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    • 22. 发明授权
    • Electron beam vapor deposition apparatus and method of coating
    • 电子束气相沉积装置及其涂覆方法
    • US08419857B2
    • 2013-04-16
    • US12414697
    • 2009-03-31
    • James W. Neal
    • James W. Neal
    • C23C16/00
    • C23C14/30C23C14/046H01J37/3053H01J37/3178H01J2237/3132
    • An electron beam vapor deposition apparatus includes a coating chamber including a coating zone for depositing a coating on a work piece. A coating device includes at least one crucible for presenting at least one source coating material. The coating device includes a first deposition mode of depositing the at least one source coating material and a second deposition mode of depositing the at least one source coating material. At least one electron beam source evaporates the at least one source coating material for deposit onto the work piece. A controller is configured to control a speed of movement of the work piece in the coating zone during the coating operation in response to the first deposition mode and the second deposition mode.
    • 电子束气相沉积设备包括涂覆室,其包括用于在工件上沉积涂层的涂层区域。 涂覆装置包括至少一个用于呈现至少一种源涂料的坩埚。 涂覆装置包括沉积至少一种源涂料的第一沉积模式和沉积所述至少一种源涂料的第二沉积模式。 至少一个电子束源蒸发至少一个源涂料以沉积到工件上。 控制器被配置为响应于第一沉积模式和第二沉积模式,在涂覆操作期间控制工件在涂覆区域中的移动速度。