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    • 27. 发明申请
    • Methods of Forming Light Emitting Devices with Active Layers that Extend Into Opened Pits
    • 形成具有延伸到开口凹坑中的有源层的发光器件的方法
    • US20090029493A1
    • 2009-01-29
    • US12243507
    • 2008-10-01
    • David Todd EmersonMichael John Bergmann
    • David Todd EmersonMichael John Bergmann
    • H01L21/00
    • H01L33/24H01L33/007H01L33/32
    • Light emitting devices include an active region comprising a plurality of layers and a pit opening region on which the active region is disposed. The pit opening region is configured to expand a size of openings of a plurality of pits to a size sufficient for the plurality of layers of the active region to extend into the pits. In some embodiments, the active region comprises a plurality of quantum wells. The pit opening region may comprise a superlattice structure. The pits may surround their corresponding dislocations and the plurality of layers may extend to the respective dislocations. At least one of the pits of the plurality of pits may originate in a layer disposed between the pit opening layer and a substrate on which the pit opening layer is provided. The active region may be a Group III nitride based active region. Methods of fabricating such devices are also provided.
    • 发光器件包括包括多个层的有源区和设置有源区的凹坑开口区。 凹坑开口区域被配置为将多个凹坑的开口的尺寸扩大到足以使有源区域的多个层延伸到凹坑中的尺寸。 在一些实施例中,有源区包括多个量子阱。 凹坑开口区域可以包括超晶格结构。 凹坑可以围绕其相应的位错,并且多个层可以延伸到相应的位错。 多个凹坑中的凹坑中的至少一个凹坑可以起源于设置在凹坑开口层和设置凹坑开口层的基底之间的层。 有源区可以是基于III族氮化物的有源区。 还提供了制造这种装置的方法。
    • 30. 发明授权
    • Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
    • 深紫外光发射装置及其制造深紫外光发射装置的方法
    • US08772757B2
    • 2014-07-08
    • US12030539
    • 2008-02-13
    • David Todd EmersonMichael John BergmannAmber AbareKevin Haberern
    • David Todd EmersonMichael John BergmannAmber AbareKevin Haberern
    • H01L29/06
    • H01L33/12B82Y20/00H01L33/06H01L33/32
    • Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 360 nm with wall plug efficiencies of at least than 4% are provided. Wall plug efficiencies may be at least 5% or at least 6%. Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 345 nm with wall plug efficiencies of at least than 2% are also provided. Light emitting devices and methods of fabricating light emitting devices that emit at wavelengths less than 330 nm with wall plug efficiencies of at least than 0.4% are provided. Light emitting devices and methods of fabricating light emitting devices having a peak output wavelength of not greater than 360 nm and an output power of at least 5 mW, having a peak output wavelength of 345 nm or less and an output power of at least 3 mW and/or a peak output wavelength of 330 nm or less and an output power of at least 0.3 mW at a current density of less than about 0.35 μA/μm2 are also provided. The semiconductor light emitting devices may have a direct current lifetime of at least 100 hours, at least 500 hours or at least 1000 hours.
    • 提供发光装置和制造发射波长小于360nm,壁塞效率至少为4%的发光装置的方法。 墙壁插头效率可以至少为5%或至少为6%。 还提供了发光装置和制造发射波长小于345nm并具有至少2%壁塞效率的发光装置的方法。 提供发光装置和制造发射波长小于330nm,壁塞效率至少为0.4%的发光器件的方法。 具有峰值输出波长不大于360nm和输出功率至少为5mW的发光器件的发光器件和方法,具有345nm或更小的峰值输出波长和至少3mW的输出功率 还提供了在小于约0.35μA/μm2的电流密度下的330nm或更小的峰值输出波长和至少0.3mW的输出功率。 半导体发光器件可以具有至少100小时,至少500小时或至少1000小时的直流电寿命。