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21. 发明申请

US20090295288A1 ADDRESSABLE MICROPLASMA DEVICES AND ARRAYS WITH BURIED ELECTRODES IN CERAMIC 有权
标题翻译：可焊接麦克风设备和阵列与陶瓷电极
公开(公告)号：US20090295288A1
公开(公告)日：2009-12-03
申请号：US11337969
申请日：2006-01-23
申请人： J. Gary Eden , Sung-Jin Park
发明人： J. Gary Eden , Sung-Jin Park
IPC分类号： H01J17/49
CPC分类号： H01J11/18 , H05H1/2406 , H05H2001/2418 , H05H2001/2437
摘要： An array of microcavity plasma devices is formed in a ceramic substrate that provides structure for and isolation of an array of microcavities that are defined in the ceramic substrate. The ceramic substrate isolates the microcavities from electrodes disposed within the ceramic substrate. The electrodes are disposed to ignite a discharge in microcavities in the array of microcavities upon application of a time-varying potential between the electrodes. Embodiments of the invention include electrode and microcavity arrangements that permit addressing of individual microcavities or groups of microcavities. The contour of the microcavity wall allows for the electric field within the microcavity to be shaped.
摘要翻译：在陶瓷衬底中形成微腔等离子体器件的阵列，其提供在陶瓷衬底中限定的微腔阵列的结构和隔离。陶瓷衬底将微腔与设置在陶瓷衬底内的电极隔离。电极被设置成在施加电极之间的时变电位时，以微腔阵列中的微腔中点燃放电。本发明的实施例包括允许寻址单个微腔或微腔组的电极和微腔布置。微腔壁的轮廓允许微腔内的电场成形。

22. 发明授权

US08890409B2 Microcavity and microchannel plasma device arrays in a single, unitary sheet 有权
标题翻译：微腔和微通道等离子体器件阵列在单一的单一片材中
公开(公告)号：US08890409B2
公开(公告)日：2014-11-18
申请号：US12991237
申请日：2009-05-14
申请人： J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
IPC分类号： H01J17/49 , H01J9/26 , H01J9/32 , H05H1/24 , H01J61/86 , H01J11/36
CPC分类号： H05H1/24 , H01J11/36 , H01J61/86 , H05H1/2406 , H05H2001/2418
摘要： An array of microcavity plasma devices is formed in a unitary sheet of oxide with embedded microcavities or microchannels and encapsulated metal driving electrodes isolated by oxide from the microcavities or microchannels and arranged so as to generate sustain a plasma in the embedded microcavities or microchannels upon application of time-varying voltage when a plasma medium is contained in the microcavities or microchannels.
摘要翻译：微腔等离子体装置的阵列形成在具有嵌入的微腔或微通道的一体的氧化物片材中，并且被封装的金属驱动电极由氧化物从微腔或微通道分离，并被布置成在施加了微腔或微通道时在嵌入的微腔或微通道中产生维持等离子体当等离子体介质包含在微通道或微通道中时，具有时变电压。

23. 发明授权

US08497631B2 Polymer microcavity and microchannel devices and fabrication method 有权
标题翻译：聚合物微腔和微通道器件及其制造方法
公开(公告)号：US08497631B2
公开(公告)日：2013-07-30
申请号：US11698264
申请日：2007-01-23
申请人： J. Gary Eden , Sung-Jin Park , Meng Lu , Brian Cunningham
发明人： J. Gary Eden , Sung-Jin Park , Meng Lu , Brian Cunningham
IPC分类号： H01J17/49
CPC分类号： B29C35/02 , B29C65/70 , H01J9/245 , H01J11/18 , H01J65/046 , H05H1/2406 , H05H2001/2412
摘要： A microplasma device includes a substrate and either or both of a microchannel or microcavity defined in a polymer layer supported by the substrate. Electrodes arranged with respect to the polymer material can excite a plasma in a discharge medium contained in the microchannel or the microcavity or both. A method of forming a microplasma device places a curable polymer material between a mold having a negative volume impression of microcavities and/or microchannels and a substrate. The polymer is cured and then the mold is separated from the solid polymer.
摘要翻译：微血浆装置包括基质和限定在由基底支撑的聚合物层中的微通道或微腔中的任一者或两者。相对于聚合物材料布置的电极可以在包含在微通道或微腔中的放电介质中或两者中激发等离子体。形成微等离子体装置的方法将可固化的聚合物材料放置在具有负的体积的微腔和/或微通道的印模和基底之间。聚合物固化，然后将模具与固体聚合物分离。

24. 发明授权

US08404558B2 Method for making buried circumferential electrode microcavity plasma device arrays, and electrical interconnects 有权
标题翻译：用于制造埋置的圆周电极微腔等离子体器件阵列和电互连的方法
公开(公告)号：US08404558B2
公开(公告)日：2013-03-26
申请号：US13188712
申请日：2011-07-22
申请人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
发明人： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
IPC分类号： H01L33/16 , H01J17/04 , H01J17/49
CPC分类号： H01J11/18 , G09F9/313
摘要： In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.
摘要翻译：在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。箔被阳极化以形成金属氧化物。自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。

25. 发明申请

US20130071297A1 ARRAYS OF METAL AND METAL OXIDE MICROPLASMA DEVICES WITH DEFECT FREE OXIDE 有权
标题翻译：金属和金属氧化物微孔器件与无氧氧化物的阵列
公开(公告)号：US20130071297A1
公开(公告)日：2013-03-21
申请号：US13527842
申请日：2012-06-20
申请人： J. Gary Eden , Sung-Jin Park , Jin Hoon Cho , Seung Hoon Sung , Min Hwan Kim
发明人： J. Gary Eden , Sung-Jin Park , Jin Hoon Cho , Seung Hoon Sung , Min Hwan Kim
IPC分类号： H01J37/32 , C25D11/02
CPC分类号： B01J19/0093 , B01J2219/00783 , B01J2219/00842 , B01J2219/00853 , B01J2219/00891 , C01B13/115 , C25D11/02 , C25D11/022 , C25D11/026 , C25D11/12 , C25D11/18 , C25D11/26 , H01J11/18 , H01J11/22 , H01J11/34 , H01J17/066 , H01J17/16 , H01J37/32055 , H05H2001/2412 , H05H2001/2418
摘要： A microplasma device includes a microcavity or microchannel defined at least partially within a thick metal oxide layer consisting essentially of defect free oxide. Electrodes are arranged with respect to the microcavity or microchannel to stimulate plasma generation in said microcavity or microchannel. At least one of the electrodes is encapsulated within the thick metal oxide layer. A method of fabricating a microcavity or microchannel plasma device includes anodizing a flat or gently curved or gently sloped metal substrate to form a thick layer of metal oxide consisting essentially of nanopores that are perpendicular to the surface of the metal substrate. Material removal is conducted to remove metal oxide material to form a microcavity or microchannel in the thick layer of metal oxide.
摘要翻译：微型装置包括至少部分地在基本上由无缺陷氧化物组成的厚金属氧化物层内限定的微腔或微通道。电极相对于微腔或微通道布置以刺激所述微腔或微通道中的血浆产生。至少一个电极被封装在厚的金属氧化物层内。一种制造微腔或微通道等离子体装置的方法包括阳极氧化平坦或轻柔地弯曲或缓慢倾斜的金属基底，以形成基本上由纳米孔组成的厚层，金属氧化物垂直于金属基底的表面。进行材料去除以除去金属氧化物材料以在金属氧化物的厚层中形成微腔或微通道。

26. 发明申请

US20110148282A1 VARIABLE ELECTRIC FIELD STRENGTH METAL AND METAL OXIDE MICROPLASMA LAMPS AND FABRICATION 有权
标题翻译：可变电场强度金属和金属氧化物微波炉和制造
公开(公告)号：US20110148282A1
公开(公告)日：2011-06-23
申请号：US12640884
申请日：2009-12-17
申请人： J. Gary Eden , Sung-Jin Park , Jason D. Readle , Jekwon Yoon , Andrew Price , Jeffrey Putney
发明人： J. Gary Eden , Sung-Jin Park , Jason D. Readle , Jekwon Yoon , Andrew Price , Jeffrey Putney
IPC分类号： H01J61/30 , H01J61/42 , H01J9/38
CPC分类号： H01J17/49 , H01J17/16 , H01J65/046
摘要： Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.
摘要翻译：本发明的优选实施例提供了具有限定多个微腔阵列和封装的薄金属电极的多个金属和金属氧化物层的微腔等离子体灯。包装在等离子体介质中包围多个金属和金属氧化物层。金属和金属氧化物层被配置和布置成改变灯中的电场强度和总气体压力（E / p）。本发明还提供了制造微腔等离子体灯的方法，其同时抽空包装内的体积和围绕包装的体积，以保持整个包装上的微不足道或零压差。包装用等离子体介质回填，同时在整个包装上保持不显着或零压差。

27. 发明申请

US20100072893A1 ELLIPSOIDAL MICROCAVITY PLASMA DEVICES AND POWDER BLASTING FORMATION 有权
标题翻译： ELLIPSOIDAL微波等离子体装置和粉末喷砂形成
公开(公告)号：US20100072893A1
公开(公告)日：2010-03-25
申请号：US12235796
申请日：2008-09-23
申请人： J. Gary Eden , Sung-Jin Park , Seung Hoon Sung
发明人： J. Gary Eden , Sung-Jin Park , Seung Hoon Sung
IPC分类号： H01J17/49 , H01J9/24
CPC分类号： H01J65/046 , H01J9/241 , H01J11/18
摘要： The invention provides microcavity plasma devices and arrays that are formed in layers that also seal the plasma medium, i.e., gas(es) and/or vapors. No separate packaging layers are required and additional packaging can be omitted if it is desirable to do so. A preferred microcavity plasma device includes first and second thin layers that are joined together. A half ellipsoid microcavity or plurality of half ellipsoid microcavities is defined in one or both of the first and second thin layers, and electrodes are arranged with respect to the microcavity to excite a plasma within said microcavities upon application of a predetermined voltage to the electrodes. A method for forming a microcavity plasma device having a plurality of half or full ellipsoid microcavities in one or both of first and second thin layers is also provided by a preferred embodiment. The method includes defining a pattern of protective polymer on the first thin layer. Powder blasting forms half ellipsoid microcavities in the first thin layer. The second thin layer is joined to the first layer. The patterning can be conducted lithographically or can be conduced with a simple screen.
摘要翻译：本发明提供了形成为也密封等离子体介质即气体和/或蒸汽的层的微腔等离子体装置和阵列。不需要单独的包装层，如果要这样做，可以省略额外的包装。优选的微腔等离子体装置包括连接在一起的第一和第二薄层。半椭圆形微腔或多个半椭圆形微腔被限定在第一和第二薄层中的一个或两个中，并且相对于微腔布置电极，以在对电极施加预定电压时在所述微腔内激发等离子体。优选实施例也提供了一种在第一和第二薄层中的一个或两个中形成具有多个半或全椭圆形微腔的微腔等离子体装置的方法。该方法包括在第一薄层上限定保护性聚合物的图案。粉末喷射在第一薄层中形成半椭圆形微腔。第二薄层连接到第一层。图案化可以光刻地进行，或者可以用简单的屏幕进行。

28. 发明授权

US07126266B2 Field emission assisted microdischarge devices 有权
标题翻译：场放电辅助微放电器件
公开(公告)号：US07126266B2
公开(公告)日：2006-10-24
申请号：US10891417
申请日：2004-07-14
申请人： Sung-Jin Park , J. Gary Eden , Kyung-Ho Park
发明人： Sung-Jin Park , J. Gary Eden , Kyung-Ho Park
IPC分类号： H01J1/62
CPC分类号： H01J1/025 , B82Y10/00 , H01J3/025 , H01J17/066 , H01J63/02 , H01J2201/30469 , H01J2217/49
摘要： Field emission nanostructures assist operation of a microdischarge device. The field emission nanostructures are integrated into the microdischarge device(s) or are situated near an electrode of the microdischarge device(s). The field emission nanostructures reduce operating and ignition voltages compared to otherwise identical devices lacking the field emission nanostructures, while also increasing the radiative output of the microdischarge device(s).
摘要翻译：场发射纳米结构有助于微放电器件的工作。场发射纳米结构集成到微放电器件中或位于微放电器件的电极附近。与其他相同的缺少场发射纳米结构的器件相比，场致发射纳米结构降低了操作和点火电压，同时也增加了微放电器件的辐射输出。

29. 发明授权

US08547004B2 Encapsulated metal microtip microplasma devices, arrays and fabrication methods 有权
标题翻译：封装的金属微尖端微型器件，阵列和制造方法
公开(公告)号：US08547004B2
公开(公告)日：2013-10-01
申请号：US13188715
申请日：2011-07-22
申请人： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Brian Chung
发明人： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Brian Chung
IPC分类号： H01J61/04 , H01J17/49
CPC分类号： H01T21/00 , B01D53/32 , B01D2257/104 , B01D2257/91 , B01D2258/06 , B01D2259/818 , C01B13/10 , C02F1/32 , C02F1/4608 , C02F1/46109 , C02F1/48 , C02F1/78 , C02F2001/46133 , C02F2001/46152 , C02F2303/04 , H05H1/2406 , H05H2001/2418 , H05H2245/121
摘要： An embodiment of the invention is a microtip microplasma device having a first metal microtip opposing a second metal microtip with a gap therebetween. The first and second metal microtips are encapsulated in metal oxide that electrically isolates and physically connects the first and second metal microtips. In preferred devices, the first and second metal microtips and metal oxide comprise a monolithic, unitary structure. Arrays can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of to forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.
摘要翻译：本发明的一个实施例是一种微尖端微型装置，其具有与第二金属微尖端相对的第一金属微尖端，其间具有间隙。第一和第二金属微尖端被封装在金属氧化物中，其电隔离并物理地连接第一和第二金属微尖端。在优选的装置中，第一和第二金属微尖端和金属氧化物包括整体的单一结构。阵列可以是柔性的，可以堆叠布置，并且可以形成为气缸，例如用于气体和液体处理装置，空气过滤器等应用。形成微尖锐微量器件阵列的优选方法提供了金属网，其中具有微孔开口阵列。金属网的电极区域被掩蔽，留下金属网的计划连接的金属氧化物区域未被掩蔽。计算的连接金属氧化物区域进行电化学蚀刻，以将计划的连接金属氧化物区域转换成在其中封装相对的金属微尖端的金属氧化物。去除面具。电化学蚀刻电极区域以将电极区域包封在金属氧化物中。

30. 发明申请

US20120178335A1 METHOD TO MANUFACTURE REDUCED MECHANICAL STRESS ELECTRODES AND MICROCAVITY PLASMA DEVICE ARRAYS 有权
标题翻译：制造减少机械应力电极和微波等离子体装置阵列的方法
公开(公告)号：US20120178335A1
公开(公告)日：2012-07-12
申请号：US13425214
申请日：2012-03-20
申请人： J. Gary Eden , Sung-Jin Park
发明人： J. Gary Eden , Sung-Jin Park
IPC分类号： H01J9/02
CPC分类号： H01J11/18 , C25D11/26
摘要： In a preferred method of formation embodiment, a thin metal foil or film is obtained or formed with microcavities (such as through holes). The foil or film is anodized symmetrically so as to form a metal-oxide film on the surface of the foil and on the walls of the microcavities. One or more self-patterned metal electrodes are automatically formed and simultaneously buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity, and electrodes for adjacent microcavities can be isolated or connected. If the microcavity is cylindrical, the electrodes form as rings around each cavity.
摘要翻译：在优选的形成实施方案中，由微孔（例如通孔）获得或形成薄金属箔或膜。对称地对箔或膜进行阳极氧化，以在箔的表面和微腔的壁上形成金属氧化物膜。一个或多个自图形金属电极自动形成并同时埋在由阳极氧化工艺产生的金属氧化物中。电极在围绕每个微腔的封闭圆周中形成，并且用于相邻微腔的电极可被隔离或连接。如果微腔是圆柱形的，则电极形成为围绕每个空腔的环。

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