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21. 外观设计

USD453184S1 Ink tank for printer 失效
标题翻译：墨盒用于打印机
公开(公告)号：USD453184S1
公开(公告)日：2002-01-29
申请号：US29138713
申请日：2001-03-20
申请人： Hitoshi Ito , Iwao Kawamura , Kazunori Namai
设计人： Hitoshi Ito , Iwao Kawamura , Kazunori Namai

22. 发明授权

US4804726A Manufacturing method of polyolefin 失效
标题翻译：聚烯烃的制造方法
公开(公告)号：US4804726A
公开(公告)日：1989-02-14
申请号：US195440
申请日：1988-05-16
申请人： Yozo Kondo , Mitsuhiro Mori , Morihiko Sato , Toshikazu Chikusa , Hitoshi Ito
发明人： Yozo Kondo , Mitsuhiro Mori , Morihiko Sato , Toshikazu Chikusa , Hitoshi Ito
IPC分类号： C08F4/00 , C08F4/60 , C08F4/64 , C08F4/658 , C08F10/00
CPC分类号： C08F10/00 , Y10S526/905
摘要： A manufacturing method of polyolefin characterized in that at least one kind of olefins is allowed to polymerize in the presence of a catalyst system comprising(A) solid catalyst ingredient (A) obtained through the successive reaction steps, wherein, with a homogeneous solution involving(i) at least one member selected from metallic magnesium and hydroxylated organic compounds and oxygen-containing organic compounds of magnesium, and(ii) at least one kind of oxygen-containing organic compounds of titanium, are allowed to react in sequence with:(iii) at least one kind of organoaluminum compounds, then(iv) at least one kind of silicon compounds and further(V) at least one kind of halogenated aluminum compounds and(B) at least one kind of catalyst ingredients (B) selected from organometallic compounds, the metal of which belongs to Ia, IIa, IIb, IIIb or IVb group in the periodic table.
摘要翻译：一种聚烯烃的制造方法，其特征在于，在包含（A）通过连续反应步骤获得的固体催化剂成分（A）的催化剂体系的存在下，使至少一种烯烃聚合，其中，使用包含（ i）选自金属镁和羟基化有机化合物中的至少一种和镁的含氧有机化合物，和（ii）至少一种含氧的有机钛化合物，使其与以下物质反应：（iii ）至少一种有机铝化合物，然后（iv）至少一种硅化合物和（V）至少一种卤化铝化合物和（B）至少一种选自有机金属的催化剂成分（B）化合物，其金属属于周期表中的Ia，IIa，IIb，IIIb或IVb族。

23. 发明授权

US4746549A Method for forming thin film of refractory material 失效
$Method for forming thin film of refractory material$
标题翻译：形成耐火材料薄膜的方法
公开(公告)号：US4746549A
公开(公告)日：1988-05-24
申请号：US3550
申请日：1987-01-15
申请人： Hitoshi Ito , Takahiko Moriya
发明人： Hitoshi Ito , Takahiko Moriya
IPC分类号： C23C16/04 , C23C16/08 , H01L21/28 , H01L21/285 , H01L21/3205 , H01L21/768
CPC分类号： H01L21/28562 , C23C16/04 , C23C16/08 , H01L21/76879
摘要： In a method for forming a thin film of a refractory metal on a substrate having a silicon layer and an insulating layer on a surface thereof, a halogen compound of the refractory metal is mixed with hydrogen gas for providing a material gas, hydrogen halide gas or a halogen gas consisting of a second halogen less electronegative than the first halogen forming the halogen compound of the refractory metal is added to the material gas, and by use of the thus obtained mixed gas, vapor phase deposition refractory metal is effected selectively on the surface of the silicon layer of the substrate.
摘要翻译：在其表面具有硅层和绝缘层的基板上形成难熔金属薄膜的方法中，难熔金属的卤素化合物与用于提供原料气体的氢气，卤化氢气体或将由形成难熔金属的卤素化合物的第一卤素的第二卤素组成的卤素气体加入到原料气体中，并且通过使用由此获得的混合气体，在表面上选择性地进行气相沉积难熔金属的衬底的硅层。

24. 发明授权

US08237211B2 Non-volatile semiconductor storage device and method of manufacturing the same 有权
标题翻译：非易失性半导体存储装置及其制造方法
公开(公告)号：US08237211B2
公开(公告)日：2012-08-07
申请号：US12556242
申请日：2009-09-09
申请人： Yoshiaki Fukuzumi , Ryota Katsumata , Masaru Kito , Hiroyasu Tanaka , Masaru Kidoh , Yosuke Komori , Megumi Ishiduki , Akihiro Nitayama , Hideaki Aochi , Hitoshi Ito , Yasuyuki Matsuoka
发明人： Yoshiaki Fukuzumi , Ryota Katsumata , Masaru Kito , Hiroyasu Tanaka , Masaru Kidoh , Yosuke Komori , Megumi Ishiduki , Akihiro Nitayama , Hideaki Aochi , Hitoshi Ito , Yasuyuki Matsuoka
IPC分类号： H01L29/788
CPC分类号： H01L27/11578 , H01L27/11565 , H01L27/11582
摘要： A non-volatile semiconductor storage device has a memory string including a plurality of electrically rewritable memory cells connected in series. The non-volatile semiconductor storage device also has a protruding layer formed to protrude upward with respect to a substrate. The memory string includes: a plurality of first conductive layers laminated on the substrate; a first semiconductor layer formed to penetrate the plurality of first conductive layers; and an electric charge storage layer formed between the first conductive layers and the first semiconductor layer, and configured to be able to store electric charges. Each of the plurality of first conductive layers includes: a bottom portion extending in parallel to the substrate; and a side portion extending upward with respect to the substrate along the protruding layer at the bottom portion. The protruding layer has a width in a first direction parallel to the substrate that is less than or equal to its length in a lamination direction.
摘要翻译：非易失性半导体存储装置具有串联连接的多个电可重写存储单元的存储串。非挥发性半导体存储装置还具有形成为相对于基板向上突出的突出层。存储器串包括：层叠在基板上的多个第一导电层; 形成为穿透所述多个第一导电层的第一半导体层; 以及形成在第一导电层和第一半导体层之间的电荷存储层，并且能够存储电荷。多个第一导电层中的每一个包括：平行于基板延伸的底部; 以及沿底部的突出层相对于基板向上延伸的侧部。该突出层在平行于基板的第一方向上的宽度小于或等于其在层叠方向上的长度。

25. 发明授权

US08110917B2 Package substrate with a conductive connecting pin 有权
标题翻译：封装衬底，带导电连接引脚
公开(公告)号：US08110917B2
公开(公告)日：2012-02-07
申请号：US12581205
申请日：2009-10-19
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译：一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与主板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的焊盘16，用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口局部暴露于外部。导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

26. 发明授权

US07902659B2 Conductive connecting pin and package substrate 有权
标题翻译：导电连接销和封装基板
公开(公告)号：US07902659B2
公开(公告)日：2011-03-08
申请号：US12359663
申请日：2009-01-26
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译：一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

27. 发明授权

US07777601B2 Circuit breaker 有权
标题翻译：断路器
公开(公告)号：US07777601B2
公开(公告)日：2010-08-17
申请号：US11658169
申请日：2006-02-10
申请人： Hiroyuki Kakisako , Hitoshi Ito , Kozo Maeta , Masanori Kawamura , Shigeki Koumoto
发明人： Hiroyuki Kakisako , Hitoshi Ito , Kozo Maeta , Masanori Kawamura , Shigeki Koumoto
IPC分类号： H01H1/00 , H01H75/00 , H01H77/00 , H01H83/00 , H01H1/22
CPC分类号： H01H73/04 , H01H1/226 , H01H1/5833 , H01H71/528
摘要： A movable contacting device in a circuit breaker comprises: a crossbar linked with the opening/closing mechanism and carried so as to pivot cooperatively with the opening/closing mechanism; a movable contact arm engaged, so as to cooperational with the crossbar, with a shaft fitted into a mutually opposing recesses in the crossbar; and a movable contact arm support fixed to the case accomodating the opening/closing mechanism and having mutually opposing through-holes through which the shaft is passed; and the movable contact being configured so that the movable contact slides between surfaces of movable contact arm support having the mutually opposing through-holes; and the construction of a single-pole portion of the movable contact arm is constituted by arranging in parallel two movable contact arm members each having a movable contact at one end, and in a shaft-supporting portion at the other end, an elastic member is sandwiched between the two movable contact arm members. With this arrangement, circuit breakers provided with a movable contacting device that is small in size and stable in contact resistance can be made available.
摘要翻译：断路器中的可移动接触装置包括：与所述打开/关闭机构连接并被承载以与所述打开/关闭机构协作枢转的横杆; 与横杆配合的可动接触臂与装在横杆上相互相对的凹槽中的轴接合; 以及可移动的接触臂支撑件，其固定到容纳所述打开/关闭机构的壳体并且具有相互相对的所述轴穿过的通孔; 并且所述可动触头构造成使得所述可动触头在具有相互相对的通孔的可动触头支撑件的表面之间滑动; 并且可动接触臂的单极部分的构造通过平行地布置两个可动接触臂构件，每个可动接触臂构件的一端具有可动接点，而在另一端的轴支撑部分中，弹性构件是夹在两个可动接触臂构件之间。通过这种布置，可以提供具有尺寸小且接触电阻稳定的可动接触装置的断路器。

28. 发明申请

US20080289943A1 Circuit Breaker 有权
标题翻译：断路器
公开(公告)号：US20080289943A1
公开(公告)日：2008-11-27
申请号：US11658169
申请日：2006-02-10
申请人： Hiroyuki Kakisako , Hitoshi Ito , Kozo Maeta , Masanori Kawamura , Shigeki Koumoto
发明人： Hiroyuki Kakisako , Hitoshi Ito , Kozo Maeta , Masanori Kawamura , Shigeki Koumoto
IPC分类号： H01H1/00
CPC分类号： H01H73/04 , H01H1/226 , H01H1/5833 , H01H71/528
摘要： A movable contacting device in a circuit breaker comprises: a crossbar linked with the opening/closing mechanism and carried so as to pivot cooperatively with the opening/closing mechanism; a movable contact arm engaged, so as to cooperational with the crossbar, with a shaft fitted into a mutually opposing recesses in the crossbar; and a movable contact arm support fixed to the case accomodating the opening/closing mechanism and having mutually opposing through-holes through which the shaft is passed; and the movable contact being configured so that the movable contact slides between surfaces of movable contact arm support having the mutually opposing through-holes; and the construction of a single-pole portion of the movable contact arm is constituted by arranging in parallel two movable contact arm members each having a movable contact at one end, and in a shaft-supporting portion at the other end, an elastic member is sandwiched between the two movable contact arm members. With this arrangement, circuit breakers provided with a movable contacting device that is small in size and stable in contact resistance can be made available.
摘要翻译：断路器中的可移动接触装置包括：与所述打开/关闭机构连接并被承载以与所述打开/关闭机构协作枢转的横杆; 与横杆配合的可动接触臂与装在横杆上相互相对的凹槽中的轴接合; 以及可移动的接触臂支撑件，其固定到容纳所述打开/关闭机构的壳体并且具有相互相对的所述轴穿过的通孔; 并且所述可动触头构造成使得所述可动触头在具有相互相对的通孔的可动触头支撑件的表面之间滑动; 并且可动接触臂的单极部分的构造通过平行地布置两个可动接触臂构件，每个可动接触臂构件的一端具有可动接点，而在另一端的轴支撑部分中，弹性构件是夹在两个可动接触臂构件之间。通过这种布置，可以提供具有尺寸小且接触电阻稳定的可动接触装置的断路器。

29. 发明申请

US20070231654A1 Process of producing sulfonic group-containing substituted polyacetylene membrane, membrane obtained thereby and application thereof 审中-公开
标题翻译：制备含磺基取代的聚乙炔膜的方法，由此获得的膜及其应用
公开(公告)号：US20070231654A1
公开(公告)日：2007-10-04
申请号：US11730008
申请日：2007-03-29
申请人： Hitoshi Ito , Eiichi Akiyama , Hiroshi Yokota , Kazuyoshi Takedai
发明人： Hitoshi Ito , Eiichi Akiyama , Hiroshi Yokota , Kazuyoshi Takedai
IPC分类号： H01M8/10 , C08J5/22
CPC分类号： H01M8/1088 , C08J5/2287 , C08J2343/04 , C08J2349/00 , H01M8/1023 , H01M8/1083 , H01M2300/0082 , Y02P70/56
摘要： A process of producing a substituted polyacetylene electrolyte membrane which is a solid electrolyte membrane having a sulfonic group uniformly introduced thereinto, with its electrode assembly being useful as an electrochemical device or a fuel cell and an electrolyte membrane using the same are provided. A process of producing a sulfonic group-containing substituted polyacetylene membrane, which includes molding a substituted polyacetylene containing a repeating unit represented by the following formula (1) into a membrane state and bringing the molding into contact with a sulfonating agent to achieve sulfonation and a substituted polyacetylene membrane which is produced by the subject production process and in which the sulfonic group is uniformly distributed in a membrane thickness direction. In the formula (1), either one or all of R1 and R2 represent a silyl group represented by the following formula (2); and the remainder represents hydrogen, a hydroxyl group, an alkyl group or an alkoxy group each having from 1 to 8 carbon atoms, a t-butyldimethylsilyloxy group, an acetyloxy group, or a group represented by the following formula (3). In the formula (2), X1, X2 and X3 each independently represents a linear or branched alkyl group having from 1 to 6 carbon atoms. In the formula (3), R3 represents hydrogen, a hydroxyl group, an alkyl group or an alkoxy group each having from 1 to 8 carbon atoms, a trimethylsilyl group, a t-butyldimethylsilyloxy group, an acetyloxy group, or a group represented by the formula (2).
摘要翻译：提供了一种具有均匀引入磺酸基的固体电解质膜的取代聚乙炔电解质膜的制造方法，其电极组件可用作电化学装置或燃料电池以及使用该电解质膜的电解质膜。含有磺酸基的取代的聚乙炔膜的制造方法，其包括将含有下述式（1）表示的重复单元的取代聚乙炔成型为膜状，使模制物与磺化剂接触以实现磺化和取代聚乙炔膜，其通过本制造方法制造，其中磺酸基在膜厚度方向上均匀分布。在式（1）中，R 1和R 2中的一个或全部表示由下式（2）表示的甲硅烷基。其余为氢，羟基，烷基或碳原子数1〜8的烷氧基，叔丁基二甲基甲硅烷氧基，乙酰氧基或下述式（3）所示的基团。在式（2）中，X 1，X 2和X 3各自独立地表示具有1至6个碳原子的直链或支链烷基碳原子。在式（3）中，R 3表示氢，羟基，烷基或具有1至8个碳原子的烷氧基，三甲基甲硅烷基，叔丁基二甲基甲硅烷氧基，乙酰氧基或由式（2）表示的基团。

30. 发明申请

US20060170006A1 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060170006A1
公开(公告)日：2006-08-03
申请号：US11146029
申请日：2005-06-07
申请人： Hiroyuki Yamasaki , Hitoshi Ito
发明人： Hiroyuki Yamasaki , Hitoshi Ito
IPC分类号： H01L29/76
CPC分类号： H01L29/4238 , H01L29/6659 , H01L29/66628 , H01L29/7834
摘要： An MIS transistor includes a gate electrode located to intersect a device region of a semiconductor substrate isolated by a device isolation region, and source and drain regions formed in the semiconductor substrate at both sides of the gate electrode region and elevated source and drain located above the source and drain regions. A gate length of the gate electrode at a boundary between the device isolation region and the device region is longer than the gate length at a central portion of the device region.
摘要翻译： MIS晶体管包括位于与器件隔离区隔离的半导体衬底的器件区域相交的栅电极，以及形成在栅电极区两侧的半导体衬底中的源区和漏区以及位于源极和漏极区域。在器件隔离区域和器件区域之间的边界处的栅电极的栅极长度大于器件区域的中心部分处的栅极长度。

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