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21. 发明授权

US08178818B2 Photonic milling using dynamic beam arrays 失效
标题翻译：使用动态光束阵列进行光子研磨
公开(公告)号：US08178818B2
公开(公告)日：2012-05-15
申请号：US12235294
申请日：2008-09-22
申请人： Brian W. Baird , Kelly J. Bruland , Robert Hainsey
发明人： Brian W. Baird , Kelly J. Bruland , Robert Hainsey
IPC分类号： B23K26/02 , B23K26/04
CPC分类号： B23K26/03
摘要： A laser processing system includes a beam positioning system to align beam delivery coordinates relative to a workpiece. The beam positioning system generates position data corresponding to the alignment. The system also includes a pulsed laser source and a beamlet generation module to receive a laser pulse from the pulsed laser source. The beamlet generation module generates a beamlet array from the laser pulse. The beamlet array includes a plurality of beamlet pulses. The system further includes a beamlet modulator to selectively modulate the amplitude of each beamlet pulse in the beamlet array, and beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data.
摘要翻译：激光处理系统包括用于使输送坐标相对于工件对准的光束定位系统。光束定位系统产生对准的位置数据。该系统还包括脉冲激光源和子束产生模块，以从脉冲激光源接收激光脉冲。子波束生成模块从激光脉冲生成小波阵列。子束阵列包括多个子束脉冲。该系统还包括一个子束调制器，用于选择性地调制子束阵列中的每个子束脉冲的振幅，以及子束传递光学器件，用于将调制的子束阵列聚焦到与位置数据对应的工件上的位置上的一个或多个目标上。

22. 发明申请

US20090242522A1 PHOTONIC MILLING USING DYNAMIC BEAM ARRAYS 失效
标题翻译：使用动态光束阵列的光电铣削
公开(公告)号：US20090242522A1
公开(公告)日：2009-10-01
申请号：US12235294
申请日：2008-09-22
申请人： Brian W. Baird , Kelly J. Bruland , Robert Hainsey
发明人： Brian W. Baird , Kelly J. Bruland , Robert Hainsey
IPC分类号： B23K26/00
CPC分类号： B23K26/03
摘要： A laser processing system includes a beam positioning system to align beam delivery coordinates relative to a workpiece. The beam positioning system generates position data corresponding to the alignment. The system also includes a pulsed laser source and a beamlet generation module to receive a laser pulse from the pulsed laser source. The beamlet generation module generates a beamlet array from the laser pulse. The beamlet array includes a plurality of beamlet pulses. The system further includes a beamlet modulator to selectively modulate the amplitude of each beamlet pulse in the beamlet array, and beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data.
摘要翻译：激光处理系统包括用于使输送坐标相对于工件对准的光束定位系统。光束定位系统产生对准的位置数据。该系统还包括脉冲激光源和子束产生模块，以从脉冲激光源接收激光脉冲。子波束生成模块从激光脉冲生成小波阵列。子束阵列包括多个子束脉冲。该系统还包括一个子束调制器，用于选择性地调制子束阵列中的每个子束脉冲的振幅，以及子束传递光学器件，用于将调制的子束阵列聚焦到与位置数据对应的工件上的位置上的一个或多个目标上。

23. 发明申请

US20110272388A1 PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING 失效
标题翻译：光电时钟稳定激光加工
公开(公告)号：US20110272388A1
公开(公告)日：2011-11-10
申请号：US13186323
申请日：2011-07-19
申请人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
发明人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
IPC分类号： B23K26/38
CPC分类号： H01S3/0007 , B23K26/042 , B23K26/0622 , B23K26/0853
摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.
摘要翻译：用激光加工工件包括以第一脉冲重复频率产生激光脉冲。第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。

24. 发明授权

US07982160B2 Photonic clock stabilized laser comb processing 失效
标题翻译：光子时钟稳定激光梳状加工
公开(公告)号：US07982160B2
公开(公告)日：2011-07-19
申请号：US12060199
申请日：2008-03-31
申请人： Brian W. Baird , Kelly J. Bruland , Clint Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
发明人： Brian W. Baird , Kelly J. Bruland , Clint Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
IPC分类号： B23K26/36 , H01L21/768 , H01L21/77
CPC分类号： H01S3/0007 , B23K26/042 , B23K26/0622 , B23K26/0853
摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.
摘要翻译：用激光加工工件包括以第一脉冲重复频率产生激光脉冲。第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。

25. 发明申请

US20090242531A1 PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING 失效
标题翻译：光电时钟稳定激光加工
公开(公告)号：US20090242531A1
公开(公告)日：2009-10-01
申请号：US12060199
申请日：2008-03-31
申请人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
发明人： Brian W. Baird , Kelly J. Bruland , Clint R. Vandergiessen , Mark A. Unrath , Brady Nilsen , Steve Swaringen
IPC分类号： B23K26/02 , B23K26/04 , B23K26/08 , G06F19/00
CPC分类号： H01S3/0007 , B23K26/042 , B23K26/0622 , B23K26/0853
摘要： Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.
摘要翻译：用激光加工工件包括以第一脉冲重复频率产生激光脉冲。第一脉冲重复频率提供用于协调光束定位系统和一个或多个配合光束位置补偿元件的参考定时，以相对于工件对准光束传送坐标。该方法还包括在低于第一脉冲重复频率的第二脉冲重复频率下，选择性地放大激光脉冲的子集。包括在子集中的激光脉冲的选择基于从波束定位系统接收的第一脉冲重复频率和位置数据。该方法还包括使用一个或多个配合光束位置补偿元件来调整光束传送坐标，以便将放大的激光脉冲引导到工件上的选定目标。

26. 发明授权

US06593542B2 UV laser system and method for single pulse severing of IC fuses 有权
公开(公告)号：US06593542B2
公开(公告)日：2003-07-15
申请号：US09903439
申请日：2001-07-11
申请人： Brian W. Baird , Brady E. Nilsen , Ho Wai Lo
发明人： Brian W. Baird , Brady E. Nilsen , Ho Wai Lo
IPC分类号： B23K2638
CPC分类号： B23K26/0613 , B23K26/03 , B23K26/04 , B23K26/043 , B23K26/0604 , B23K26/0622 , B23K26/0643 , B23K26/066 , B23K26/0665 , B23K26/067 , B23K2101/40 , H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A Q-switched, diode-pumped, solid-state (DPSS) laser (54) employs harmonic generation through nonlinear crystals (72) to generate UV light (74) for both link processing and target alignment. The type and geometry of the nonlinear crystals (72) are selected, and their temperatures are precisely controlled, to produce focused spot sizes with excellent beam quality for severing of IC fuses. A fraction of the laser output (56) can be utilized in a secondary target alignment system (50). An imaging optics module (52) may be employed to further enhance the shape quality of either or both of the secondary and primary beams. Each beam passes through a detection module (100) that measures the incident and reflected light. The two beams pass through a common combiner to facilitate calibration and alignment of the beams and subsequent link processing.

27. 发明授权

US07157038B2 Ultraviolet laser ablative patterning of microstructures in semiconductors 有权
标题翻译：半导体微结构的紫外激光烧蚀图案化
公开(公告)号：US07157038B2
公开(公告)日：2007-01-02
申请号：US10017497
申请日：2001-12-14
申请人： Brian W. Baird , Michael J. Wolfe , Richard S. Harris , Kevin P. Fahey , Lian-Cheng Zou , Thomas R. McNeil
发明人： Brian W. Baird , Michael J. Wolfe , Richard S. Harris , Kevin P. Fahey , Lian-Cheng Zou , Thomas R. McNeil
IPC分类号： B23K26/38
CPC分类号： B23K26/0622 , B23K26/066 , B23K26/083 , B23K26/0869 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, GaAs, indium phosphide, or single crystalline sapphire, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindrical through-hole openings for integrated circuit connections; singulation of processed die contained on semiconductor wafers; and microtab cutting to separate microcircuit workpieces from a parent semiconductor wafer. Laser output pulses (32) from a diode-pumped, Q-switched frequency-tripled Nd:YAG, Nd:YVO4, or Nd:YLF is directed to the workpiece (12) with high speed precision using a compound beam positioner. The optical system produces a Gaussian spot size, or top hat beam profile, of about 10 microns. The pulse energy used for high-speed ablative processing of semiconductors using this focused spot size is greater than 200 μJ per pulse at pulse repetition frequencies greater than 5 kHz and preferably above 15 kHz. The laser pulsewidth measured at the full width half-maximum points is preferably less than 80 ns.
摘要翻译：特征尺寸小于50微米的图案使用紫外激光烧蚀直接在半导体，特别是硅，GaAs，磷化铟或单晶蓝宝石中形成。这些图案包括用于集成电路连接的非常高的纵横比圆柱形通孔开口; 包含在半导体晶片上的加工芯片的分割; 和微型切割以从母半导体晶片分离微电路工件。来自二极管泵浦Q开关频率三倍的Nd：YAG，Nd：YVO 4或Nd：YLF的激光输出脉冲（32）以高速精度被引导到工件（12）使用复合光束定位器。光学系统产生约10微米的高斯光点尺寸或顶帽光束轮廓。用于使用这种聚焦光点尺寸的半导体高速烧蚀处理的脉冲能量大于5kHz，优选高于15kHz的脉冲重复频率时，每脉冲大于200μJ。在全宽度半最大点处测量的激光脉冲宽度优选小于80ns。

28. 发明申请

US20130244449A1 Methods and Apparatus For Patterning Photovoltaic Devices and Materials For Use With Such Devices 有权
标题翻译：用于图案化的光伏器件和材料用于这种器件的方法和装置
公开(公告)号：US20130244449A1
公开(公告)日：2013-09-19
申请号：US13820997
申请日：2011-09-06
申请人： Brian W. Baird , Timothy D. Gerke
发明人： Brian W. Baird , Timothy D. Gerke
IPC分类号： H01L31/18 , H01L21/78
CPC分类号： H01L31/0236 , B23K26/0624 , B23K26/0732 , B23K26/364 , B23K26/40 , B23K2103/172 , H01L21/268 , H01L21/78 , H01L31/046 , H01L31/0463 , H01L31/073 , H01L31/0749 , H01L31/18 , Y02E10/543
摘要： A picosecond laser beam shaping assembly is disclosed for shaping a picosecond laser beam for use in patterning (e.g., scribing) semiconductor devices. The assembly comprises a pulsed fibre laser source of picosecond laser pulses, a harmonic conversion element for converting laser pulses at a first laser wavelength having a first spectral bandwidth to laser pulses at a second laser wavelength having a second spectral bandwidth, and a beam shaping apparatus for shaping the laser beam at the second laser wavelength, the beam shaping apparatus having a spectral bandwidth that substantially corresponds to the second spectral bandwidth so as to produce a laser beam having a substantially rectangular cross-sectional profile.
摘要翻译：公开了一种皮秒激光束成形组件，用于成形用于图案化（例如划线）半导体器件的皮秒激光束。组件包括皮秒激光脉冲的脉冲光纤激光源，用于将具有第一光谱带宽的第一激光波长的激光脉冲转换成具有第二光谱带宽的第二激光波长的激光脉冲的谐波转换元件，以及光束成形设备为了在第二激光波长处成形激光束，光束成形装置具有基本对应于第二光谱带宽的光谱带宽，以便产生具有基本上矩形横截面轮廓的激光束。

29. 发明申请

US20110170163A1 SYSTEM AND METHOD FOR THE SPATIAL TAILORING OF LASER LIGHT USING TEMPORAL PHASE MODULATION 有权
标题翻译：使用时间相位调制对激光进行空间定位的系统和方法
公开(公告)号：US20110170163A1
公开(公告)日：2011-07-14
申请号：US12978126
申请日：2010-12-23
申请人： Yves Taillon , Mathieu Drolet , David Gay , Louis Desbiens , Brian W. Baird
发明人： Yves Taillon , Mathieu Drolet , David Gay , Louis Desbiens , Brian W. Baird
IPC分类号： G02F1/01
CPC分类号： B23K26/066
摘要： Laser systems and methods for providing an output light beam having a target spatial pattern are provided. A light generating module generates an input light beam, whose spectral profile is then tailored by imposing thereon a controllable phase modulation. The obtained spectrally tailored light beam is dispersed, using at least one spatially-dispersive element to provide an output light beam having a spatial profile which is a function of the spectral profile of the spectrally tailored light beam, The phase modulation is selected in view of the spectral profile of the input light beam and of the dispersion characteristics of the at least one spatially-dispersive element so that the spatial pattern of the output light beam matches the target spatial pattern therefor.
摘要翻译：提供了用于提供具有目标空间图案的输出光束的激光系统和方法。光产生模块产生输入光束，其光谱轮廓然后通过在其上施加可控相位调制而被调整。使用至少一个空间色散元件将获得的光谱定制的光束分散，以提供具有作为光谱定制的光束的光谱分布的函数的空间分布的输出光束。相位调制是根据输入光束的光谱分布和至少一个空间色散元件的色散特性，使得输出光束的空间图案与目标空间图案匹配。

30. 发明申请

US20090245301A1 LASER MICROMACHINING USING PROGRAMMABLE PULSE SHAPES 有权
标题翻译：使用可编程脉冲形状的激光微型计算机
公开(公告)号：US20090245301A1
公开(公告)日：2009-10-01
申请号：US12057264
申请日：2008-03-27
申请人： Xiaoyuan Peng , Brian W. Baird , William J. Jordens , David Martin Hemenway
发明人： Xiaoyuan Peng , Brian W. Baird , William J. Jordens , David Martin Hemenway
IPC分类号： H01S3/10 , H01S3/00
CPC分类号： H01S3/0057 , B23K26/0622 , G02F1/0327
摘要： Laser pulse shaping techniques produce tailored laser pulse spectral output. The laser pulses can be programmed to have desired pulse widths and pulse shapes (such as sub-nanosecond to 10 ns-20 ns pulse widths with 1 ns to several nanoseconds leading edge rise times). Preferred embodiments are implemented with one or more electro-optical modulators receiving drive signals that selectively change the amount of incident pulsed laser emission to form a tailored pulse output. Triggering the drive signal from the pulsed laser emission suppresses jitter associated with other stages of the link processing system and substantially removes jitter associated with pulsed laser emission build-up time.
摘要翻译：激光脉冲整形技术产生定制的激光脉冲光谱输出。激光脉冲可以被编程为具有期望的脉冲宽度和脉冲形状（例如，亚纳秒到10ns-20ns脉冲宽度，1ns至几纳秒前沿上升时间）。优选实施例是用一个或多个电光调制器来实现的，该电光调制器接收有选择地改变入射脉冲激光发射量的驱动信号以形成定制的脉冲输出。从脉冲激光发射器触发驱动信号抑制与链路处理系统的其他级相关联的抖动，并且基本上消除与脉冲激光发射建立时间相关联的抖动。

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