the difference between a reverse transformation-finishing temperature and a martensitic transformation-starting temperature being 100° C. or less in the thermal hysteresis of martensitic transformation and reverse transformation.
摘要翻译：具有形状记忆性和超弹性的铁基合金，其具有25〜35质量％的Ni，13〜25质量％的Co，2-8质量％的Al和1-20质量％总共含有选自1-5质量％的Ti，2-10质量％的Nb和3-20质量％的Ta中的至少一种，余量基本上为Fe和不可避免的杂质，以及基本上包含γ相和γ'相的再结晶织构，γ相的特定晶体取向对准，反相转变温度和马氏体相变起始温度之间的差为100℃以下马氏体转变和反向转变的热滞后。

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