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    • 25. 发明授权
    • Non-volatile semiconductor memory device and method for producing the same
    • 非易失性半导体存储器件及其制造方法
    • US06563165B2
    • 2003-05-13
    • US09199264
    • 1998-11-25
    • Kiyohiko SakakibaraHirotada Kuriyama
    • Kiyohiko SakakibaraHirotada Kuriyama
    • A01L29788
    • H01L27/11526H01L27/115H01L27/11521H01L27/11531H01L29/42324
    • A non-volatile semiconductor memory device comprising: a semiconductor substrate, memory cells, a region of memory cell array in which said memory cells are arranged in a matrix-like form, a region of peripheral circuit, a connecting region for connecting said region of memory cell array to said region of peripheral circuit, and conductive layers provided closest to said substrate with intervals between each other, wherein said intervals of said conductive layers are substantially equal to each other in said region of memory cell array and said connecting region, whereby when insulating films are formed and planarized after forming said conductive layers, it is possible to restrict producing of seams in the insulating films at stripped portions of the conductive layers.
    • 一种非易失性半导体存储器件,包括:半导体衬底,存储单元,其中所述存储单元以矩阵状形式布置的存储单元阵列的区域,外围电路的区域,用于连接所述区域的连接区域 存储单元阵列到所述外围电路的所述区域,以及最靠近所述衬底设置的导电层,所述导体层之间具有间隔,其中所述导电层的所述间隔在所述存储单元阵列区域和所述连接区域中基本相等,由此 当在形成所述导电层之后形成绝缘膜并进行平坦化时,可以限制导电层的剥离部分的绝缘膜中的接缝的产生。
    • 26. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US06420751B1
    • 2002-07-16
    • US09640880
    • 2000-08-18
    • Shigenobu MaedaYasuo YamaguchiHirotada KuriyamaShigeto Maegawa
    • Shigenobu MaedaYasuo YamaguchiHirotada KuriyamaShigeto Maegawa
    • H01L2976
    • H01L27/092H01L27/10823H01L27/10841H01L27/1104H01L27/1203H01L29/66666H01L29/7827
    • A field effect transistor occupying a small area and a semiconductor device using the same can be obtained. A gate electrode is provided on a substrate on which a source region is provided with a first interlayer insulating film interposed therebetween. The gate electrode is covered with a second interlayer insulating film. A contact hole for exposing a part of the surface of the source region is provided so as to penetrate through the first interlayer insulating film, the gate electrode, and the second interlayer insulating film. A sidewall surface of the contact hole is covered with a gate insulating film. A first semiconductor layer of a first conductivity type is provided on the surface of the source region in contact therewith up to the lower surface of the gate electrode. A channel semiconductor layer is provided on the surface of the first semiconductor layer up to the upper surface of the gate electrode. A second semiconductor layer of a first conductivity type serving as a drain region is provided on the channel semiconductor layer.
    • 可以获得占据小面积的场效应晶体管和使用其的半导体器件。 栅电极设置在基板上,源极区域之间插入有第一层间绝缘膜。 栅电极被第二层间绝缘膜覆盖。 提供用于暴露源区域的一部分表面的接触孔,以穿透第一层间绝缘膜,栅电极和第二层间绝缘膜。 接触孔的侧壁表面被栅极绝缘膜覆盖。 第一导电类型的第一半导体层设置在与其接触的源极区域的表面上,直到栅电极的下表面。 沟道半导体层设置在第一半导体层的表面上直到栅电极的上表面。 在沟道半导体层上设置有用作漏极区的第一导电类型的第二半导体层。
    • 28. 发明授权
    • SRAM memory device having reduced size
    • 具有减小尺寸的SRAM存储器件
    • US6030548A
    • 2000-02-29
    • US978002
    • 1997-11-25
    • Hirotada Kuriyama
    • Hirotada Kuriyama
    • H01L21/8244H01L27/11H01L29/76H01L29/94H01L31/062H01L31/113
    • H01L27/1104Y10S257/903
    • A semiconductor memory device is provided that can have the memory cell size reduced and electrical imbalance eliminated. This semiconductor memory device has gate electrodes of a driver transistor and a load transistor formed of a first polysilicon layer, and a word line also serving as a gate electrode of an access transistor formed of a different layer of a second polysilicon layer. Therefore, the gate electrodes of the driver transistor and the load transistor can be overlapped with each other in a planar manner with the word line, resulting in reduction in the planar area of the memory cell. In a cell current path, a contact portion other than a bit line contact and a GND contact is not provided. Therefore, electrical imbalance in memory cells is prevented.
    • 提供了可以使存储单元尺寸减小并消除电不平衡的半导体存储器件。 该半导体存储器件具有驱动晶体管的栅电极和由第一多晶硅层形成的负载晶体管,以及还用作由第二多晶硅层的不同层形成的存取晶体管的栅电极的字线。 因此,驱动晶体管和负载晶体管的栅电极可以与字线平面地彼此重叠,导致存储单元的平面面积减小。 在电池电流路径中,不提供除位线触点和GND触点之外的接触部分。 因此,防止了存储器单元中的电不平衡。
    • 30. 发明授权
    • Semiconductor memory device including a memory cell region of six
transistors
    • 半导体存储器件包括六个晶体管的存储单元区域
    • US5818080A
    • 1998-10-06
    • US601554
    • 1996-02-14
    • Hirotada Kuriyama
    • Hirotada Kuriyama
    • H01L21/8244H01L27/11H01L29/788
    • H01L27/1104Y10S257/903
    • A semiconductor memory device is provided that can have the memory cell size reduced and electrical imbalance eliminated. This semiconductor memory device has gate electrodes of a driver transistor and a load transistor formed of a first polysilicon layer, and a word line also serving as a gate electrode of an access transistor formed of a different layer of a second polysilicon layer. Therefore, the gate electrodes of the driver transistor and the load transistor can be overlapped with each other in a planar manner with the word line, resulting in reduction in the planar area of the memory cell. In a cell current path, a contact portion other than a bit line contact and a GND contact is not provided. Therefore, electrical imbalance in memory cells is prevented.
    • 提供了可以使存储单元尺寸减小并消除电不平衡的半导体存储器件。 该半导体存储器件具有驱动晶体管的栅电极和由第一多晶硅层形成的负载晶体管,以及还用作由第二多晶硅层的不同层形成的存取晶体管的栅电极的字线。 因此,驱动晶体管和负载晶体管的栅电极可以与字线平面地彼此重叠,导致存储单元的平面面积减小。 在电池电流路径中,不提供除位线触点和GND触点之外的接触部分。 因此,防止了存储器单元中的电不平衡。