专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07766218B2 Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board 有权
标题翻译：整洁的银粒子组合物，固体银的制造方法，固体银，接合方法以及印刷线路板的制造方法
公开(公告)号：US07766218B2
公开(公告)日：2010-08-03
申请号：US12067648
申请日：2006-09-20
申请人： Kimio Yamakawa , Katsutoshi Mine
发明人： Kimio Yamakawa , Katsutoshi Mine
IPC分类号： B23K31/02 , B23K35/34
CPC分类号： H05K3/321 , B22F1/004 , B22F1/0062 , B22F2998/00 , H01B1/22 , H01L2224/29339 , H01L2224/8384 , H01L2924/01019 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H05K1/097 , H05K2201/10636 , H05K2203/1131 , Y02P70/611 , B22F3/10 , H01L2924/00
摘要： To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the like. A pasty silver particle composition comprising nonspherical silver particles having an average particle diameter of 0.1 to 18 μm and a carbon content of not more than 1.0% by weight and a volatile dispersion medium, wherein, upon heating, the volatile dispersion medium is volatilized and the nonspherical silver particles are sintered to one another to form solid silver. There are also provided a process for producing solid silver comprising heating the pasty silver particle composition, solid silver having excellent strength, electric conductivity and thermal conductivity, a method for joining a metallic member using the pasty silver particle composition, and a production process of a printed wiring board comprising silver wiring.
摘要翻译：提供糊状银粒子组合物，其在加热时允许银颗粒容易地烧结以形成具有优异强度，导电性和导热性的固体银以及固体银等的制备方法。一种糊状银粒子组合物，其包含平均粒径为0.1〜18μm，碳含量为1.0重量％以下的非球状银粒子和挥发性分散介质，其中，在加热时，挥发性分散介质挥发，非球形银颗粒彼此烧结以形成固体银。还提供了一种制备固体银的方法，包括加热糊状银颗粒组合物，具有优异强度，导电性和导热性的固体银，使用糊状银颗粒组合物接合金属构件的方法和包括银线的印刷线路板。

22. 发明申请

US20090236404A1 PASTY SILVER PARTICLE COMPOSITION, PROCESS FOR PRODUCING SOLID SILVER, SOLID SILVER, JOINING METHOD, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD 有权
标题翻译：过硫酸银颗粒组合物，用于生产固体银的方法，固体银，接合方法和生产印刷线路板的方法
公开(公告)号：US20090236404A1
公开(公告)日：2009-09-24
申请号：US12067648
申请日：2006-09-20
申请人： Kimio Yamakawa , Katsutoshi Mine
发明人： Kimio Yamakawa , Katsutoshi Mine
IPC分类号： H01B1/22 , C22C1/04 , C22C5/06 , B23K31/02
CPC分类号： H05K3/321 , B22F1/004 , B22F1/0062 , B22F2998/00 , H01B1/22 , H01L2224/29339 , H01L2224/8384 , H01L2924/01019 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H05K1/097 , H05K2201/10636 , H05K2203/1131 , Y02P70/611 , B22F3/10 , H01L2924/00
摘要： [PROBLEMS] To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the like. [MEANS FOR SOLVING PROBLEMS] A pasty silver particle composition comprising nonspherical silver particles having an average particle diameter of 0.1 to 18 μm and a carbon content of not more than 1.0% by weight and a volatile dispersion medium, wherein, upon heating, the volatile dispersion medium is volatilized and the nonspherical silver particles are sintered to one another to form solid silver. There are also provided a process for producing solid silver comprising heating the pasty silver particle composition, solid silver having excellent strength, electric conductivity and thermal conductivity, a method for joining a metallic member using the pasty silver particle composition, and a production process of a printed wiring board comprising silver wiring.
摘要翻译： [问题]提供一种糊状银粒子组合物，其在加热时允许银颗粒容易地烧结以形成具有优异强度，导电性和导热性的固体银以及固体银等的制备方法。 [解决问题的手段]一种糊状银粒子组合物，其包含平均粒径为0.1〜18μm，碳含量为1.0重量％以下的非球形银粒子和挥发分散介质，其中，在加热时，分散介质挥发，非球形银颗粒彼此烧结形成固体银。还提供了一种制备固体银的方法，包括加热糊状银颗粒组合物，具有优异强度，导电性和导热性的固体银，使用糊状银颗粒组合物接合金属构件的方法和包括银线的印刷线路板。

23. 发明授权

US5907190A Semiconductor device having a cured silicone coating with non uniformly dispersed filler 失效
标题翻译：具有固化的具有非均匀分散填料的硅氧烷涂层的半导体器件
公开(公告)号：US5907190A
公开(公告)日：1999-05-25
申请号：US561472
申请日：1995-11-21
申请人： Takae Ishikawa , Katsutoshi Mine , Hiroyosi Naito , Kimio Yamakawa
发明人： Takae Ishikawa , Katsutoshi Mine , Hiroyosi Naito , Kimio Yamakawa
IPC分类号： H01L23/29 , H01L23/31
CPC分类号： H01L23/24 , H01L23/295 , H01L23/3121 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/181
摘要： A semiconductor device in which the surface of the semiconductor element is coated with a cured silicone in which there is dispersed filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 characterized in that the concentration of said filler is higher in the layer of said cured material remote from the element than in the layer of said cured material adjoining the element. The method for fabricating such a device comprises coating the surface of a semiconductor element with a curable silicone composition in which there is dispersed a filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 and thereafter curing said composition after the elapse of sufficient time for the filler in the layer of the composition adjoining the element to migrate into the layer of said composition remote from the element.
摘要翻译：一种半导体器件，其中半导体元件的表面涂覆有固化的硅氧烷，其中具有平均粒径为0.01至500微米，比重为0.01至0.95的分散填料，其特征在于所述填料的浓度为远离元件的所述固化材料的层中高于邻近元件的所述固化材料层。制造这种装置的方法包括用可固化的硅氧烷组合物涂覆半导体元件的表面，其中分散了平均粒径为0.01至500微米，比重为0.01至0.95的填料，然后固化所述组合物在与元件相邻的组合物层中的填料经过足够的时间以迁移到远离元件的组合物层中之后。

24. 发明授权

US6025435A Thermal conductive silicone rubber composition 失效
标题翻译：导热硅橡胶组成
公开(公告)号：US6025435A
公开(公告)日：2000-02-15
申请号：US654493
申请日：1996-05-28
申请人： Kimio Yamakawa , Noriyasu Yokoyama , Katsutoshi Mine
发明人： Kimio Yamakawa , Noriyasu Yokoyama , Katsutoshi Mine
IPC分类号： C08K3/22 , C08L83/04 , C08L83/05 , C08L83/06 , C08L83/07 , C08L83/02
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/24 , C08G77/70
摘要： A thermally conductive silicone rubber composition comprised of (A) 100 parts by weight of an organopolysiloxane that contains at least two silicon-bonded alkenyl groups per molecule, (B) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms molecule, (C) 0.1 to 10 parts by weight of organosiloxane that contains at least one silicon-bonded alkoxy group per silicon-bonded hydroxyl per molecule, (D) 300 to 1200 parts by weight of fine alumina powder comprised of (i) 5 to 95 wt % of spherical or nonspherical fine powder of an average particle diameter of up to 10 .mu.m and of (ii) 95 to 5 wt % of spherical or nonspherical fine alumina powder of an average particle diameter of 10 to 50 .mu.m, and (E) a catalytic quantity a hydrosilylation reaction catalyst.
摘要翻译：一种导热硅橡胶组合物，其包含（A）每分子含有至少两个硅键合的烯基的有机聚硅氧烷100重量份，（B）0.1至50重量份的含有至少两个硅键的烯基的有机基聚硅氧烷，键合氢原子分子，（C）每分子含硅键羟基含有至少一个与硅键合的烷氧基为0.1〜10重量份的有机硅氧烷，（D）300〜1200重量份由（ i）5〜95重量％的平均粒径为10μm以下的球状或非球形的细粉末和（ii）95〜5重量％的平均粒径为10〜50的球状或非球形的微细氧化铝粉末（E）催化量的氢化硅烷化反应催化剂。

25. 发明授权

US5891969A Epoxy resin and epoxy-functional organopolysiloxane 失效
标题翻译：环氧树脂和环氧官能的有机聚硅氧烷
公开(公告)号：US5891969A
公开(公告)日：1999-04-06
申请号：US795919
申请日：1997-02-05
申请人： Katsutoshi Mine , Takae Takeuchi , Kimio Yamakawa
发明人： Katsutoshi Mine , Takae Takeuchi , Kimio Yamakawa
IPC分类号： C08G59/30 , C08G59/32 , C08G59/40 , C08L63/00 , C08L83/04 , C08L83/06 , H01L23/24 , H01L23/29 , H01L23/31 , C08L63/02
CPC分类号： H01L23/296 , C08G59/306 , C08G59/3254 , C08L63/00 , C08L83/04 , C08L83/06 , H01L23/24 , C08G77/10 , C08G77/12 , C08G77/14 , C08G77/70 , H01L2224/48091 , H01L2224/73265
摘要： A curable epoxy resin composition comprising (A) a curable epoxy resin and (B) an organopolysiloxane prepared by equilibrium polymerization and having the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.din which R.sup.1 is an epoxy-functional monovalent organic group, R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group having no more than 4 carbon atoms, a>0, b>0, d>0 and c.gtoreq.0. Also, an electronic component coated with a product obtained by curing the aforesaid composition
摘要翻译：一种可固化环氧树脂组合物，其包含（A）可固化环氧树脂和（B）通过平衡聚合制备并具有平均单元式（R1SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（R3O1 / 2）其中R1是环氧官能的一价有机基团，R 2是一价烃基，R 3是氢原子或不超过4个碳原子的烷基，a> 0，b> 0，d> 0和 c> / = 0。另外，涂覆有通过固化上述组合物获得的产品的电子部件

26. 发明授权

US5877228A Method for curing ultraviolet-curable silicone compositions 失效
标题翻译：紫外线固化型有机硅组合物的固化方法
公开(公告)号：US5877228A
公开(公告)日：1999-03-02
申请号：US926112
申请日：1997-09-09
申请人： Katsutoshi Mine , Hiroyoshi Naito , Kimio Yamakawa
发明人： Katsutoshi Mine , Hiroyoshi Naito , Kimio Yamakawa
IPC分类号： C08F2/48 , C08J3/28
CPC分类号： C08J3/28 , C08J2383/04
摘要： Method for curing UV-curable silicone compositions, characterized by the formation of cured silicone, having a low-tack surface that is harder than the interior, by exposing an ultraviolet-curable silicone composition to ultraviolet radiation at a ratio of the exposure dose for wavelengths of 200 to 280 nm (excluding 280 nm) to the exposure dose for wavelengths of 280 to 400 nm of 0.5 to 10.0.
摘要翻译：固化可UV固化的有机硅组合物的方法，其特征在于形成固化的硅氧烷，其具有比内部更硬的低粘性表面，通过将紫外线固化的硅氧烷组合物暴露于紫外线辐射下，以波长的曝光剂量为200〜280nm（不包括280nm），对于波长为280〜400nm的曝光剂量为0.5〜10.0。

27. 发明授权

US5036024A Method of treating a hardened semiconductor resin encapsulated layer with ultraviolet radiation 失效
标题翻译：用紫外线辐射处理硬化的半导体树脂封装层的方法
公开(公告)号：US5036024A
公开(公告)日：1991-07-30
申请号：US580054
申请日：1990-09-10
申请人： Katsutoshi Mine , Akemi Kogo , Kimio Yamakawa , Kazumi Nakayoshi
发明人： Katsutoshi Mine , Akemi Kogo , Kimio Yamakawa , Kazumi Nakayoshi
IPC分类号： H01L21/56 , H01L23/29 , H01L23/31 , H01L25/065
CPC分类号： H01L21/56 , H01L23/293 , H01L23/3135 , H01L25/0652 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L24/45 , H01L24/48 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/1301 , H01L2924/181 , Y10T29/49121
摘要： Semiconductor devices which comprise a semiconductor chip, electrically conductive materials for connections to external leads, and encapsulated by a sealing resin has a surface and a portion of the electrically conductive material covered with a hardened silicone layer whose surface is exposed to ultraviolet radiation and the irradiation processed surface adheres to and is unified with the sealing resin. The sealing resin does not break easily when the device is exposed to heat cycles, thermal shock, repeated interruptions in current flow, and long periods of time at high temperature or low temperature. Such devices also exhibit excellent properties of moisture resistance, corrosion resistance and stress relaxation.

28. 发明授权

US07375158B2 Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition 失效
标题翻译：使用该组合物制造的导热性可固化液体聚合物组合物和半导体器件
公开(公告)号：US07375158B2
公开(公告)日：2008-05-20
申请号：US10511659
申请日：2003-05-29
申请人： Hiroki Ishikawa , Katsutoshi Mine , Kimio Yamakawa , Kazumi Nakayoshi
发明人： Hiroki Ishikawa , Katsutoshi Mine , Kimio Yamakawa , Kazumi Nakayoshi
IPC分类号： C08L83/04
CPC分类号： C08K3/08 , C08G77/12 , C08G77/20 , C08K3/10 , C08K3/22 , C08K2003/2227 , C08L83/04 , C09K5/14 , H01L23/3736 , H01L23/3737 , H01L2224/32245 , H01L2224/48091 , H01L2924/12044 , H01L2924/1301 , Y10T428/31511 , Y10T428/31663 , C08L2666/54 , C08L83/00 , H01L2924/00014 , H01L2924/00
摘要： A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.
摘要翻译：一种导热固化液体聚合物组合物，其包含（A）可固化液体聚合物，（B）由热可伸长形状记忆合金制成的填料，和（C）除（B）之外的导热填料。一种半导体器件，其具有胶合或涂覆有导热可固化液体聚合物组合物的半导体元件。

29. 发明授权

US5708054A Two-part curable liquid silicone composition 失效
标题翻译：两部分可固化液体硅酮组合物
公开(公告)号：US5708054A
公开(公告)日：1998-01-13
申请号：US738486
申请日：1996-10-28
申请人： Katsutoshi Mine , Takae Takeuchi , Kimio Yamakawa
发明人： Katsutoshi Mine , Takae Takeuchi , Kimio Yamakawa
IPC分类号： C08L83/05 , C08K5/5419 , C08L83/04 , C08L83/07 , C08K9/06
CPC分类号： C08L83/04 , C08G77/12 , C08G77/18 , C08G77/20
摘要： A two-part composition comprising a liquid composition (I) composed of the components (A), (C), and (E) described below and a liquid composition (II) composed of the components (A) (B), (C), and (D) described below, which yield upon mixing a curable liquid silicone composition comprising (A) an alkenyl-substituted poyorganopolysiloxane; (B) a hydrogen-substituted organopolysiloxane in an amount that provides 0.3 to 10 moles silicon-bonded hydrogen from component (B) per 1 mole alkenyl in component (A); (C) an inorganic filler that has a specific surface of 50 to 500 m.sup.2 /g; (D) an alkoxy-substituted organopolysiloxane; and (E) platinum catalyst in a quantity sufficient to cure the instant composition; wherein the curable silicone composition that results when liquid composition (I) and liquid composition (II) are mixed, is thixotropic and has a viscosity, immediately upon the mixing that is greater than the viscosity of liquid composition (II).
摘要翻译：包含由下述组分（A），（C）和（E）组成的液体组合物（I）和由组分（A）（B），（C）组成的液体组合物（II）的两部分组合物）和（D），其在混合包含（A）链烯基取代的聚有机聚硅氧烷的可固化液体硅氧烷组合物时产率; （B）组分（A）中每1摩尔烯烃从组分（B）提供0.3至10摩尔与硅键合的氢的量的氢取代的有机聚硅氧烷; （C）比表面积为50〜500m 2 / g的无机填料; （D）烷氧基取代的有机聚硅氧烷; 和（E）铂催化剂，其量足以固化本发明组合物; 其中当混合液体组合物（I）和液体组合物（II）时产生的可固化有机硅组合物是触变性的并且在混合时立即具有大于液体组合物（II）的粘度的粘度）。

30. 发明授权

US07700678B2 Silver-based powder, method of preparation thereof, and curable silicone composition 失效
标题翻译：银粉，其制备方法和可固化的有机硅组合物
公开(公告)号：US07700678B2
公开(公告)日：2010-04-20
申请号：US10536669
申请日：2003-11-17
申请人： Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Katsutoshi Mine
发明人： Kazumi Nakayoshi , Hiroki Ishikawa , Ryoto Shima , Katsutoshi Mine
IPC分类号： C08K3/22 , C08G77/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08K9/04 , C09J183/04 , H05K3/321
摘要： A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.
摘要翻译：通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理的机械化学反应。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式