专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 外观设计

USD605272S1 Dehumidifier 有权
公开(公告)号：USD605272S1
公开(公告)日：2009-12-01
申请号：US29331267
申请日：2009-01-22
申请人： Jae Hung Chun , Kyu Nam Lee , Jae Won Jeong , Ji Eun Kim , Seon Kyu Kim
设计人： Jae Hung Chun , Kyu Nam Lee , Jae Won Jeong , Ji Eun Kim , Seon Kyu Kim

22. 外观设计

USD580032S1 Standing type air conditioner 有权
公开(公告)号：USD580032S1
公开(公告)日：2008-11-04
申请号：US29290871
申请日：2008-01-24
申请人： Tae Il Kim , Sang Woog Cho , Kang Eui Cho , Jeong Rok Lee , Ji Eun Kim , Seon Kyu Kim
设计人： Tae Il Kim , Sang Woog Cho , Kang Eui Cho , Jeong Rok Lee , Ji Eun Kim , Seon Kyu Kim

23. 发明授权

US09144153B2 Method of manufacturing a fabric type circuit board 有权
标题翻译：织物型电路板的制造方法
公开(公告)号：US09144153B2
公开(公告)日：2015-09-22
申请号：US13551911
申请日：2012-07-18
申请人： Ji Eun Kim , Bae Sun Kim , Yong Ki Son , Sung Yong Shin , Il Yeon Cho
发明人： Ji Eun Kim , Bae Sun Kim , Yong Ki Son , Sung Yong Shin , Il Yeon Cho
IPC分类号： H05K3/02 , H05K3/10 , H05K1/03 , H05K1/14 , H05K3/36 , H05K3/40
CPC分类号： H05K1/038 , H05K1/141 , H05K3/368 , H05K3/403 , H05K2201/055 , Y10T29/49155
摘要： A fabric type circuit board in which a conductive pattern is provided both faces of fabrics and a method of manufacturing the same. A fabric type circuit board includes fabrics and a conductive pattern in which extension units folded from one side of the fabrics to another side of the fabrics are formed, wherein the conductive pattern is formed using at least one of a copper film transfer printing scheme, printing, etching, embroidery, and sewing. A method of manufacturing a fabric type circuit board includes forming a conductive pattern, having extension units formed therein, on fabrics, cutting a part of the fabrics on which the conductive pattern is formed, and forming contact surfaces by folding the extension units from one side of the fabrics to another side of the fabrics.
摘要翻译：织物的两面设有导电图案的织物类型电路板及其制造方法。织物型电路板包括织物和导电图案，其中形成从织物的一侧向织物的另一侧折叠的延伸部分，其中导电图案使用铜膜转印印刷方案，印刷中的至少一种形成，蚀刻，刺绣和缝制。一种制造织物类电路板的方法包括在织物上形成具有形成在其中的延伸单元的导电图案，切割其上形成有导电图案的织物的一部分，并且通过从一侧折叠延伸单元来形成接触表面的织物的另一面。

24. 发明授权

US08934716B2 Method and apparatus for sequencing off-line character from natural scene 有权
标题翻译：从自然场景中排除离线角色的方法和装置
公开(公告)号：US08934716B2
公开(公告)日：2015-01-13
申请号：US13599111
申请日：2012-08-30
申请人： Ho Sub Yoon , Ji Eun Kim , Kyu Dae Ban , Dong Jin Lee , Jae Hong Kim , Joo Chan Sohn
发明人： Ho Sub Yoon , Ji Eun Kim , Kyu Dae Ban , Dong Jin Lee , Jae Hong Kim , Joo Chan Sohn
IPC分类号： G06K9/34 , G06K9/46
CPC分类号： G06K9/00865 , G06K9/3258 , G06K9/348 , G06K2209/01
摘要： Disclosed is a method of sequencing character information in order to increase precision of character recognition. The method includes: a pre-processing that extracts character information from an image to binarize the extracted character information through a predetermined threshold and extracts and thins a center line of the binarized character information; normalizing the pre-processed character information to character information according to a predetermined criteria; and sequencing the normalized character information using structural features including an end point or a divergence point of the character information. The present invention suggests an angle normalization method of input character information, a structural feature position determining method, and a structural feature numeral string generating method to strongly recognize characters configured by various fonts obtained from a natural scene regardless of an angle or a size of the characters.
摘要翻译：公开了一种对字符信息进行排序以提高字符识别精度的方法。该方法包括：预处理，其从图像提取字符信息，以将所提取的字符信息二值化为预定阈值，并提取并清除二值化字符信息的中心线; 根据预定标准将预处理字符信息规范化为字符信息; 以及使用包括字符信息的终点或发散点的结构特征对归一化字符信息进行排序。本发明提出一种输入字符信息的角度归一化方法，结构特征位置确定方法和结构特征数字串生成方法，用于强烈地识别从自然场景获得的各种字体配置的字符，而不管角度或尺寸如何人物。

25. 发明授权

US08913332B2 Photographing lens optical system 有权
标题翻译：摄影镜头光学系统
公开(公告)号：US08913332B2
公开(公告)日：2014-12-16
申请号：US13604347
申请日：2012-09-05
申请人： Pil Sun Jung , Hyoung Bae Park , Chi Ho An , Jae Hoon Cho , Ji Eun Kim
发明人： Pil Sun Jung , Hyoung Bae Park , Chi Ho An , Jae Hoon Cho , Ji Eun Kim
IPC分类号： G02B13/00 , G02B3/04
CPC分类号： G02B13/0045 , G02B3/04
摘要： A lens optical system including first, second, third, fourth, and fifth lenses that are sequentially arranged between an object and an image sensor on which an image of the object is formed. The first lens may have a positive refractive power and may be biconvex. The second lens may have a negative refractive power and may have a meniscus shape that is convex toward the object. The third lens may have a positive refractive power. The fourth lens may have a positive refractive power and may have a meniscus shape that is convex toward the image sensor. The fifth lens may have a negative refractive power, and at least one of an incident surface and an exit surface of the fifth lens may be an aspherical surface.
摘要翻译：一种透镜光学系统，包括顺序地布置在物体和形成有物体的图像的图像传感器之间的第一，第二，第三，第四和第五透镜。第一透镜可以具有正屈光力并且可以是双凸面。第二透镜可以具有负折光力并且可以具有朝向物体凸出的弯月形状。第三透镜可以具有正折射光焦度。第四透镜可以具有正折射光焦度并且可以具有向图像传感器凸起的弯月形状。第五透镜可以具有负折光力，并且第五透镜的入射表面和出射表面中的至少一个可以是非球面。

26. 发明授权

US08564141B2 Chip unit and stack package having the same 有权
标题翻译：具有相同的芯片单元和堆叠封装
公开(公告)号：US08564141B2
公开(公告)日：2013-10-22
申请号：US13038831
申请日：2011-03-02
申请人： Kyu Won Lee , Cheol Ho Joh , Eun Hye Do , Ji Eun Kim , Hee Min Shin
发明人： Kyu Won Lee , Cheol Ho Joh , Eun Hye Do , Ji Eun Kim , Hee Min Shin
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/3121 , H01L23/5389 , H01L23/562 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L25/105 , H01L2224/0401 , H01L2224/13022 , H01L2224/16225 , H01L2224/48091 , H01L2224/48147 , H01L2224/48227 , H01L2225/06517 , H01L2225/0652 , H01L2225/06524 , H01L2225/06527 , H01L2225/06548 , H01L2225/06558 , H01L2225/06562 , H01L2225/06572 , H01L2225/1035 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H01L2924/19107 , H01L2924/3511 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other.
摘要翻译：芯片单元包括：第一半导体芯片和第二半导体芯片，其布置成使得其用于形成第一焊盘和第二焊盘的表面彼此面对; 第一和第二连接构件，设置在第一和第二半导体芯片的表面上，用于形成第一和第二接合焊盘，并且具有一端与第一和第二接合焊盘连接的再分配线，另一端突出超过第一和第二半导体芯片和薄膜; 插入在所述第一连接构件和所述第二连接构件之间的粘合构件; 并且通过图案通过粘合构件并将第一和第二连接构件的再分配线的突出部彼此连接。

27. 发明申请

US20130265652A1 Photographic Lens Optical System 有权
标题翻译：摄影镜头光学系统
公开(公告)号：US20130265652A1
公开(公告)日：2013-10-10
申请号：US13588583
申请日：2012-08-17
申请人： Chi Ho An , Pil Sun Jung , Jae Hoon Cho , Ji Eun Kim , Chan Goo Kang
发明人： Chi Ho An , Pil Sun Jung , Jae Hoon Cho , Ji Eun Kim , Chan Goo Kang
IPC分类号： G02B13/18 , G02B9/34
CPC分类号： G02B13/004 , G02B5/208 , G02B13/18
摘要： A lens optical system includes first, second, third, and fourth lenses that are arranged between an object and an image sensor, in order from an object side, wherein the first lens has positive refractive power and an incident surface that is convex toward the object, the second lens has negative refractive power and both surfaces of which are concave, the third lens has positive refractive power and a meniscus shape that is convex toward the image sensor, and the fourth lens has negative refractive power and at least one of an incident surface and an exit surface of which is an aspherical surface, wherein the system satisfies the inequality, 3.0
摘要翻译：透镜光学系统包括从物体侧开始依次布置在物体和图像传感器之间的第一透镜，第二透镜，第三透镜和第四透镜，其中第一透镜具有正折光力，并且朝向物体凸出的入射表面第二透镜具有负屈光力并且其两个表面都是凹形的，第三透镜具有正的折光力和朝向图像传感器凸起的弯月形状，并且第四透镜具有负折光力，并且至少一个入射表面，其出射表面是非球面，其中系统满足不等式3.0

28. 发明授权

US08546943B2 Ball grid array substrate with insulating layer and semiconductor chip package 失效
标题翻译：球栅阵列衬底采用绝缘层和半导体芯片封装
公开(公告)号：US08546943B2
公开(公告)日：2013-10-01
申请号：US12923037
申请日：2010-08-30
申请人： Jung Hyun Park , Nam Keun Oh , Sang Duck Kim , Jong Gyu Choi , Young Ji Kim , Ji Eun Kim , Myung Sam Kang
发明人： Jung Hyun Park , Nam Keun Oh , Sang Duck Kim , Jong Gyu Choi , Young Ji Kim , Ji Eun Kim , Myung Sam Kang
IPC分类号： H01L23/13 , H01L23/498
CPC分类号： H01L21/76885 , H01L21/02112 , H01L23/13 , H01L23/3128 , H01L24/48 , H01L24/97 , H01L2224/451 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.
摘要翻译：提供了一种球栅阵列基板，半导体芯片封装及其制造方法。球栅阵列基板包括绝缘层，其具有提供半导体芯片的安装区域的第一表面，与第一表面相对的第二表面和连接第二表面与半导体芯片的安装区域的开口，以及电路图案埋在第二面。由于球栅阵列基板通过堆叠两个绝缘层的方法制造，因此可以使用现有的装置，并且可以将球栅阵列基板制造为超薄板。此外，由于电路图案被埋在绝缘层中，因此可以形成高密度电路图案。

29. 发明申请

US20130087369A1 FABRIC TYPE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：织物型电路板及其制造方法
公开(公告)号：US20130087369A1
公开(公告)日：2013-04-11
申请号：US13551911
申请日：2012-07-18
申请人： Ji Eun Kim , Bae Sun Kim , Yong Ki Son , Sung Yong Shin , II Yeon Cho
发明人： Ji Eun Kim , Bae Sun Kim , Yong Ki Son , Sung Yong Shin , II Yeon Cho
IPC分类号： H05K1/03 , H05K3/10
CPC分类号： H05K1/038 , H05K1/141 , H05K3/368 , H05K3/403 , H05K2201/055 , Y10T29/49155
摘要： Disclosed are a fabric type circuit board in which a conductive pattern is provided both faces of fabrics and a method of manufacturing the same. A fabric type circuit board according to the present invention includes fabrics and a conductive pattern in which extension units folded from one side of the fabrics to an other side of the fabrics are formed, wherein the conductive pattern is formed using at least one of a copper film transfer printing scheme, printing, etching, embroidery, and sewing. A method of manufacturing a fabric type circuit board according to the present invention includes forming a conductive pattern, having extension units formed therein, on fabrics, cutting a part of the fabrics on which the conductive pattern is formed, and forming contact surfaces by folding the extension units from one side of the fabrics to an other side of the fabrics.
摘要翻译：公开了一种织物类型电路板，其中在织物的两个面上设置导电图案及其制造方法。根据本发明的织物类型电路板包括织物和导电图案，其中形成从织物的一侧向织物的另一侧折叠的延伸单元，其中导电图案使用铜电影转印，印刷，蚀刻，刺绣和缝制。根据本发明的织物类型电路板的制造方法包括在织物上形成具有形成在其中的延伸单元的导电图案，切割其上形成有导电图案的织物的一部分，并通过折叠形成接触表面来形成接触表面延伸单元从织物的一侧到织物的另一侧。

30. 发明授权

US08244293B2 Dual mode mobile communication terminal and method of selecting mode therein 有权
标题翻译：双模移动通信终端及其中选择模式的方法
公开(公告)号：US08244293B2
公开(公告)日：2012-08-14
申请号：US12152565
申请日：2008-05-14
申请人： Ji Eun Kim
发明人： Ji Eun Kim
IPC分类号： H04M1/00
CPC分类号： H04W48/18 , H04W88/06
摘要： A dual mode mobile communication terminal and a method of selecting a mode therein that can minimize a call cost are provided. The method of selecting a mode in a dual mode mobile communication terminal into which at least two cards are inserted includes: requesting mode selection; selecting a card and a mode that can minimize a call cost according to a provider network to connect to based on previously stored call cost information for each provider and the at least two cards; and connecting to a corresponding provider network using the selected mode.
摘要翻译：提供一种双模式移动通信终端及其中选择其中可以最小化呼叫成本的模式的方法。在插入至少两张卡的双模移动通信终端中选择模式的方法包括：请求模式选择; 基于先前存储的用于每个提供商和所述至少两个卡的呼叫费用信息，选择卡和模式，其可以根据提供商网络来最小化呼叫成本以进行连接; 并使用所选择的模式连接到相应的提供商网络。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式