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    • 21. 发明申请
    • RELAY DEVICE
    • 继电器
    • US20130250846A1
    • 2013-09-26
    • US13991784
    • 2011-12-21
    • Tadashi MatsumotoTakeshi Sugiyama
    • Tadashi MatsumotoTakeshi Sugiyama
    • H04B7/26
    • H04B7/2606H04B7/15564
    • The relay device includes a first switch interposed between a first extraction unit and a second superimposing unit and a second switch interposed between a second extraction unit and a first superimposing unit. The first switch opens and closes a path where a superimposed signal is relayed from a first transmission path to a second transmission path. The second switch opens and closes a path where a superimposed signal is relayed from the second transmission path to the first transmission path. The first switch is controlled in response to reception of a first control signal to be turned off when a superimposed signal is relayed from the second transmission path to the first transmission path. The second switch is controlled in response to reception of a second control signal to be turned off when a superimposed signal is relayed from the first transmission path to the second transmission path.
    • 中继装置包括插入在第一提取单元和第二叠加单元之间的第一开关和插入在第二提取单元和第一叠加单元之间的第二开关。 第一开关打开和关闭叠加信号从第一传输路径中继到第二传输路径的路径。 第二开关打开和关闭叠加信号从第二传输路径中继到第一传输路径的路径。 当叠加的信号从第二传输路径中继到第一传输路径时,第一开关被响应于接收待关闭的第一控制信号而被控制。 当叠加的信号从第一传输路径中继到第二传输路径时,响应于接收到要关闭的第二控制信号来控制第二开关。
    • 22. 发明申请
    • METHOD FOR PRODUCING METALLIC IRON
    • 生产金属铁的方法
    • US20130055853A1
    • 2013-03-07
    • US13696412
    • 2011-05-02
    • Takeshi SugiyamaTakao Harada
    • Takeshi SugiyamaTakao Harada
    • C21B13/10
    • C22B1/245C21B13/008C21B13/105
    • Disclosed is a technique for preventing the adhesive of metallic iron and/or wustite (which is a material produced by the heat reduction of iron oxide contained in a powder derived from an agglomerate that comprises, as a raw material, a mixture containing a iron-oxide-containing substance and a carbonaceous reducing material) on a heath of a movable furnace heath type heating furnace without largely changing the design of a facility for the production, in the production of metallic iron by placing the agglomerate on the heath and heating the agglomerate in the heating furnace to reduce iron oxide contained in the agglomerate. A heath-forming material for preventing the cohesive of metallic iron and/or wustite (which is a material produced by the heat reduction of iron oxide contained in the powder derived from the agglomerate) on the heath is charged into the furnace together with the agglomerate.
    • 公开了一种防止金属铁和/或方铁矿的粘合剂的技术(其是通过由附聚物得到的粉末中含有的氧化铁的热还原产生的材料,其包含作为原料的含铁 - 含氧化物物质和碳质还原材料),在不会大幅度地改变生产设备的设计的情况下,在生产金属铁的过程中,将附聚物放置在保护层上并加热附聚物 在加热炉中减少附聚物中含有的氧化铁。 将用于防止金属铁和/或方铁矿(其是通过由附聚物衍生的粉末中包含的氧化铁的热还原产生的材料)在固化物上的固化物形成的树脂材料与凝聚物一起装入炉中 。
    • 23. 发明申请
    • MANUFACTURING METHOD OF PACKAGE
    • 包装制造方法
    • US20120249254A1
    • 2012-10-04
    • US13429855
    • 2012-03-26
    • Takeshi Sugiyama
    • Takeshi Sugiyama
    • H01L41/08H05K13/00H03B28/00
    • H03H3/02H03H9/02H03H9/1014H03H9/21H03H2003/026Y10T29/42Y10T29/49126Y10T29/49128
    • Provided is a manufacturing method of a package where a gas generated between a base substrate forming wafer and a lid substrate forming wafer at the time of bonding these two wafers to each other can be easily discharged to the outside. In the method, the base substrate forming wafer and the lid substrate forming wafer are laminated to each other by sandwiching the base substrate forming wafer and the lid substrate forming wafer from both sides in the laminating direction using a lower jig and an upper jig arranged in a vacuum chamber thus forming a wafer bonded body having a plurality of cavities in each of which a piezoelectric vibrating piece is sealed, and the wafer bonded body is cut for every one of plurality of cavities thus forming a plurality of packages.
    • 提供一种封装的制造方法,其中,在将这两个晶片彼此接合时,在基底基板形成晶片和盖基板形成晶片之间产生的气体可以容易地排出到外部。 在该方法中,通过使用下夹具和上夹具布置在基板形成晶片和盖基板形成晶片的两侧的层叠方向上夹着基底基板形成晶片和盖基板形成晶片,将基板形成晶片和盖基板形成晶片彼此层压 真空室,由此形成具有多个空腔的晶片接合体,每个空腔密封压电振动片,并且对于多个空腔中的每一个空腔切割晶片接合体,从而形成多个封装。
    • 24. 发明申请
    • PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR MOUNTING BODY, AND PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD
    • 压电振动器,压电振动器安装体和压电振动器制造方法
    • US20110285250A1
    • 2011-11-24
    • US13196356
    • 2011-08-02
    • Takeshi Sugiyama
    • Takeshi Sugiyama
    • H01L41/053H01L41/22
    • H03H9/1021Y10T29/42
    • This piezoelectric vibrator is provided with a package that is structured to include a first substrate and a second substrate that are bonded to each other such that a cavity is formed therebetween, an internal electrode portion that is formed on the first substrate and housed in the cavity, a piezoelectric vibrating reed that is sealed in the cavity and also is electrically connected to the internal electrode portion in the cavity, an external electrode portion that is formed on an external surface of the first substrate, a through electrode portion that is disposed so as not to be overlapped by the external electrode portion in a thickness direction of the first substrate, while one end of the through electrode portion is electrically connected to the internal electrode portion and another end of the through electrode portion is formed on the external surface of the first substrate while penetrating through the first substrate, and a routing wiring portion that electrically connects the through electrode portion and the external electrode portion.
    • 该压电振动器设置有包括被构造成包括第一基板和第二基板的封装,第一基板和第二基板彼此接合以形成空腔,内部电极部分形成在第一基板上并容纳在空腔中 ,密封在所述空腔中并且还与所述空腔中的内部电极部分电连接的压电振动片,形成在所述第一基板的外表面上的外部电极部分,所述通孔电极部分设置为 在第一基板的厚度方向上不与外部电极部分重叠,而通孔电极部分的一端电连接到内部电极部分,并且通孔电极部分的另一端形成在第二基板的外表面上 第一基板,以及电连接的布线布线部 贯通电极部和外部电极部。