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    • 24. 发明申请
    • Resist patterning process and manufacturing photo mask
    • 抗蚀剂图案化工艺和制造光罩
    • US20100009271A1
    • 2010-01-14
    • US12457544
    • 2009-06-15
    • Takanobu TakedaSatoshi WatanabeTamotsu WatanabeAkinobu TanakaKeiichi MasunagaRyuji Koitabashi
    • Takanobu TakedaSatoshi WatanabeTamotsu WatanabeAkinobu TanakaKeiichi MasunagaRyuji Koitabashi
    • G03F1/00G03F7/20
    • G03F7/0392
    • There is disclosed a resist patterning process with a minimum line width of 65 nanometers or less may be formed by using a resist composition containing a polymer, as a base polymer of a chemically-amplified resist composition, composed of a styrene unit whose hydroxyl group is protected by an acid labile group, and an indene unit, and/or an acenaphthalene unit, wherein the polymer has the weight-average molecular weight of 4,000 to 7,000, and in particular, 4,500 to 5,500. One of the currently existing problems to be solved is the line edge roughness. To solve this problem by an acid-generator and a basic compound, there is a problem of the trade-off relationship with a resolution power. There can be provided a resist composition having a high resolution containing a base polymer such as hydroxystyrene that is protected by an acid labile group, a resist patterning process with a pattern rule of 65 nanometers or less having a reduced line edge roughness.
    • 公开了通过使用包含聚合物的抗蚀剂组合物形成最小线宽度为65纳米或更小的抗蚀剂图案化工艺,所述抗蚀剂组合物作为化学增强抗蚀剂组合物的基础聚合物,其由羟基为 由酸不稳定基团和茚单元和/或苊单元保护,其中聚合物的重均分子量为4,000-7,000,特别是4,500-5,500。 目前存在的问题之一是线边缘粗糙度。 为了通过酸发生剂和碱性化合物来解决这个问题,存在与分辨能力的权衡关系的问题。 可以提供具有高分辨率的抗蚀剂组合物,其含有由酸不稳定基团保护的羟基苯乙烯的基础聚合物,具有减少的线边缘粗糙度的图案规则为65纳米或更小的抗蚀剂图案化工艺。
    • 26. 发明授权
    • Negative resist composition, patterning process, and testing process and preparation process of negative resist composition
    • 负性抗蚀剂组成,图案化工艺,负极抗蚀剂组成的测试工艺及制备工艺
    • US08557509B2
    • 2013-10-15
    • US12662435
    • 2010-04-16
    • Akinobu TanakaKeiichi MasunagaDaisuke DomonSatoshi Watanabe
    • Akinobu TanakaKeiichi MasunagaDaisuke DomonSatoshi Watanabe
    • G03F7/004G03F7/028G03F7/26
    • G03F7/0382G03F7/0045G03F7/30G03F7/322
    • There is disclosed a negative resist composition comprising at least (A) a base resin that is alkaline-soluble and is made alkaline-insoluble by action of an acid, and/or a combination of a base resin that is alkaline-soluble and is made alkaline-insoluble by reaction with a crosslinker by action of an acid, with a crosslinker, (B) an acid generator, and (C) a compound containing a nitrogen as a basic component, and forming a resist film having the film thickness X (nm) of 50 to 100 nm, wherein, in the case that the resist film is formed from the negative resist composition under the film-forming conditions for the pattern formation, a dissolution rate of the resist film into the alkaline developer used in the development treatment for the pattern formation is 0.0333X−1.0 (nm/second) or more and 0.0667X−1.6 (nm/second) or less. There can be a negative resist composition having excellent etching resistance and resolution and giving a good pattern profile even at the substrate's interface, a patterning process using the same, and a testing process and a preparation process of this negative resist composition.
    • 公开了一种负性抗蚀剂组合物,其至少包含(A)碱溶性碱性树脂,并且通过酸的作用而成为碱不溶性,和/或碱溶性碱性树脂的组合 通过与交联剂的反应,通过与交联剂的反应,(B)酸产生剂和(C)含有氮作为碱性成分的化合物,并且形成具有膜厚度X( nm)为50〜100nm,其中,在用于图案形成的成膜条件下,由抗蚀剂组合物形成抗蚀剂膜的情况下,抗蚀剂膜在显影剂中使用的碱性显影剂的溶解速度 图案形成的处理为0.0333X-1.0(nm /秒)以上且0.0667X-1.6(nm /秒)以下。 可以存在耐蚀性和分辨率优异的负光刻胶组合物,即使在基板的界面也能得到良好的图案图案,使用该抗蚀剂组合物的图案化工艺,以及该负型抗蚀剂组合物的测试方法和制备方法。
    • 27. 发明授权
    • Negative resist composition and patterning process using the same
    • 负光刻胶组合物和使用其的图案化工艺
    • US08361692B2
    • 2013-01-29
    • US12662763
    • 2010-05-03
    • Akinobu TanakaKeiichi MasunagaDaisuke DomonSatoshi Watanabe
    • Akinobu TanakaKeiichi MasunagaDaisuke DomonSatoshi Watanabe
    • G03F7/004G03F7/038G03F7/26
    • G03F7/0382
    • There is disclosed a negative resist composition comprising (A) a base polymer which is soluble in alkali and which is insolubilized in alkali by an action of an acid; and/or a combination of a crosslinking agent and a base polymer which is soluble in alkali and which is reacted with the crosslinking agent by an action of an acid to thereby be insolubilized in alkali, (B) an acid generator, and (C) a nitrogen-containing compound as a basic component; wherein the polymer to be used as the base polymer is: a polymer, which is obtained by polymerizing two or more kinds of monomers represented by the following general formula (1), or which is obtained by polymerizing a monomer mixture containing one or more kinds of monomers represented by the general formula (1) and one or more kinds of styrene monomers represented by the following general formula (2).
    • 公开了一种负型抗蚀剂组合物,其包含(A)可溶于碱的碱性聚合物,其通过酸的作用在碱中不溶解; 和/或交联剂和碱性聚合物的组合,其可溶于碱,并通过酸的作用与交联剂反应,从而不溶于碱,(B)酸产生剂,和(C) 作为碱性成分的含氮化合物; 其中用作基础聚合物的聚合物是:通过聚合由以下通式(1)表示的两种或更多种单体获得的聚合物,或通过使含有一种或多种的单体混合物 的由通式(1)表示的单体和一种或多种由以下通式(2)表示的苯乙烯单体。
    • 29. 发明授权
    • Chemically amplified positive resist composition and resist patterning process
    • 化学扩增正性抗蚀剂组合物和抗蚀剂图案化工艺
    • US08252518B2
    • 2012-08-28
    • US12591540
    • 2009-11-23
    • Akinobu TanakaTakanobu TakedaSatoshi Watanabe
    • Akinobu TanakaTakanobu TakedaSatoshi Watanabe
    • G03F7/039G03F7/20G03F7/30G03F7/09
    • G03F7/0395G03F7/0045G03F7/0392
    • There is disclosed a chemically amplified positive resist composition to form a chemically amplified resist film to be used in a lithography, wherein the chemically amplified positive resist composition comprises at least, (A) a base resin, insoluble or poorly soluble in an alkaline solution, having a repeating unit whose phenolic ydroxyl group is protected by a tertiary alkyl group, while soluble in an alkaline solution when the tertiary alkyl group is removed; (B) an acid generator; (C) a basic component; and (D) an organic solvent, and a solid component concentration is controlled so that the chemically amplified resist film having the film thickness of 10 to 100 nm is obtained by a spin coating method. There can be provided, in a lithography, a chemically amplified positive resist composition giving a high resolution with a suppressed LER deterioration caused by film-thinning at the time of forming a chemically amplified resist film with the film thickness of 10 to 100 nm, and a resist patterning process using the same.
    • 公开了一种化学放大的正性抗蚀剂组合物,以形成用于光刻的化学放大的抗蚀剂膜,其中化学放大的正性抗蚀剂组合物至少包含(A)不溶于或难溶于碱性溶液的基础树脂, 具有酚羟基被叔烷基保护的重复单元,当叔烷基被除去时可溶于碱性溶液; (B)酸发生剂; (C)基本组成部分; 和(D)有机溶剂,并且通过旋涂法获得固体成分浓度,从而得到膜厚为10〜100nm的化学放大型抗蚀剂膜。 在平版印刷法中,可以提供化学放大的正性抗蚀剂组合物,其在形成具有10至100nm的膜厚度的化学放大型抗蚀剂膜时产生具有抑制的由薄膜变薄引起的LER劣化的高分辨率,以及 使用其的抗蚀剂图案化工艺。
    • 30. 发明申请
    • Negative resist composition and patterning process using the same
    • 负光刻胶组合物和使用其的图案化工艺
    • US20100304301A1
    • 2010-12-02
    • US12662763
    • 2010-05-03
    • Akinobu TanakaKeiichi MasunagaDaisuke DomonSatoshi Watanabe
    • Akinobu TanakaKeiichi MasunagaDaisuke DomonSatoshi Watanabe
    • G03F7/004G03F7/20
    • G03F7/0382
    • There is disclosed a negative resist composition comprising (A) a base polymer which is soluble in alkali and which is insolubilized in alkali by an action of an acid; and/or a combination of a crosslinking agent and a base polymer which is soluble in alkali and which is reacted with the crosslinking agent by an action of an acid to thereby be insolubilized in alkali, (B) an acid generator, and (C) a nitrogen-containing compound as a basic component; wherein the polymer to be used as the base polymer is: a polymer, which is obtained by polymerizing two or more kinds of monomers represented by the following general formula (1), or which is obtained by polymerizing a monomer mixture containing one or more kinds of monomers represented by the general formula (1) and one or more kinds of styrene monomers represented by the following general formula (2).
    • 公开了一种负型抗蚀剂组合物,其包含(A)可溶于碱的碱性聚合物,其通过酸的作用在碱中不溶解; 和/或交联剂和碱性聚合物的组合,其可溶于碱,并通过酸的作用与交联剂反应,从而不溶于碱,(B)酸产生剂,和(C) 作为碱性成分的含氮化合物; 其中用作基础聚合物的聚合物是:通过聚合由以下通式(1)表示的两种或更多种单体获得的聚合物,或通过使含有一种或多种的单体混合物 的由通式(1)表示的单体和一种或多种由以下通式(2)表示的苯乙烯单体。