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21. 发明授权

US06298678B1 Window-type air conditioner 有权
标题翻译：窗式空调
公开(公告)号：US06298678B1
公开(公告)日：2001-10-09
申请号：US09543158
申请日：2000-04-04
申请人： Jung-Ho Kim
发明人： Jung-Ho Kim
IPC分类号： F25D2312
CPC分类号： F24F1/027 , F24F13/224
摘要： An improved window-type air conditioner for easy installation includes: a main unit having a base plate on which heavy components of the air conditioner, such as a compressor, and indoor and outdoor heat-exchangers, are mounted; a cabinet for receiving the main unit through an opening in the front side thereof; and an inclination section for maintaining a predetermined downward inclination of the main unit in the cabinet. The inclination section includes at least two guide rails formed on a bottom of the cabinet at a predetermined downward inclination toward the outside for supporting the lower side of the base plate.
摘要翻译：一种易于安装的改进的窗式空调器包括：具有底板的主单元，其上安装有诸如压缩机的空调的重组件，以及室内和室外热交换器; 用于通过其前侧的开口接收主机的机柜; 以及用于保持主机在机柜中的预定向下倾斜的倾斜部分。倾斜部包括形成在机壳的底部上的至少两个导轨，以预定的向下倾斜的方式朝向外部支撑底板的下侧。

22. 发明授权

US08615564B2 Method and system for channel scanning in a mesh network 有权
标题翻译：网状网络中信道扫描的方法和系统
公开(公告)号：US08615564B2
公开(公告)日：2013-12-24
申请号：US11432384
申请日：2006-05-12
申请人： Jung-Ho Kim , Young-Gon Choi , Ji-Hoon Lee , Yong-Sung Roh , Jae-Hoon Kim , Shubhranshu Singh
发明人： Jung-Ho Kim , Young-Gon Choi , Ji-Hoon Lee , Yong-Sung Roh , Jae-Hoon Kim , Shubhranshu Singh
IPC分类号： G06F15/16
CPC分类号： H04W48/08 , H04W8/005 , H04W84/22
摘要： A channel scanning method and system at an MP within a mesh network associated with a local network are provided. A MAP sends a local management frame including information about a mesh network on an allocated local channel and sends a mesh management frame on a mesh channel indicated by the mesh network information. An MP scans a plurality of channels including the local channel and the mesh channel in an order of channels numbers, receives the local management frame by scanning the local channel, and receives the mesh management frame by scanning the mesh channel based on the mesh network information of the local management frame.
摘要翻译：提供了与本地网络相关联的网状网络内的MP处的信道扫描方法和系统。 MAP在分配的本地信道上发送包括网状网络信息的本地管理帧，并在网状网络信息指示的网孔上发送网状管理帧。 MP以信道号顺序扫描包括本地信道和网状信道的多个信道，通过扫描本地信道接收本地管理帧，并且基于网状网络信息扫描网格信道来接收网格管理帧的本地管理框架。

23. 发明授权

US08445317B2 Methods of fabricating semiconductor devices 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08445317B2
公开(公告)日：2013-05-21
申请号：US13030454
申请日：2011-02-18
申请人： Jin Ha Jeong , Jung-Ho Kim , Kihyun Hwang , Yong-Hoon Son
发明人： Jin Ha Jeong , Jung-Ho Kim , Kihyun Hwang , Yong-Hoon Son
IPC分类号： H01L21/84
CPC分类号： H01L27/11578 , H01L27/11582 , H01L29/42352 , H01L29/4236 , H01L29/66666 , H01L29/66833 , H01L29/7827 , H01L29/7926
摘要： Methods for fabricating a semiconductor device are provided. In the methods, first material layers and second material layers may be alternatingly and repeatedly stacked on a substrate. An opening penetrating the first material layers and the second material layers may be formed. A semiconductor solution may be formed in the opening by using a spin-on process.
摘要翻译：提供了制造半导体器件的方法。在这些方法中，第一材料层和第二材料层可以交替地和重复堆叠在基底上。可以形成贯穿第一材料层和第二材料层的开口。可以通过使用旋涂工艺在开口中形成半导体溶液。

24. 发明授权

US08217668B2 Method for evaluation of the ground reinforcement effect using 4-D electrical resistivity monitoring 有权
标题翻译：使用4-D电阻率监测评估地面加固效果的方法
公开(公告)号：US08217668B2
公开(公告)日：2012-07-10
申请号：US12518024
申请日：2009-03-27
申请人： Sam-Gyu Park , Jung-Ho Kim , Myeung-Jong Yi , Seong-Jun Cho
发明人： Sam-Gyu Park , Jung-Ho Kim , Myeung-Jong Yi , Seong-Jun Cho
IPC分类号： G01R27/08 , G01V3/00
CPC分类号： E02D1/08 , E02D1/02 , E02D33/00
摘要： Disclosed is a method of evaluating a ground reinforcement effect using 4-D electrical resistivity monitoring, wherein the ground reinforcement is made up on an underground cavity through cement mortar grouting, the method including: (a) installing a survey line for measuring electrical resistivity in a ground reinforcement zone; (b) measuring the electrical resistivity of the ground reinforcement zone through the survey line before grouting mortar, and imaging three-dimensional electrical resistivity distribution in the ground reinforcement zone by applying a three-dimensional electrical resistivity inversion to the measured results; (c) measuring the electrical resistivity of the ground reinforcement zone through the survey line while or after grouting the mortar, and imaging the three-dimensional electrical resistivity distribution in the ground reinforcement zone by applying the three-dimensional electrical resistivity inversion to the measured results; and (d) calculating a change ratio of the electrical resistivity measured while or after the grouting in (c) to the electrical resistivity measured before the grouting in (b), and evaluating the ground reinforcement effect by imaging the three-dimensional electrical resistivity distribution in the ground reinforcement zone on the basis of the change ratio.
摘要翻译：本发明公开了一种使用4-D电阻率监测来评估地面加固效果的方法，其中通过水泥砂浆灌浆在地下空腔上形成地面加固，该方法包括：（a）安装用于测量电阻率的测量线地面加固区; （b）在灌浆砂浆前测量地面加固区的电阻率，并通过对测量结果应用三维电阻率反演，对地面加固区的三维电阻率分布进行成像; （c）在灌浆砂浆之前或之后通过测量线测量地面加固区域的电阻率，并通过对测量结果应用三维电阻率反演来对地面加固区域中的三维电阻率分布进行成像 ; 和（d）计算在（c）中的灌浆期间或之后测量的电阻率与（b）中的灌浆之前测量的电阻率之间测量的电阻率的变化率，并且通过对三维电阻率分布进行成像来评估地面强化效应在地面加筋区的变化比例的基础上。

25. 发明授权

US08004295B2 Electrical specific resistivity probing robot 有权
标题翻译：电阻率探测机器人
公开(公告)号：US08004295B2
公开(公告)日：2011-08-23
申请号：US12280433
申请日：2007-10-11
申请人： Seong-Jun Cho , Jung-Ho Kim
发明人： Seong-Jun Cho , Jung-Ho Kim
IPC分类号： G01R27/08 , G01R31/02 , G01V3/00
CPC分类号： B25J5/005 , B25J13/087 , G01V3/15
摘要： An electrical specific resistivity probing robot is directed to automatically measuring a three-dimensional electrical specific resistivity structure of an underground shallow region by installing a plurality of probing electrodes at regular intervals along a robot-moving caterpillar to measure difference of potentials of the electrodes at a ground plane. The electrical specific resistivity probing robot includes a frame, a driving member installed under the frame, a pair of insulating caterpillars installed to both sides of a lower portion of the frame and driven by the driving member, a plurality of probing electrodes installed along track circumferences of the caterpillars at regular intervals, a slip ring electrically slip-connected to the probing electrodes one by one, and a cable electrically connected to the slip ring.
摘要翻译：电气电阻率探测机器人通过沿着机器人运动的毛毛虫以规则的间隔安装多个探测电极，来自动测量地下浅区域的三维电阻率结构，以测量电极的电位差地面飞机电阻率探测机器人包括框架，安装在框架下方的驱动构件，一对安装在框架下部两侧并由驱动构件驱动的绝缘毛虫，沿轨道周边安装的多个探测电极的毛毛虫，一个一个接一个地电触滑地连接到探测电极的滑环，以及电连接到滑环的电缆。

26. 发明授权

US07835332B2 Method and apparatus for scheduling in WLAN mesh communication system 有权
标题翻译： WLAN网状通信系统调度方法与装置
公开(公告)号：US07835332B2
公开(公告)日：2010-11-16
申请号：US11432665
申请日：2006-05-12
申请人： Jae-Hoon Kim , Young-Gon Choi , Jung-Ho Kim , Ji-Hoon Lee , Shubhranshu Singh , Yong-Sung Roh
发明人： Jae-Hoon Kim , Young-Gon Choi , Jung-Ho Kim , Ji-Hoon Lee , Shubhranshu Singh , Yong-Sung Roh
IPC分类号： H04W4/00 , H04L12/26
CPC分类号： H04W48/12 , H04W8/005 , H04W84/12 , H04W92/20
摘要： A method and apparatus for scheduling in a Wireless Local Area Network (WLAN) mesh communication system including a plurality of Mesh Access Points (MAPs) are provided, in which, when a message to be transmitted from a first MAP of the MAPs to MAPs adjacent to first MAP is generated, setting a first interval for transmitting the generated message during a predetermined period, and setting a remaining interval excluding the first interval during the predetermined period as a second interval for receiving messages from the adjacent MAPs.
摘要翻译：提供了一种用于在包括多个网状接入点（MAP）的无线局域网（WLAN）网状通信系统中进行调度的方法和装置，其中当要从MAP的第一MAP到邻近的MAP发送的消息生成第一MAP，在预定时段内设置用于发送所生成的消息的第一间隔，并且在预定周期期间将除了第一间隔之外的剩余间隔设置为用于从相邻MAP接收消息的第二间隔。

27. 发明申请

US20100109164A1 STACKED INTEGRATED CIRCUIT PACKAGE FABRICATION METHODS THAT USE VIAS FORMED AND FILLED AFTER STACKING, AND RELATED STACKED INTEGRATED CIRCUIT PACKAGE STRUCTURES 有权
标题翻译：堆叠集成电路包装制造方法，堆叠后形成和填充的堆叠集成电路，以及相关的堆叠集成电路封装结构
公开(公告)号：US20100109164A1
公开(公告)日：2010-05-06
申请号：US12606799
申请日：2009-10-27
申请人： Pil-kyu Kang , Jung-Ho Kim , Jong-Wook Lee , Seung-woo Choi , Dae-Lok Bae
发明人： Pil-kyu Kang , Jung-Ho Kim , Jong-Wook Lee , Seung-woo Choi , Dae-Lok Bae
IPC分类号： H01L23/522 , H01L21/50 , H01L25/04
CPC分类号： H01L23/481 , H01L21/76898 , H01L24/25 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2221/68359 , H01L2221/68377 , H01L2224/0401 , H01L2224/05009 , H01L2224/13009 , H01L2224/16145 , H01L2224/16225 , H01L2224/24145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/83894 , H01L2224/9202 , H01L2225/06541 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic packages are fabricated by stacking integrated circuits upon one another. Each integrated circuit includes a semiconductor layer having microelectronic devices and a wiring layer on the semiconductor layer having wiring that selectively interconnects the microelectronic devices. After stacking, a via is formed that extends through at least two of the integrated circuits that are stacked upon one another. Then, the via is filled with conductive material that selectively electrically contacts the wiring. Related microelectronic packages arc also described.
摘要翻译：微电子封装通过彼此堆叠集成电路制造。每个集成电路包括具有微电子器件的半导体层和在半导体层上具有有选择性地互连微电子器件的布线的布线层。在堆叠之后，形成延伸通过彼此堆叠的至少两个集成电路的通孔。然后，通孔被选择性地电接触布线的导电材料填充。还描述了相关的微电子封装。

28. 发明授权

US07599343B2 Method for transmitting and receiving beacon information in wireless LAN mesh network 有权
标题翻译：用于在无线LAN网状网络中发送和接收信标信息的方法
公开(公告)号：US07599343B2
公开(公告)日：2009-10-06
申请号：US11516669
申请日：2006-09-07
申请人： Jae-Hoon Kim , Ji-Hoon Lee , Young-Gon Choi , Jung-Ho Kim
发明人： Jae-Hoon Kim , Ji-Hoon Lee , Young-Gon Choi , Jung-Ho Kim
IPC分类号： H04J3/06
CPC分类号： H04B7/26 , H04W56/00
摘要： Provided is a method for transmitting beacon timing information from a transmission node in a wireless Local Area Network (LAN) mesh network. In the method, each of a plurality of nodes transmits a beacon signal with its unique offset within a beacon signal transmission time period and the transmission node periodically transmits beacon timing information including a first unique offset within the beacon signal transmission time period. The transmission node sets a second offset different from the first offset and transmits probe beacon timing information including the first offset and the second offset.
摘要翻译：提供了一种用于从无线局域网（LAN）网状网络中的传输节点发送信标定时信息的方法。在该方法中，多个节点中的每个节点在信标信号传输时间周期内发射具有其唯一偏移量的信标信号，并且传输节点周期性地发送包括信标信号传输时间段内的第一唯一偏移量的信标定时信息。发送节点设置与第一偏移不同的第二偏移，并发送包括第一偏移和第二偏移的探测信标定时信息。

29. 发明申请

US20090221133A1 Methods of Fabricating Silicon on Insulator (SOI) Wafers 审中-公开
标题翻译：在绝缘体（SOI）晶片上制造硅的方法
公开(公告)号：US20090221133A1
公开(公告)日：2009-09-03
申请号：US12370783
申请日：2009-02-13
申请人： Seung-Woo Choi , Dae-Lok Bae , Jong-Wook Lee , Yong-Won Cha , Pil-Kyu Kang , Jung-Ho Kim
发明人： Seung-Woo Choi , Dae-Lok Bae , Jong-Wook Lee , Yong-Won Cha , Pil-Kyu Kang , Jung-Ho Kim
IPC分类号： H01L21/762
CPC分类号： H01L21/76254
摘要： Methods of fabricating SOI wafers are provided including providing a donor wafer and forming a hydrogen ion implantation layer in the donor wafer. A circumference portion of one side of the donor wafer is recessed to form a height difference. The one side of the donor wafer and a handle wafer are bonded to form a bonded wafer. The bonded wafer is heat treated to separate the bonded wafer along the hydrogen ion implantation layer.
摘要翻译：提供制造SOI晶片的方法包括提供施主晶片并在施主晶片中形成氢离子注入层。供体晶片的一侧的周边部分被凹入以形成高度差。供体晶片和处理晶片的一侧被结合以形成接合晶片。接合的晶片被热处理以沿着氢离子注入层分离键合的晶片。

30. 发明申请

US20090085716A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090085716A1
公开(公告)日：2009-04-02
申请号：US12241114
申请日：2008-09-30
申请人： Jung-Ho Kim
发明人： Jung-Ho Kim
IPC分类号： H01C1/14 , H01C17/28 , H01L21/60
CPC分类号： H01C7/006 , H01C1/14 , H01C17/06513 , H01C17/288 , H01L23/5228 , H01L24/03 , H01L24/05 , H01L2924/14 , H01L2924/19043 , Y10T29/49101
摘要： A semiconductor device and a method for manufacturing the same that includes terminal patterns and resistor patterns disposed between and electrically connected to the terminal patterns. The resistor patterns have an electrical resistance higher than the electrical resistance of the terminal patterns and also have a width greater than a width of the terminal patterns
摘要翻译：一种半导体器件及其制造方法，其包括设置在端子图案之间并电连接到端子图案的端子图案和电阻图案。电阻图案具有高于端子图案的电阻的电阻，并且还具有大于端子图案的宽度的宽度

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