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    • 21. 发明授权
    • Substrate, substrate adapted for interconnecting optical elements and optical module
    • 基板,适用于互连光学元件的基板和光学模块
    • US07519243B2
    • 2009-04-14
    • US11017811
    • 2004-12-22
    • Koji TeradaJun MatsuiHiroyuki Nobuhara
    • Koji TeradaJun MatsuiHiroyuki Nobuhara
    • G02B6/12
    • G02B6/4202G02B6/4221
    • The present invention provides substrate 10, capable of transmitting lights in thickness direction for enhancing usefulness of the substrate. Its object is to provide a substrate adapted for interconnecting optical elements, allowing reduction of number of components leading to miniaturization and low cost, and high-efficient and stable optical coupling leading to low electric power dissipation. To accomplish the object the substrate comprises substrate body, wherein it is comprised of electric wiring layer disposed on first substrate body surface in such a manner as to be capable of electrically connecting first optical element mounted on the side of first substrate body surface; and optical transmission path, propagating lights being transmitted and received between first optical element electrically connected at electric wiring layer and second optical element disposed on the side of second substrate body surface different from first substrate body surface in substrate body.
    • 本发明提供了能够在厚度方向上透过光以提高基板的有用性的基板10。 其目的是提供适于互连光学元件的基板,从而减少导致小型化和低成本的部件的数量,以及导致低功耗的高效且稳定的光耦合。 为了实现该目的,衬底包括衬底主体,其中它包括设置在第一衬底主体表面上的电布线层,以便能够电连接安装在第一衬底主体表面侧上的第一光学元件; 以及光传输路径,在电配线层电连接的第一光学元件与设置在第二基板主体表面的与衬底本体中的第一衬底主体表面不同的一侧的第二光学元件之间传播和接收传播光。
    • 24. 发明授权
    • Release mechanism for electronic device unit and disk array device
    • 电子设备单元和磁盘阵列设备的释放机制
    • US08363395B2
    • 2013-01-29
    • US12903130
    • 2010-10-12
    • Jun Matsui
    • Jun Matsui
    • G06F1/16
    • G11B33/128
    • The release mechanism includes a guide body adapted to support a guide wall of the electronic device unit, and a locking mechanism adapted to lock the electronic device unit supported on the guide body. The locking mechanism includes an elastic piece projecting in cantilever fashion from an end of the guide body, an operating projection that projects from the elastic piece, and an engaging protrusion that protrudes from the elastic piece and that is adapted to intrude into a screw hole in the electronic device unit to thereby restrict sliding of the electronic device unit. The operating projection is formed with larger size than the engaging protrusion so that under conditions of induced flexure of the elastic piece the engaging protrusion disengages from the screw hole, and during sliding of the electronic device unit does not contact the guide wall.
    • 释放机构包括适于支撑电子设备单元的引导壁的引导体,以及适于锁定支撑在引导体上的电子设备单元的锁定机构。 锁定机构包括从引导体的端部以悬臂方式突出的弹性件,从弹性件突出的操作突起和从弹性件突出并且适于插入到螺钉孔中的接合突起 电子设备单元,从而限制电子设备单元的滑动。 操作突起形成为具有比接合突起更大的尺寸,使得在弹性片的感应挠曲的条件下,接合突起与螺钉孔脱离,并且在电子设备单元的滑动期间不接触引导壁。
    • 26. 发明申请
    • STRUCTURE OF MOUNTING ELECTRONIC DEVICE INTO HOUSING
    • 安装电子设备到外壳的结构
    • US20090219680A1
    • 2009-09-03
    • US12396867
    • 2009-03-03
    • Tomoaki KOUYAMAJun Matsui
    • Tomoaki KOUYAMAJun Matsui
    • H05K5/00
    • G11B33/124
    • In a structure of mounting an electronic device into a housing according to the present invention, the electronic device has the following structure. First and second storage devices are connected to respective connecting parts provided on a substrate. Convex portions provided on a first supporting member are fitted from above into a gap between the first storage device and the substrate and a gap between the second storage device and the substrate, respectively. Convex portions provided on a second supporting member are fitted from below into the gap between the first storage device and the substrate and the gap between the second storage device and the substrate, respectively. The electronic device into which the first and second supporting members are fitted is inserted into the housing from an opening thereof, and fixed within the housing by the housing and a cover.
    • 在根据本发明的将电子设备安装到外壳中的结构中,电子设备具有以下结构。 第一和第二存储装置连接到设置在基板上的各个连接部分。 设置在第一支撑构件上的凸部分别从上方装配到第一存储装置和基板之间的间隙以及第二存储装置和基板之间的间隙。 设置在第二支撑构件上的凸部从下方配合到第一存储装置和基板之间的间隙以及第二存储装置与基板之间的间隙。 将第一和第二支撑构件装配到其中的电子装置从其开口插入壳体中,并且通过壳体和盖子固定在壳体内。