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    • 23. 发明申请
    • NONVOLATILE MEMORY AND MANUFACTURING METHOD THEREOF
    • 非易失性存储器及其制造方法
    • US20100052022A1
    • 2010-03-04
    • US12549163
    • 2009-08-27
    • Yoshinori Kumura
    • Yoshinori Kumura
    • H01L27/115H01L21/00H01L21/336
    • H01L27/11507H01L27/11509H01L28/55
    • According to an aspect of the present invention, there is provided a nonvolatile memory including: a cell transistor including: a gate electrode and first and second diffusion layers; a second insulating film covering the cell transistor; first and second plugs penetrating the second insulating film to reach the first and second diffusion layers, respectively; a ferroelectric capacitor having a ferroelectric film and first and second electrodes, the first electrode contacting with the first plug; a first conductive spacer contacting with the second plug and including the same material as the first electrode; a third insulating film covering side faces of the first electrode, the ferroelectric film and the first conductive spacer; and a first wiring that is continuously formed with the second electrode and connected to the first conductive spacer and that includes the same material as the second electrode.
    • 根据本发明的一个方面,提供了一种非易失性存储器,包括:单元晶体管,包括:栅电极和第一和第二扩散层; 覆盖单元晶体管的第二绝缘膜; 分别穿过第二绝缘膜的第一和第二插塞到达第一和第二扩散层; 具有铁电体膜的铁电电容器和第一和第二电极,所述第一电极与所述第一插塞接触; 与所述第二插头接触并且包括与所述第一电极相同的材料的第一导电间隔件; 覆盖第一电极,铁电体膜和第一导电间隔物的侧面的第三绝缘膜; 以及第一布线,其与第二电极连续地形成并且连接到第一导电间隔物并且包括与第二电极相同的材料。
    • 27. 发明授权
    • Non-volatile semiconductor memory device and method for fabricating the same
    • 非易失性半导体存储器件及其制造方法
    • US07573084B2
    • 2009-08-11
    • US11898949
    • 2007-09-18
    • Yoshinori KumuraTohru OzakiIwao Kunishima
    • Yoshinori KumuraTohru OzakiIwao Kunishima
    • H01L27/108
    • H01L27/11502H01L27/11507H01L28/57
    • According to an aspect of the present invention, there is provided a non-volatile semiconductor memory device, including a ferroelectric capacitor being stacked a first electrode, a ferroelectric film and a second electrode in order, a first protective film with hydrogen barrier performance, the first protective film being formed under the first electrode and on a side-wall of the ferroelectric capacitor, the first protective film being widened from the second electrode towards the first electrode, a second protective film with hydrogen barrier performance, the second protective film being formed over the second electrode and on the first protective film formed on the side-wall of the ferroelectric capacitor, the second protective film being widened from the first electrode towards the second electrode, a cell transistor, a source of the cell transistor being connected to the first electrode, a drain of the cell transistor being connected to a bit line and a gate being connected to a word line.
    • 根据本发明的一个方面,提供了一种非易失性半导体存储器件,包括堆叠第一电极,铁电体膜和第二电极的铁电电容器,具有氢阻挡性能的第一保护膜, 第一保护膜形成在第一电极下方和铁电电容器的侧壁上,第一保护膜从第二电极朝向第一电极加宽,具有氢阻挡性能的第二保护膜,形成第二保护膜 在第二电极上以及形成在铁电电容器的侧壁上的第一保护膜上,第二保护膜从第一电极朝向第二电极加宽,单元晶体管,单元晶体管的源极连接到 第一电极,单元晶体管的漏极连接到位线,栅极连接到aw ord行。
    • 28. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND FABRICATING METHOD FOR SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件的半导体存储器件和制造方法
    • US20090095993A1
    • 2009-04-16
    • US12244210
    • 2008-10-02
    • Tohru OzakiYoshinori Kumura
    • Tohru OzakiYoshinori Kumura
    • H01L27/115H01L21/8246
    • H01L27/11502H01L27/11507H01L28/57
    • According to an aspect of the present invention, there is provided a semiconductor memory device including a ferroelectric capacitor, including a semiconductor substrate, a transistor having diffusion layers being a source and a drain, the transistor being formed on a surface of the semiconductor substrate, a ferroelectric capacitor being formed over the transistor, the ferroelectric capacitor including a lower electrode, a ferroelectric film and an upper electrode stacked in order, an interlayer insulator separating between the transistor and the ferroelectric capacitor, a first contact plug being embedded in the interlayer insulator formed beneath the ferroelectric capacitor, the first contact plug directly connecting between one of the diffusion layers and the lower electrode, a first hydrogen barrier film covering the transistor a second hydrogen barrier film, a portion of the second hydrogen barrier film being formed on the first hydrogen barrier film, another portion of the second hydrogen barrier film covering at least the ferroelectric capacitor, and a second contact plug being embedded in the interlayer insulator, the second hydrogen barrier film and the first hydrogen barrier film, one end of the second contact plug connecting to the other of the diffusion layers.
    • 根据本发明的一个方面,提供了一种包括具有半导体衬底的铁电电容器,具有源极和漏极的扩散层的晶体管的半导体存储器件,晶体管形成在半导体衬底的表面上, 形成在晶体管上的强电介质电容器,所述强电介质电容器包括下电极,强电介质膜和依次堆叠的上电极,分隔在所述晶体管和所述铁电电容器之间的层间绝缘体,第一接触插塞嵌入所述层间绝缘体 形成在强电介质电容器下方的第一接触插塞,直接连接在一个扩散层和下电极之间的第一接触插塞,第一氢阻挡膜,覆盖晶体管第二氢阻挡膜,第二氢阻挡膜的一部分形成在第一 氢屏障膜,另一部分的secon d氢屏障膜,其至少覆盖所述铁电电容器,以及第二接触插塞,其被嵌入在所述层间绝缘体中,所述第二氢阻挡膜和所述第一氢阻挡膜,所述第二接触插塞的一端连接到所述扩散层中的另一个 。
    • 29. 发明申请
    • NON-VOLATILE MEMORY DEVICE
    • 非易失性存储器件
    • US20080230818A1
    • 2008-09-25
    • US12053137
    • 2008-03-21
    • Yoshinori KumuraTohru OzakiIwao Kunishima
    • Yoshinori KumuraTohru OzakiIwao Kunishima
    • H01L27/108H01L21/8242
    • H01L27/11502H01L27/11507H01L28/55
    • According to an aspect of the present invention, there is provided a non-volatile memory including: a transistor formed on a semiconductor substrate, the transistor including: two diffusion layers and a gate therebetween; a first insulating film formed on a top and a side surfaces of the gate; a first and a second contact plugs formed on corresponding one of the diffusion layers to contact the first insulating film; a ferroelectric capacitor formed on the first contact plug and on the first insulating film, the ferroelectric capacitor including: a first and a second electrodes and a ferroelectric film therebetween; a third contact plug formed on the second electrode; and a fourth contact plug formed on the second contact plug.
    • 根据本发明的一个方面,提供了一种非易失性存储器,包括:形成在半导体衬底上的晶体管,所述晶体管包括:两个扩散层和栅极; 形成在栅极的顶部和侧表面上的第一绝缘膜; 第一和第二接触塞形成在相应的一个扩散层上以接触第一绝缘膜; 形成在所述第一接触插塞和所述第一绝缘膜上的强电介质电容器,所述强电介质电容器包括:第一和第二电极及其间的铁电体膜; 形成在所述第二电极上的第三接触插塞; 以及形成在所述第二接触插塞上的第四接触插塞。
    • 30. 发明申请
    • Non-volatile semiconductor memory device and method for fabricating the same
    • 非易失性半导体存储器件及其制造方法
    • US20080073682A1
    • 2008-03-27
    • US11898949
    • 2007-09-18
    • Yoshinori KumuraTohru OzakiIwao Kunishima
    • Yoshinori KumuraTohru OzakiIwao Kunishima
    • H01L29/94H01L21/00
    • H01L27/11502H01L27/11507H01L28/57
    • According to an aspect of the present invention, there is provided a non-volatile semiconductor memory device, including a ferroelectric capacitor being stacked a first electrode, a ferroelectric film and a second electrode in order, a first protective film with hydrogen barrier performance, the first protective film being formed under the first electrode and on a side-wall of the ferroelectric capacitor, the first protective film being widened from the second electrode towards the first electrode, a second protective film with hydrogen barrier performance, the second protective film being formed over the second electrode and on the first protective film formed on the side-wall of the ferroelectric capacitor, the second protective film being widened from the first electrode towards the second electrode, a cell transistor, a source of the cell transistor being connected to the first electrode, a drain of the cell transistor being connected to a bit line and a gate being connected to a word line.
    • 根据本发明的一个方面,提供了一种非易失性半导体存储器件,包括堆叠第一电极,铁电体膜和第二电极的铁电电容器,具有氢阻挡性能的第一保护膜, 第一保护膜形成在第一电极下方和铁电电容器的侧壁上,第一保护膜从第二电极朝向第一电极加宽,具有氢阻挡性能的第二保护膜,形成第二保护膜 在第二电极上以及形成在铁电电容器的侧壁上的第一保护膜上,第二保护膜从第一电极朝向第二电极加宽,单元晶体管,单元晶体管的源极连接到 第一电极,单元晶体管的漏极连接到位线,栅极连接到aw ord行。