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21. 发明授权

US06774404B2 Light emitting diode 有权
标题翻译：发光二极管
公开(公告)号：US06774404B2
公开(公告)日：2004-08-10
申请号：US10407249
申请日：2003-04-07
申请人： Sadato Imai
发明人： Sadato Imai
IPC分类号： H01L3300
CPC分类号： H01L33/44 , H01L2224/48091 , H01L2224/73265 , H01L2933/0091 , H01L2924/00014
摘要： A light emitting diode is disclosed which can enhance the scattering of light produced by a light emitting element to improve a brightness not only at an upper surface but also at side surfaces of a resin sealant covering the light emitting element, thereby providing a high brightness level in a wider range of angle. This light emitting diode comprises a substrate 22, a pair of electrodes 23a, 23b provided on the substrate, a light emitting element 24 mounted on the substrate and electrically connected to the electrodes, a sealant 26 provided on the substrate to seal the electrodes 23a, 23b and the light emitting element 24; and a light scattering layer 30 formed on an outermost layer of a light projecting surface 27 of the sealant 26.
摘要翻译：公开了一种发光二极管，其可以增强由发光元件产生的光的散射，以便不仅在覆盖发光元件的树脂密封件的上表面，而且在侧表面处提高亮度，从而提供高亮度级该发光二极管包括基板22，设置在基板上的一对电极23a，23b，安装在基板上并电连接到电极的发光元件24，设置在基板22上的密封剂26 基板以密封电极23a，23b和发光元件24; 以及形成在密封剂26的光投射面27的最外层上的光散射层30。

22. 发明申请

US20130264958A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20130264958A1
公开(公告)日：2013-10-10
申请号：US13822792
申请日：2011-12-29
申请人： Takakazu Yano , Akio Yoshimura , Sadato Imai , Shinichi Miyashita
发明人： Takakazu Yano , Akio Yoshimura , Sadato Imai , Shinichi Miyashita
IPC分类号： H05B33/08
CPC分类号： H05B33/0815 , F21K9/00 , H01L25/0753 , H01L2924/0002 , H05B33/0806 , H05B33/0821 , H05B33/0824 , H01L2924/00
摘要： A light-emitting device (10) includes a plurality of light-emitting areas (10a, 10b and 10c), and each of the light-emitting areas (10a, 10b and 10c) includes a first light-emitting block (3) and a second light-emitting block (4). Each respective first light-emitting blocks (3) include a plurality of first light-emitting elements (A1, A2, or A3), which are connected in series, and each respective second light-emitting blocks (4) include a plurality of second light-emitting elements (B1, B2, or B3), which are connected in series. The number of first light-emitting elements in each respective first light-emitting blocks (3) is the same with one another of the first light-emitting blocks (3), and the number of second light-emitting elements in each respective second light-emitting blocks (4) is the same with one another of the second light-emitting blocks (4).
摘要翻译：发光装置（10）包括多个发光区域（10a，10b和10c），并且每个发光区域（10a，10b和10c）包括第一发光块（3）和第二发光块（4）。每个第一发光块（3）包括串联连接的多个第一发光元件（A1，A2或A3），并且各个第二发光块（4）包括多个第二发光元件串联连接的发光元件（B1，B2或B3）。各个第一发光块（3）中的第一发光元件的数量与第一发光块（3）中的彼此相同，并且每个相应的第二光中的第二发光元件的数量 - 发光块（4）与第二发光块（4）中的另一个相同。

23. 外观设计

USD645417S1 Light-emitting diode 有权
公开(公告)号：USD645417S1
公开(公告)日：2011-09-20
申请号：US29376075
申请日：2010-10-01
申请人： Sadato Imai , Kazuo Funakubo
设计人： Sadato Imai , Kazuo Funakubo

24. 发明授权

US07688591B2 Electronic-component-mounting board 有权
标题翻译：电子元器件安装板
公开(公告)号：US07688591B2
公开(公告)日：2010-03-30
申请号：US12043606
申请日：2008-03-06
申请人： Sadato Imai , Satoru Kikuchi , Koichi Fukasawa
发明人： Sadato Imai , Satoru Kikuchi , Koichi Fukasawa
IPC分类号： H05K7/20 , F21V21/00 , F21V29/00
CPC分类号： F21V29/70 , F21K9/20 , F21Y2103/10 , F21Y2115/10 , H01L2924/0002 , H01R4/023 , H05K1/0203 , H05K1/056 , H05K1/114 , H05K1/141 , H05K1/181 , H05K3/3421 , H05K7/205 , H05K2201/10106 , H05K2201/10287 , H05K2201/10409 , Y02P70/611 , H01L2924/00
摘要： The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved. In addition, the cost of the electronic-component-mounting board can be reduced.
摘要翻译：根据本发明的电子部件安装板包括：高散热基板，包括金属板和形成在金属板的上表面上的电路图案; 电子部件，安装在高散热基板上，与电路图形电连接; 以及一个外部连接端子，其设置在高散热基板上并且提供电子部件安装板和外部设备之间的电连接。外部连接端子由导热率小于金属板的导热性的材料形成，并且具有焊接有引线的至少一个外部电极。因此，即使在高散热性基板上也可以通过焊接来连接引线。因此，电连接的可靠性得到改善，并且可以实现电子部件安装板的尺寸和厚度的减小。另外，可以减少电子部件安装板的成本。

25. 发明申请

US20090160302A1 LED LIGHTING LAMP 有权
标题翻译： LED照明灯
公开(公告)号：US20090160302A1
公开(公告)日：2009-06-25
申请号：US11911595
申请日：2006-04-13
申请人： Sadato Imai , Masayoshi Kanamori
发明人： Sadato Imai , Masayoshi Kanamori
IPC分类号： H01J61/94
CPC分类号： H01R33/94 , F21K9/232 , F21S43/15 , F21S43/19 , F21V19/001 , F21W2107/10 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The present invention is an LED lighting lamp which comprises a lamp body including a light emitting part in which a plurality of LED elements are arranged on each of side surfaces of a polygonal supporting member and a connection part which is provided at a different position from that of the light emitting part and is formed with a plurality of terminal electrodes electrically connected to the LED elements, and a socket in which the connection part of the lamp body is fitted and which has a pair of output terminals electrically connected to the terminal electrodes, and which is configured to enhance reliability and long-term stability and reduce a cost involved in exchanging a light source.
摘要翻译：本发明是一种LED照明灯，其包括：灯体，其包括发光部分，多个LED元件布置在多边形支撑构件的每个侧表面上，并且连接部分设置在与所述多个发光部分不同的位置并且形成有与LED元件电连接的多个端子电极，以及插座，其中灯体的连接部分被装配并且具有电连接到端子电极的一对输出端子，并且其被配置为增强可靠性和长期稳定性并降低交换光源所涉及的成本。

26. 外观设计

USD587219S1 Light-emitting diode for illuminating an object 有权
公开(公告)号：USD587219S1
公开(公告)日：2009-02-24
申请号：US29322838
申请日：2008-08-13
申请人： Sadato Imai , Masayoshi Kanamori
设计人： Sadato Imai , Masayoshi Kanamori

27. 外观设计

USD575243S1 Light-emitting diode for illuminating an object 有权
公开(公告)号：USD575243S1
公开(公告)日：2008-08-19
申请号：US29244504
申请日：2005-12-12
申请人： Sadato Imai , Masayoshi Kanamori
设计人： Sadato Imai , Masayoshi Kanamori

28. 发明授权

US07253447B2 Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element 有权
标题翻译：具有发光元件的发光元件和发光器件以及用于制造发光元件的方法
公开(公告)号：US07253447B2
公开(公告)日：2007-08-07
申请号：US10784242
申请日：2004-02-24
申请人： Nodoka Oishi , Koichi Fukasawa , Sadato Imai
发明人： Nodoka Oishi , Koichi Fukasawa , Sadato Imai
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , H01L33/486 , H01L33/62 , H01L33/648 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.
摘要翻译：发光二极管具有由导热材料制成的基座，由绝缘材料制成的线板并固定到基座的上表面。导电图案被固定到线板，并且发光二极管元件在暴露的安装区域固定到基座。发光二极管元件电连接到导电图案。

29. 发明授权

US08596820B2 LED unit and LED lighting lamp using the LED unit 有权
标题翻译： LED单元和LED照明灯使用LED单元
公开(公告)号：US08596820B2
公开(公告)日：2013-12-03
申请号：US11911658
申请日：2006-04-13
申请人： Koichi Fukasawa , Sadato Imai , Masayoshi Kanamori
发明人： Koichi Fukasawa , Sadato Imai , Masayoshi Kanamori
IPC分类号： F21S4/00 , F21V21/00 , H01R33/00
CPC分类号： F21K9/00 , F21V29/83 , F21V29/89 , F21Y2103/10 , F21Y2107/30 , F21Y2115/10 , H01L2224/48091 , H01L2924/00014
摘要： The present invention is an LED unit having a thermal-release structure including a base having high thermal conductivity, a circuit board which includes a wiring pattern and is provided on the base, at least one LED element which is electrically connected to the wiring pattern and disposed on the base, and a light-transmitting resinous body provided to cover above the base to seal the LED element.
摘要翻译：本发明是一种具有热释放结构的LED单元，该热释放结构包括具有高热导率的基底，包括布线图案的电路板，并且设置在基底上，至少一个LED元件与布线图案电连接，设置在基座上，以及透光树脂体，设置成覆盖在基座上方以密封LED元件。

30. 发明授权

US08154037B2 Light-emitting diode light source apparatus 有权
标题翻译：发光二极管光源装置
公开(公告)号：US08154037B2
公开(公告)日：2012-04-10
申请号：US12840800
申请日：2010-07-21
申请人： Norikazu Kadotani , Koichi Fukasawa , Sadato Imai
发明人： Norikazu Kadotani , Koichi Fukasawa , Sadato Imai
IPC分类号： H01L27/15
CPC分类号： F21V29/85 , F21K9/232 , F21V29/74 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/48137 , H01L2224/48091 , H01L2924/00014
摘要： An LED light source apparatus comprises a circular base having thermal conductivity, an insulative substrate concentric with the base and including a pass-through hole provided to pass through an upper surface and a lower surface of the substrate, at least one mounting area formed having a central portion of an upper surface of the base exposed from the pass-through hole of the substrate, and a plurality of LED elements mounted on the mounting area and electrically connected to electrodes provided on the upper surface of the substrate, the pass-through hole being formed in a circular shape concentric with the base and the substrate.
摘要翻译： LED光源装置包括具有导热性的圆形基底，与基底同心的绝缘基底，并且包括设置成穿过基底的上表面和下表面的通孔，至少一个安装区域形成为具有从基板的通孔露出的基板的上表面的中心部分和安装在安装区域上并与设置在基板的上表面上的电极电连接的多个LED元件，通孔形成为与基底和基底同心的圆形。

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