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21. 发明申请

US20070223167A1 ALUMINA SINTERED BODY 有权
标题翻译：铝氧化物烧结体
公开(公告)号：US20070223167A1
公开(公告)日：2007-09-27
申请号：US11688332
申请日：2007-03-20
申请人： Akiyoshi Hattori , Yutaka Mori , Kazuhiro Nobori
发明人： Akiyoshi Hattori , Yutaka Mori , Kazuhiro Nobori
IPC分类号： H02H9/06
CPC分类号： C04B35/101
摘要： An alumina sintered body comprises an alumina substrate having a first main surface and a second main surface opposing each other, an embedded film electrode made of a metal and embedded in the alumina substrate at a depth HD of 0.4 mm or less from a first main surface SF1, and an embedded terminal formed of a metal, embedded in the alumina substrate nearer a second main surface SF2 side than the embedded electrode. The embedded terminal is in contact with the embedded electrode and a film thickness HE of the embedded electrode is 25 μm or less.
摘要翻译：氧化铝烧结体包括具有彼此相对的第一主表面和第二主表面的氧化铝基体，由金属制成并嵌入氧化铝基底中的深度H D D为0.4的嵌入膜电极 mm以下的嵌入式端子，以及由金属构成的嵌入式端子，嵌入在氧化铝基板中，比嵌入的第二主表面SF2更靠近第二主表面SF2 电极。嵌入式端子与嵌入式电极接触，嵌入式电极的膜厚H E为25μm以下。

22. 发明申请

US20050056976A1 Method of manufacturing electrical resistance heating element 有权
标题翻译：制造电阻加热元件的方法
公开(公告)号：US20050056976A1
公开(公告)日：2005-03-17
申请号：US10903893
申请日：2004-07-30
申请人： Hiroto Matsuda , Kazuhiro Nobori , Yutaka Mori
发明人： Hiroto Matsuda , Kazuhiro Nobori , Yutaka Mori
IPC分类号： H05B3/20 , C04B35/00 , H01C17/065 , H01C17/28 , H01L21/00 , H01L21/02 , H01L21/68 , H01L21/683 , H05B3/10 , H05B3/12 , H05B3/14 , H05B3/18 , H05B3/74
CPC分类号： H01L21/67103 , H01C17/06513 , H01C17/288 , H01L21/6831 , Y10T29/49083 , Y10T29/49087 , Y10T29/49098 , Y10T29/49124 , Y10T29/49158 , Y10T29/49163
摘要： A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics, and forming a ceramic base material having mainly a high melting point metal on the electrode embedded therein, thereby forming a heating element with built-in electrode.
摘要翻译：电阻加热元件的制造方法包括：在烧结陶瓷或煅烧陶瓷上形成烧结陶瓷或煅烧陶瓷，形成电极，在其上嵌入的电极上形成主要具有高熔点金属的陶瓷基材，形成具有内置电极的加热元件。

23. 发明授权

US06603154B2 Semiconductor package and method of manufacturing semiconductor package 失效
标题翻译：半导体封装及半导体封装制造方法
公开(公告)号：US06603154B2
公开(公告)日：2003-08-05
申请号：US09814964
申请日：2001-03-23
申请人： Yoshinori Sakai , Kazuhiro Nobori , Kazuo Arisue
发明人： Yoshinori Sakai , Kazuhiro Nobori , Kazuo Arisue
IPC分类号： H01L23495
CPC分类号： H01L23/3121 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00015 , H01L2924/00012
摘要： A lower electrode of a semiconductor is directly connected to a heat sink, while a first electrode and a second electrode are connected to a plate-shaped second conductor by means of a first conductor. Radiated heat of the semiconductor is directly conducted to the heat sink and absorbed. The heat is radiated by being further conducted to the plate-shaped second conductor via the first conductor, thereby allowing the semiconductor to have a reduced temperature.
摘要翻译：半导体的下电极直接连接到散热器，而第一电极和第二电极通过第一导体连接到板状第二导体。半导体的辐射热直接传导到散热片并被吸收。通过经由第一导体进一步传导到板状第二导体而辐射热量，从而允许半导体具有降低的温度。

24. 发明申请

US20130141881A1 DISPLAY DEVICE 有权
标题翻译：显示设备
公开(公告)号：US20130141881A1
公开(公告)日：2013-06-06
申请号：US13702216
申请日：2011-04-11
申请人： Kazuhiro Nobori
发明人： Kazuhiro Nobori
IPC分类号： H05K7/00 , H05K13/00
CPC分类号： H05K7/00 , G02F1/13452 , H01L2924/0002 , H05K1/147 , H05K3/323 , H05K3/361 , H05K13/00 , H05K2201/045 , H05K2201/055 , H05K2201/09445 , Y10T29/49124 , H01L2924/00
摘要： In a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.
摘要翻译：在显示装置（100）中，在端子部（112）的连接面上形成有一排突出电极（115）和一排突出电极（116），一排突出电极（116）在一排突出电极（115）和显示部分（111）之间，柔性印刷电路板（150）的一端连接到一排突出电极（115），柔性印刷电路板（160）的一端）连接到所述突出电极（116）的行，所述突出电极（115）的行与所述突出电极（116）的行相邻，并且所述柔性印刷电路板（150）的一端和柔性印刷电路板（160）的一端彼此相对。

25. 发明授权

US08436253B2 Method of manufacturing mounting structure and mounting structure 有权
标题翻译：制造安装结构和安装结构的方法
公开(公告)号：US08436253B2
公开(公告)日：2013-05-07
申请号：US12992306
申请日：2009-03-23
申请人： Takayuki Higuchi , Yoshihiro Tomura , Kazuhiro Nobori , Kentaro Kumazawa
发明人： Takayuki Higuchi , Yoshihiro Tomura , Kazuhiro Nobori , Kentaro Kumazawa
IPC分类号： H05K1/00
CPC分类号： H05K3/305 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/32225 , H01L2224/731 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3011 , H05K2201/0187 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , H05K2203/1476 , Y02P70/613 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.
摘要翻译：提供一种安装结构，其包括电子部件; 电路板; 第一绝缘树脂和第二绝缘树脂，其被放置在电子部件和电路板之间用于密封; 在电子部件或电路基板上形成多个凸块; 连接到所述多个凸块的所述电路板或所述电子部件的多个对置电极; 和多个接合区域。多个连接区域由第二绝缘树脂形成，多个第一绝缘树脂区域设置在接合区域周围，使得接合区域被多个第一绝缘树脂区域夹持，第一绝缘树脂和第二绝缘树脂区域树脂各自含有填料，第二绝缘树脂的固化温度比第一绝缘树脂的固化温度高。

26. 发明授权

US08050049B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08050049B2
公开(公告)日：2011-11-01
申请号：US12427056
申请日：2009-04-21
申请人： Teppei Iwase , Kazuhiro Nobori , Yoshihiro Tomura , Koujiro Nakamura , Kentaro Kumazawa
发明人： Teppei Iwase , Kazuhiro Nobori , Yoshihiro Tomura , Koujiro Nakamura , Kentaro Kumazawa
IPC分类号： H05K7/00
CPC分类号： H05K1/181 , H05K3/284 , H05K3/305 , H05K2201/0133 , H05K2201/09036 , H05K2201/09909 , H05K2201/10674 , H05K2201/10977 , Y02P70/611
摘要： The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip 31 mounted on the top surface of the circuit board 2 overlaps with the semiconductor chip 32 mounted on the bottom surface of the circuit board 2, a recess portion 21 (or a protruding portion 22) is formed in the surfaces of the circuit board 2.
摘要翻译：本发明提供了一种双面安装结构的半导体器件，其包括在电路板的相对表面上布置和接合在一起的电路板和多个半导体芯片，其中在安装在电路板上的半导体芯片31的区域中电路板2的顶面与安装在电路基板2的底面的半导体芯片32重叠，在电路基板2的表面形成有凹部21（或突出部22）。

27. 发明授权

US07994638B2 Semiconductor chip and semiconductor device 失效
标题翻译：半导体芯片和半导体器件
公开(公告)号：US07994638B2
公开(公告)日：2011-08-09
申请号：US12531819
申请日：2008-05-09
申请人： Yoshihiro Tomura , Kazuhiro Nobori , Yuichiro Yamada , Kentaro Kumazawa , Teppei Iwase
发明人： Yoshihiro Tomura , Kazuhiro Nobori , Yuichiro Yamada , Kentaro Kumazawa , Teppei Iwase
IPC分类号： H01L23/488
CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L2224/02125 , H01L2224/0401 , H01L2224/05076 , H01L2224/05554 , H01L2224/05576 , H01L2224/05599 , H01L2224/1147 , H01L2224/11472 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/73204 , H01L2224/81001 , H01L2224/81191 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/00 , H01L2924/00012
摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.
摘要翻译：在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的导电状态。

28. 发明授权

US07848075B2 Electrostatic chuck with heater 有权
标题翻译：带加热器的静电吸盘
公开(公告)号：US07848075B2
公开(公告)日：2010-12-07
申请号：US11777318
申请日：2007-07-13
申请人： Kazuhiro Nobori , Tetsuya Kawajiri , Akiyoshi Hattori
发明人： Kazuhiro Nobori , Tetsuya Kawajiri , Akiyoshi Hattori
IPC分类号： H01L21/683
CPC分类号： H01L21/6831 , H01L21/68757
摘要： An electrostatic chuck with a heater including: a base which is composed of a sintered body containing alumina, an electrode disposed in an upper part of the base, and a resistance heating element embedded in a lower part of the base. The base includes a dielectric layer between the electrode and an upper surface of the base and a supporting member between the electrode and a lower surface of the base. The dielectric layer has a carbon content of not more than 100 ppm, and the supporting member has a carbon content of 0.03 to 0.25 wt %. Moreover, the resistance heating element is formed into a coil and mainly composed of niobium.
摘要翻译：一种具有加热器的静电卡盘，包括：由包含氧化铝的烧结体构成的基底，设置在基部的上部的电极和嵌入基座的下部的电阻加热元件。底座包括电极和基座的上表面之间的电介质层，以及在电极和底座的下表面之间的支撑构件。电介质层的碳含量不大于100ppm，并且支撑构件的碳含量为0.03-0.25重量％。此外，电阻加热元件形成为主要由铌构成的线圈。

29. 发明申请

US20100243635A1 CERAMIC HEATER AND METHOD FOR PRODUCING SAME 有权
标题翻译：陶瓷加热器及其生产方法
公开(公告)号：US20100243635A1
公开(公告)日：2010-09-30
申请号：US12732449
申请日：2010-03-26
申请人： Keiichi NAKAMURA , Kazuhiro Nobori
发明人： Keiichi NAKAMURA , Kazuhiro Nobori
IPC分类号： F23Q7/22
CPC分类号： F23Q7/22 , H05B3/143 , Y10T29/49083
摘要： A method for producing a ceramic heater includes performing firing at 1,600° C. to 1,750° C. in a state in which front and back surfaces of an inner shaped body 32 composed of low-temperature sinterable raw material powder containing aluminum nitride powder as a main component and 0.03% to 1% by weight of rare earth oxide powder are sandwiched between a pair of outer layers 30 composed of aluminum nitride sintered bodies having a volume resistivity of 1015 Ωcm or more through resistive heating elements 14 and 16 composed of metal meshes, thereby obtaining a ceramic heater 10.
摘要翻译：一种陶瓷加热器的制造方法，其特征在于，在由含有氮化铝粉末的低温可烧结原料粉末构成的内部构件32的正面和背面的状态下，在1600℃〜1750℃下进行烧成主成分和0.03〜1重量％的稀土类氧化物粉末通过电阻加热元件14和16由体积电阻率为1015Ω·cm-cm以上的氮化铝烧结体组成的一对外层30夹在金属网，从而获得陶瓷加热器10。

30. 发明授权

US07582367B2 Ceramic member and manufacturing method for the same 有权
标题翻译：陶瓷构件及其制造方法相同
公开(公告)号：US07582367B2
公开(公告)日：2009-09-01
申请号：US11236223
申请日：2005-09-27
申请人： Yasufumi Aihara , Hiroto Matsuda , Kazuhiro Nobori , Tsutomu Kato
发明人： Yasufumi Aihara , Hiroto Matsuda , Kazuhiro Nobori , Tsutomu Kato
IPC分类号： B32B18/00
CPC分类号： C04B35/117 , B32B18/00 , C04B35/119 , C04B35/505 , C04B35/5626 , C04B35/6365 , C04B35/645 , C04B37/001 , C04B37/005 , C04B2235/3217 , C04B2235/3225 , C04B2235/3246 , C04B2235/422 , C04B2235/5436 , C04B2235/5445 , C04B2235/604 , C04B2235/608 , C04B2235/6562 , C04B2235/6567 , C04B2235/77 , C04B2235/786 , C04B2235/96 , C04B2235/9661 , C04B2237/064 , C04B2237/34 , C04B2237/343
摘要： A ceramic member is provided including a base including an alumina sintered body, an yttria sintered body formed on the alumina sintered body, an intermediate layer including yttrium and aluminum formed between the alumina sintered body and the yttria sintered body, and a metallic member buried in the intermediate layer of the base. A difference between the thermal expansion coefficient of the alumina sintered body and that of the yttria sintered body is equal to or less than about 0.50×10−6/K, and the thermal expansion coefficient of the alumina sintered body is greater than the thermal expansion coefficient of the yttria sintered body. The alumina sintered body, the intermediate layer, the yttria sintered body, and the metallic member are formed into an integrated sintered body, and the content of yttria in the yttria sintered body is 99 wt % or more.
摘要翻译：提供一种陶瓷构件，其包括基底，其包括氧化铝烧结体，形成在氧化铝烧结体上的氧化钇烧结体，在氧化铝烧结体和氧化钇烧结体之间形成的包括钇和铝的中间层，以及埋入基底的中间层。氧化铝烧结体的热膨胀系数与氧化钇烧结体的热膨胀系数之差等于或小于约0.50×10 -6 / K，氧化铝烧结体的热膨胀系数大于热膨胀系数的氧化钇烧结体。氧化铝烧结体，中间层，氧化钇烧结体和金属构件形成为一体的烧结体，氧化钇烧结体中的氧化钇含量为99重量％以上。

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