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21. 发明申请

US20130178092A1 IMPLEMENTING ENHANCED DIMENSIONAL STABILITY WITH GRAPHITE NANOTUBE HYBRID SOCKET 有权
标题翻译：用石墨纳米管混合插座实现增强的尺寸稳定性
公开(公告)号：US20130178092A1
公开(公告)日：2013-07-11
申请号：US13346986
申请日：2012-01-10
申请人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
发明人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H01R13/40 , B82Y99/00 , B82Y30/00
CPC分类号： H05K7/1069 , B82Y30/00
摘要： A method and structure for implementing enhanced dimensional stability with a graphite nanotube hybrid socket. A socket housing wall includes a plurality of aligned graphite nanofibers. The plurality of aligned graphite nanofibers distributing heat and providing enhanced dimensional stability. For example, the plurality of aligned graphite nanofibers more evenly distributes heat when the socket is undergoing solder reflow processes, thereby reducing strain.
摘要翻译：用石墨纳米管混合插座实现增强的尺寸稳定性的方法和结构。插座壳体壁包括多个对准的石墨纳米纤维。多个对准的石墨纳米纤维分布热量并提供增强的尺寸稳定性。例如，当插座经历焊料回流工艺时，多个对准的石墨纳米纤维更均匀地分布热量，从而减少应变。

22. 发明申请

US20120138269A1 DUPLEX FLEXIBLE HEAT EXCHANGER 有权
标题翻译：双重灵活热交换器
公开(公告)号：US20120138269A1
公开(公告)日：2012-06-07
申请号：US12959477
申请日：2010-12-03
申请人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
发明人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
IPC分类号： F28D15/00
CPC分类号： F28D15/00 , F04D13/024 , F04D29/586 , F28F2250/08 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.
摘要翻译：公开了一种用于冷却电热源的方法和系统。热交换器具有两个主要子组件。通过设置在热源旁边的第二子组件提供闭环流体流。通过与第二子组件连通的第一子组件提供开环流体流。第一和第二子组件中的每一个具有旋转元件。进入第一子组件的流体流使第一旋转元件旋转，并且旋转元件之间的磁连通引起第二旋转元件的移动，从而实现第二子组件内的流体运动。操作上，闭环子组件从热源移除热量并将其传送到开环子组件，以便在下游流体流中进行随后的热传递。

23. 发明申请

US20120086952A1 Providing Thermal Compensation for Topographic Measurement at an Elevated Temperature Using a Non-Contact Vibration Transducer 失效
标题翻译：使用非接触式振动传感器在高温下提供用于地形测量的热补偿
公开(公告)号：US20120086952A1
公开(公告)日：2012-04-12
申请号：US12898783
申请日：2010-10-06
申请人： Arvind K. Sinha
发明人： Arvind K. Sinha
IPC分类号： G01B11/24
CPC分类号： G01B11/24
摘要： A mechanism for providing thermal compensation when measuring surface topography at an elevated temperature using a non-contact vibration transducer, such as a laser Doppler vibrometer (LDV). Thermal compensation is provided to a detector output signal to correct for thermal diffraction of a reflected portion of a beam of radiant energy directed at a surface of a test object. The thermal compensation is based on a calculated deviation between the detector output signal r2 at an elevated temperature and the detector output signal r1 at approximately room temperature. In one embodiment, the thermal compensation mechanism calculates a stationary signal r3 (t) which represents the detector output signal without noise and corrected for thermal diffraction at the elevated temperature according to the following equation: r 3  ( t ) = lim T → ∞  1 / T  ∫ - t / 2 + t / 2  r 2 *  ( t ) * r 2 *  ( t + Δ   t )    t , wherein T represents the total number of spectrums measured at the elevated temperature at multiple times upon which the compensation is based, and wherein r2*=r2−r2 (baseline).
摘要翻译：使用诸如激光多普勒振动计（LDV）的非接触式振动传感器在高温测量表面形貌时提供热补偿的机构。将热补偿提供给检测器输出信号，以校正指向测试对象表面的辐射能束的反射部分的热衍射。热补偿基于在升高的温度下的检测器输出信号r2与大约室温下的检测器输出信号r1之间的计算偏差。在一个实施例中，热补偿机构根据以下等式计算表示无噪声的检测器输出信号的稳定信号r3（t），并根据以下等式对高温下的热衍射进行校正：r 3（t）= lim T→∞ 其中T表示测量的光谱总数，其中T表示测量的光谱总数，其中T表示测量的光谱总数在补偿所基于的多次的高温下，其中r2 * = r2-r2（基线）。

24. 发明申请

US20100243716A1 Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers 审中-公开
标题翻译：具有用于优先冷却晶片的冷却壳的增强连接器支架
公开(公告)号：US20100243716A1
公开(公告)日：2010-09-30
申请号：US12410726
申请日：2009-03-25
申请人： Joseph Kuczynski , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
发明人： Joseph Kuczynski , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
IPC分类号： B23K31/02 , B23K37/04 , H01R43/02 , H05K7/20
CPC分类号： H01R43/0256 , B23K1/0016 , B23K2101/36 , Y10T29/49213
摘要： A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board.
摘要翻译：一种用于经由具有冷却壳的支架优先冷却电路板的方法，系统和装置。增强的连接器支架通过使用选择性地使得连接器引线达到回流温度水平的冷却部件能够将连接器安全且精确地放置在电路板上。支架通过支架的梳状结构将电路板对准并牢固地连接到连接器，以形成单个连接器单元。将热量施加到单个连接器单元以引发结合形成。支架通过在加热过程中通过冷却部件的循环使选择性地最小化对电路板和其它板部件的热量。因此，支架限制了连接器引线的回流温度水平。将连接器牢固地连接到电路板之后，将托架机构从电路板上取下。

25. 发明授权

US07354281B1 Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectors 有权
标题翻译：用于限制围绕SMT连接器的纵向轴线的旋转力矩的方法和装置
公开(公告)号：US07354281B1
公开(公告)日：2008-04-08
申请号：US11683512
申请日：2007-03-08
申请人： William L. Brodsky , Mark G. Clark , Amanda E. E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
发明人： William L. Brodsky , Mark G. Clark , Amanda E. E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
IPC分类号： H01R9/22
CPC分类号： H01R12/7011 , H01R12/716 , H01R12/721 , H01R13/514 , H05K1/181 , H05K2201/10189 , H05K2201/10537 , H05K2201/209 , Y02P70/611
摘要： An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).
摘要翻译：电连接器包括具有从其延伸的互锁特征的第一连接器主体。互锁特征将第一连接器主体与相邻的第二连接器主体相互延伸的互补互锁特征互锁，以将第二或第二连接器主体上的横向力分布在相邻的连接器本体上，从而减小每个电连接器的基座处的旋转力矩连接到印刷电路板（PCB）。

26. 发明申请

US20080024983A1 A DYNAMIC AIR MOVING SYSTEM 失效
标题翻译：动态空气移动系统
公开(公告)号：US20080024983A1
公开(公告)日：2008-01-31
申请号：US11461250
申请日：2006-07-31
申请人： William J. Anderl , Maurice F. Holahan , Arvind K. Sinha , Gregory S. Vande Corput
发明人： William J. Anderl , Maurice F. Holahan , Arvind K. Sinha , Gregory S. Vande Corput
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20727
摘要： Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.
摘要翻译：公开了一种动态空气移动系统，其包括设置在电子外壳中的轨道系统，至少一个风扇壳体，其可移动地设置在轨道系统上，风扇可沿轨道系统致动，可枢转风扇设置在每个至少一个风扇壳体，包括在风扇中的至少一个叶片，所述至少一个叶片可围绕至少一个叶片轴线旋转;风扇控制器芯片，其控制至少一个风扇壳体的致动，至少一个叶片的单独旋转，风扇，设置在位于电子外壳中的至少一个芯片上的芯片热传感器，热传感器连接到风扇控制器芯片，以及设置在与电子外壳相关联的至少一个磁盘驱动器上的驱动热传感器，驱动热传感器连接到风扇控制器芯片。

27. 发明授权

US09257359B2 System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks 有权
标题翻译：在3D芯片堆叠中使用的热界面材料中处理水平对准的石墨纳米纤维的系统和方法
公开(公告)号：US09257359B2
公开(公告)日：2016-02-09
申请号：US13188572
申请日：2011-07-22
申请人： Joseph Kuczynski , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
发明人： Joseph Kuczynski , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
IPC分类号： H01L23/48 , H01L21/50 , H01L23/36 , H01L23/373 , H01L23/42 , H01L23/427 , H01L25/065 , H01L23/00
CPC分类号： H01L23/36 , H01L23/373 , H01L23/42 , H01L23/4275 , H01L23/481 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L2224/131 , H01L2224/14131 , H01L2224/16146 , H01L2224/17181 , H01L2224/17519 , H01L2224/29099 , H01L2224/32245 , H01L2224/73203 , H01L2224/73253 , H01L2224/81815 , H01L2924/01322 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.
摘要翻译：具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。该装置还包括放置在第一芯片和第二芯片之间的热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维。该方法包括在第一侧上创建具有电路的第一芯片，并通过连接器网格将第二芯片电连接并机械耦合到第一芯片。该方法还包括在第一芯片和第二芯片之间放置热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维。

28. 发明授权

US08716597B2 Implementing enhanced dimensional stability with graphite nanotube hybrid socket 有权
标题翻译：用石墨纳米管混合插座实现增强的尺寸稳定性
公开(公告)号：US08716597B2
公开(公告)日：2014-05-06
申请号：US13346986
申请日：2012-01-10
申请人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
发明人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H02G3/08 , H01R13/14 , B82Y40/00
CPC分类号： H05K7/1069 , B82Y30/00
摘要： A method and structure for implementing enhanced dimensional stability with a graphite nanotube hybrid socket. A socket housing wall includes a plurality of aligned graphite nanofibers. The plurality of aligned graphite nanofibers distributing heat and providing enhanced dimensional stability. For example, the plurality of aligned graphite nanofibers more evenly distributes heat when the socket is undergoing solder reflow processes, thereby reducing strain.
摘要翻译：用石墨纳米管混合插座实现增强的尺寸稳定性的方法和结构。插座壳体壁包括多个对准的石墨纳米纤维。多个对准的石墨纳米纤维分布热量并提供增强的尺寸稳定性。例如，当插座经历焊料回流工艺时，多个对准的石墨纳米纤维更均匀地分布热量，从而减少应变。

29. 发明授权

US08558564B2 Heat spreader flatness detection 失效
标题翻译：散热器平面度检测
公开(公告)号：US08558564B2
公开(公告)日：2013-10-15
申请号：US13033637
申请日：2011-02-24
申请人： Arvind K. Sinha , Kory W. Weckman
发明人： Arvind K. Sinha , Kory W. Weckman
IPC分类号： G01R27/08 , G01R31/08
CPC分类号： G01N27/041 , H05K7/20509
摘要： A heat spreader includes a plurality of sensors that indicate that the heat spreader is flat against and in thermal contact with a plurality of chips when the heat spreader is loaded upon a chip stack. One or more nodes within the sensors are connected by electric conductors. The resistances of the conductors may be compared to determine if the nodes within the sensors are relatively flat. Sensor flatness may be indicated to a higher level electronic device such as a visual display. The display may ultimately be viewed by a user to determine whether the heat spreader is flat and in thermal contact with the plurality of chips when the heat spreader is loaded upon the chip stack.
摘要翻译：散热器包括多个传感器，这些传感器指示当散热器装载在芯片堆叠上时，散热器平坦地对抗多个芯片并与之热接触。传感器内的一个或多个节点通过电导体连接。可以比较导体的电阻，以确定传感器内的节点是否相对平坦。传感器的平坦度可以指示到较高级别的电子设备，诸如视觉显示器。用户可以最终看到显示器，以便当散热器装载在芯片堆叠上时，确定散热器是否平坦并与多个芯片热接触。

30. 发明申请

US20110303403A1 Flexible Heat Exchanger 审中-公开
标题翻译：柔性换热器
公开(公告)号：US20110303403A1
公开(公告)日：2011-12-15
申请号：US12814175
申请日：2010-06-11
申请人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
发明人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
IPC分类号： F28F21/00 , B21D53/02
CPC分类号： H01L23/4332 , F28F3/12 , F28F2255/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： An embodiment of the invention comprises a method for constructing a heat exchanger for cooling one or more semiconductor components. The method comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber. Channel segments are configured along the interior side of the first sheet, wherein each channel extends between the coolant chambers and two TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.
摘要翻译：本发明的实施例包括一种用于构造用于冷却一个或多个半导体部件的热交换器的方法。该方法包括提供特定导热金属箔的第一和第二平面片的步骤，其中每个片具有外侧和内侧。该方法还包括在第一片材中形成一个或多个热接触节点（TCN），其中每个TCN从第一片材的外侧向外延伸，并且包括平面接触构件和一个或多个侧面部分，侧面部分包括能够使TCN的接触构件朝向和远离第一板的外侧移动的弹性部件，以及TCN的侧部和接触部件共同形成冷却剂室。通道段沿着第一片材的内侧配置，其中每个通道选择性地在冷却剂室和两个TCN之间或TCN的冷却剂室与输入端口或输出端口之间延伸。该方法还包括将第二片材的内侧连接到第一片材的内侧，以便形成包括每个通道段的密封流动路径，并且使液体冷却剂能够流入和流出每个通道段的冷却剂室 TCN。

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