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21. 发明申请

US20180190430A1 Leadless Multi-Layered Ceramic Capacitor Stack 审中-公开
公开(公告)号：US20180190430A1
公开(公告)日：2018-07-05
申请号：US15909735
申请日：2018-03-01
申请人： KEMET Electronics Corporation
发明人： John E. McConnell , Garry L. Renner , John Bultitude , Allen Hill
IPC分类号： H01G4/228 , H01G4/12 , H01G4/008 , H01G4/38 , B23K1/00 , B23K1/005 , B23K1/008 , B23K1/20 , B23K35/36
CPC分类号： H01G4/228 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/3613 , B23K2101/40 , B23K2101/42 , H01G4/0085 , H01G4/12 , H01G4/2325 , H01G4/30 , H01G4/38 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00
摘要： A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

22. 发明授权

US09748043B2 Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors 有权
公开(公告)号：US09748043B2
公开(公告)日：2017-08-29
申请号：US13959995
申请日：2013-08-06
申请人： Kemet Electronics Corporation
发明人： Antony P. Chacko , John E. McConnell , Robert Ramsbottom , Philip M. Lessner , Randolph S. Hahn , John Bultitude
IPC分类号： H01G9/048 , H01G9/00 , H01G9/012 , H01G11/26 , H01G9/04 , H01G9/042
CPC分类号： H01G9/048 , H01G9/0029 , H01G9/012 , H01G9/04 , H01G9/0425 , H01G11/26 , Y10T29/417
摘要： A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.

23. 发明申请

US20170169955A1 Multiple MLCC Modules 有权
公开(公告)号：US20170169955A1
公开(公告)日：2017-06-15
申请号：US14963766
申请日：2015-12-09
申请人： Kemet Electronics Corporation
发明人： Galen W. Miller , John E. McConnell , John Bultitude , Garry L. Renner
IPC分类号： H01G4/38 , H01G4/224 , H01G4/228 , H01G4/30
CPC分类号： H01G4/38 , H01G2/106 , H01G4/224 , H01G4/228 , H01G4/232 , H01G4/30
摘要： An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.

24. 发明授权

US09472342B2 Leadless multi-layered ceramic capacitor stacks 有权
标题翻译：无铅多层陶瓷电容器堆叠
公开(公告)号：US09472342B2
公开(公告)日：2016-10-18
申请号：US13959954
申请日：2013-08-06
申请人： Kemet Electronics Corporation
发明人： John E. McConnell , Garry L. Renner , John Bultitude , Allen Hill
IPC分类号： H01G4/228 , H01G4/06 , B23K1/00 , B23K1/005 , B23K1/008 , B23K1/20 , B23K35/36 , B23K35/02 , H01G4/30 , H01G4/232 , H01G4/008 , H01G4/12 , H01G4/38
CPC分类号： H01G4/228 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/3613 , B23K2101/40 , B23K2101/42 , H01G4/0085 , H01G4/12 , H01G4/2325 , H01G4/30 , H01G4/38 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00
摘要： A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.
摘要翻译：提供堆叠的MLCC电容器，其中电容器堆叠包括多层陶瓷电容器，其中每个多层陶瓷电容器包括第一电极和交替堆叠的第二电极，每个第一电极和每个相邻的第二电极之间具有电介质。第一电极在第一侧和第二电极的第二侧终止。第一瞬态液相烧结导电层是第一侧并与每个第一电极电接触; 并且第二瞬态液相烧结导电层位于第二侧上并与每个第二电极电接触。

25. 发明授权

US09357634B2 Coefficient of thermal expansion compensating compliant component 有权
标题翻译：热膨胀系数适应元件
公开(公告)号：US09357634B2
公开(公告)日：2016-05-31
申请号：US13870414
申请日：2013-04-25
申请人： KEMET Electronics Corporation
发明人： John E. McConnell , Alan P. Webster , John Bultitude , Abhijit Gurav
IPC分类号： H05K7/04 , H01L23/49 , H05K1/02 , H05K3/30 , H01G4/38 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H05K1/18
CPC分类号： H05K1/0271 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H01G4/38 , H05K1/181 , H05K1/182 , H05K3/30 , H05K3/301 , H05K2201/049 , H05K2201/10015 , H05K2201/10454 , Y10T29/49121
摘要： An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
摘要翻译：描述了一种改进的离散电子设备和制造改进的分立电子设备的方法。分立的电子设备具有带终端和引线框架的电子无源部件。补偿兼容部件在终端和引线框架之间。补偿柔性部件具有复合芯和复合芯上的第一导体。第一个导线与端子电接触。第二导体也在复合芯上，其中第二导体与引线框架电接触。

26. 发明授权

US09087648B2 Asymmetric high voltage capacitor 有权
标题翻译：不对称高压电容器
公开(公告)号：US09087648B2
公开(公告)日：2015-07-21
申请号：US13849806
申请日：2013-03-25
申请人： Kemet Electronics Corporation
发明人： John Bultitude , Lonnie G. Jones , James R. Magee , Kitae Park
IPC分类号： H01G4/30 , H01G4/005 , H01G4/012 , H01G4/232
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232 , Y10T29/435
摘要： An improved multi-layered ceramic capacitor, and method of making the multi-layered ceramic capacitor, is described. The capacitor has an active area comprising first layers and second layers in alternating parallel arrangement with dielectric there between. The first layer comprises a first active electrode and a first floating electrode in a common plane and the second layer comprises a second active electrode and a second floating electrode in a second common plane. At least one shield layer is adjacent to an outermost first layer of the first layers wherein the shield layer has a first projection and the first layers have a second projection wherein the first projection and the second projection are different.
摘要翻译：描述了改进的多层陶瓷电容器以及制造多层陶瓷电容器的方法。电容器具有包括第一层和第二层的有源区域，其间以电介质交替并行布置。第一层包括公共平面中的第一有源电极和第一浮动电极，第二层包括第二共用平面中的第二有源电极和第二浮动电极。至少一个屏蔽层与第一层的最外面的第一层相邻，其中屏蔽层具有第一突起，并且第一层具有第二突起，其中第一突起和第二突起不同。

27. 发明申请

US20140232485A1 Discharge Capacitor 有权
标题翻译：放电电容器
公开(公告)号：US20140232485A1
公开(公告)日：2014-08-21
申请号：US14263130
申请日：2014-04-28
申请人： Kemet Electronics Corporation
发明人： John Bultitude , Mark R. Laps , Lonnie G. Jones
IPC分类号： H01G2/14 , H03H7/01
CPC分类号： H01G2/14 , H01G4/005 , H01G4/232 , H01G4/30 , H03H7/0115
摘要： A discharge capacitor for use in electronic circuits is described. The discharge capacitor has first internal electrodes in electrical contact with a first external termination and second internal electrodes parallel to and interleaved with the first internal electrodes wherein the second internal electrodes are in electrical contact with a second external termination. A dielectric is between the first internal electrodes and adjacent second internal electrodes. A first discharge gap is between at least one first internal electrode of said first internal electrodes and said second external termination.
摘要翻译：描述了用于电子电路的放电电容器。放电电容器具有与第一外部端子电连接的第一内部电极和与第一内部电极平行并交错的第二内部电极，其中第二内部电极与第二外部端子电接触。电介质位于第一内部电极和相邻的第二内部电极之间。第一放电间隙在所述第一内部电极的至少一个第一内部电极和所述第二外部端子之间。

28. 发明申请

US20210227693A1 Component Assemblies and Embedding for High Density Electronics 有权
公开(公告)号：US20210227693A1
公开(公告)日：2021-07-22
申请号：US17147908
申请日：2021-01-13
申请人： KEMET Electronics Corporation
发明人： John Bultitude , Peter Alexandre Blais , James A. Burk , Galen W. Miller , Hunter Hayes , Allen Templeton , Lonnie G. Jones , Mark R. Laps
IPC分类号： H05K1/18 , H01G4/38 , H05K1/14 , H05K1/02 , H05K3/32
摘要： Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

29. 发明授权

US10757811B2 Higher density multi-component and serial packages 有权
公开(公告)号：US10757811B2
公开(公告)日：2020-08-25
申请号：US16212156
申请日：2018-12-06
申请人： KEMET Electronics Corporation
发明人： James A. Burk , John Bultitude , Galen W. Miller
IPC分类号： H05K3/00 , H05K1/18 , H01G4/30 , H03H7/01 , H05K1/02 , H05K3/30 , H01G4/228 , H01G4/232 , H01G4/38 , H05K3/34
摘要： A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.

30. 发明授权

US10729051B2 Component stability structure 有权
公开(公告)号：US10729051B2
公开(公告)日：2020-07-28
申请号：US15187451
申请日：2016-06-20
申请人： KEMET Electronics Corporation
发明人： John E. McConnell , John Bultitude
IPC分类号： H05K13/04 , H05K3/30 , H05K7/12 , H01G4/232 , H01C1/01 , H01G2/06 , H01C13/02 , H01G4/38 , H01C1/14 , H05K3/34 , H05K1/02 , H01G4/30 , H01C7/00
摘要： An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

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