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21. 发明授权

US08769706B2 System and method for user to verify a network resource address is trusted 有权
标题翻译：用户验证网络资源地址的系统和方法是可信的
公开(公告)号：US08769706B2
公开(公告)日：2014-07-01
申请号：US11828619
申请日：2007-07-26
申请人： Hong Deng , Jodi E. Everdon , Colette A. Manoni , Renata Rand McFadden , Jennifer A. Thompson
发明人： Hong Deng , Jodi E. Everdon , Colette A. Manoni , Renata Rand McFadden , Jennifer A. Thompson
IPC分类号： G06F7/04
CPC分类号： H04L63/126 , H04L61/3015 , H04L63/1441 , H04L63/1483
摘要： A system, method and computer program product for a user to verify that a network resource address is trusted. At least one entity registration is stored at a server. Each entity registration comprises an identity of an entity and entity addressing information associated with the identity of the entity. The existence of at least one entity whose identity is included in the at least one entity registration is confirmed. A query comprising a target addressing information is received from a client. If the target addressing information matches the entity addressing information, the identity of the entity associated with the entity addressing information is determined and a result comprising the identity of the entity associated with the entity addressing information matching the target addressing information is transmitted to the client. If no entity addressing information matches the target addressing information, an indication of such is transmitted to the client.
摘要翻译：用于用户验证网络资源地址被信任的系统，方法和计算机程序产品。至少一个实体注册被存储在服务器上。每个实体注册包括与实体的身份相关联的实体和实体寻址信息的身份。确认至少一个实体的身份被包含在至少一个实体注册中的存在。从客户端接收包括目标寻址信息的查询。如果目标寻址信息与实体寻址信息匹配，则确定与实体寻址信息相关联的实体的身份，并且将包含与实际寻址信息匹配的实体寻址信息相关联的实体的身份的结果发送给客户端。如果没有实体寻址信息与目标寻址信息匹配，则向客户端发送这样的指示。

22. 发明授权

US07964297B2 Adhesion layer for thin film magnetic recording medium 有权
标题翻译：薄膜磁记录介质粘合层
公开(公告)号：US07964297B2
公开(公告)日：2011-06-21
申请号：US12653216
申请日：2009-12-09
申请人： Hong Deng , Yoshihiro Ikeda , Mary Frances Minardi , Kentaro Takano , Kai Tang
发明人： Hong Deng , Yoshihiro Ikeda , Mary Frances Minardi , Kentaro Takano , Kai Tang
IPC分类号： G11B5/127 , G11B5/71
CPC分类号： G11B5/667 , G11B5/7325
摘要： The invention uses an adhesion layer of an amorphous alloy of aluminum. A first aluminum titanium embodiment of the amorphous adhesion layer preferably contains approximately equal amounts of aluminum and titanium (+/−5 at. %). A second embodiment of the amorphous adhesion layer preferably contains approximately equal amounts of aluminum and titanium (+/−5 at. %) and up to 10 at. % Zr with 5 at. % Zr being preferred. A third embodiment is aluminum tantalum preferably including from 15 to 25 at. % tantalum with 20 at. % being preferred. The most preferred compositions are Al50Ti50, Al47.5Ti47.5Zr5 or Al80Ta20. The adhesion layer is deposited onto the substrate. The substrate can be glass or a metal such as NiP-plated AlMg. The preferred embodiment of media according to the invention is for perpendicular recording and includes a magnetically soft underlayer deposited above the adhesion layer.
摘要翻译：本发明使用铝非晶合金的粘合层。无定形粘合层的第一铝钛实施例优选含有大约相等量的铝和钛（+/- 5原子％）。无定形粘合层的第二个实施方案优选含有大约相等量的铝和钛（+/- 5原子％）和至多10原子。％Zr，5 at。％Zr是优选的。第三实施例是铝钽，优选包括15至25at。 20％钽。％是首选。最优选的组合物是Al 50 Ti 50，Al 47.5 Ti 47.5 Zr 5或Al 80 T a 20。粘附层沉积在基底上。基底可以是玻璃或诸如NiP镀AlMg的金属。根据本发明的介质的优选实施例是用于垂直记录，并且包括沉积在粘附层上方的磁软底层。

23. 发明申请

US20090110962A1 SYSTEM, METHOD AND APPARATUS FOR ELIMINATING ADHESION LAYERS BETWEEN SUBSTRATES AND SOFT UNDERLAYERS IN PERPENDICULAR MEDIA 审中-公开
标题翻译：衬底和软底层粘结层之间消除粘结层的系统，方法和装置
公开(公告)号：US20090110962A1
公开(公告)日：2009-04-30
申请号：US11930449
申请日：2007-10-31
申请人： Hong Deng , Yoshihiro Ikeda
发明人： Hong Deng , Yoshihiro Ikeda
IPC分类号： G11B5/62 , B05D1/36 , G11B5/82 , B32B7/00
CPC分类号： G11B5/667 , G11B5/7325 , Y10T428/24
摘要： A perpendicular media is formed without an adhesion layer between the substrate and soft underlayer (SUL) to reduce the cost of fabrication. The thickness of the SUL is reduced to less than 50 nm to increase the film adhesion strength between the substrate and SUL. The perpendicular media comprises only a substrate, the SUL, an exchange break layer, a recording layer, and a protective overcoat.
摘要翻译：在基板和软底层（SUL）之间形成没有粘附层的垂直介质，以降低制造成本。 SUL的厚度减小到小于50nm，以增加基板和SUL之间的膜粘附强度。垂直介质仅包括基底，SUL，交换断裂层，记录层和保护性外涂层。

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