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    • 27. 发明授权
    • Apparatus for preparation of aqueous emulsion from curable silicone composition and suspension of cured silicone particles
    • 用于由可固化硅氧烷组合物制备水性乳液的装置和固化的硅氧烷颗粒的悬浮液
    • US07452195B2
    • 2008-11-18
    • US11680934
    • 2007-03-01
    • Kazuhiko AndoKeiji YoshidaToyohiko YamaderaYoshitsugu MoritaMitsuo Hamada
    • Kazuhiko AndoKeiji YoshidaToyohiko YamaderaYoshitsugu MoritaMitsuo Hamada
    • B29B9/06
    • B01F3/0807B01F5/061B01F5/0682B01F5/0688B01F7/00758B01F13/103C08J3/03C08J2383/04
    • Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier. Method for preparation of a suspension of cured silicone particles by allowing such emulsion to stand at room temperature, or heating the aforementioned emulsion.
    • 由(A)具有至少两个与硅键合的羟基的有机聚硅氧烷,(B)有机氢硅氧烷和(C)固化催化剂)组成的可固化有机硅组合物制备水乳液的方法,所述方法的特征在于(i )将组分(A),组分(B)和组分(C)或组分(A)和组分(B)和组分(C)的混合物通过各个入口端连续供给到连续混合器中,并在所述组分 不超过10℃,(ii)将所得混合物和(D)表面活性剂的水溶液连续供给到乳化剂中,并在不超过20℃的温度下乳化该组分。 的可固化硅氧烷组合物的水性乳液,其包含用于混合组分(A)至(C)的连续混合器,与混合器的下部连接的分配单元和乳化剂。 通过使这种乳液在室温下放置或加热上述乳液来制备固化的硅氧烷颗粒的悬浮液的方法。
    • 29. 发明申请
    • Impedance matching circuit, and semiconductor element and radio communication device using the same
    • 阻抗匹配电路,以及使用其的半导体元件和无线电通信装置
    • US20060170515A1
    • 2006-08-03
    • US10548758
    • 2004-03-04
    • Keiji YoshidaHaruichi KanayaTadaaki Tsuchiya
    • Keiji YoshidaHaruichi KanayaTadaaki Tsuchiya
    • H01P5/02H03H7/38
    • H01P5/02
    • An impedance matching circuit and a semiconductor element and a radio communication device using the same which is capable of adjusting bandwidth while permitting it to be constructed on the semiconductor element by reducing its occupation area. Since a reactance compensating distributed constant line (31) compensates reactance (BL, XS) of a load (6) and a quarter-wave transmission line (32) and an impedance inverting distributed constant line (33) composing an impedance inverting circuit (K inverter or J inverter) corresponding to the degree of impedance (ZL, ZS) of the load (6) match the impedance (ZL, ZS) of the compensated load (6) and output the input signals (SI1, SI2) at the preset bandwidth, adjustment of bandwidth can be made while miniaturizing the impedance matching circuit (7a) by shortening the line length of the reactance compensating distributed constant line (31) and the quarter-wave transmission line (32).
    • 一种阻抗匹配电路和半导体元件以及使用该阻抗匹配电路的无线电通信装置,其能够通过减少其占用面积来允许其在半导体元件上构造而调整带宽。 由于电抗补偿分布常数线(31)补偿负载(6)和四分之一波长传输线(32)的电抗(B SUB L,X S S),并且 构成对应于所述阻抗反相电路(K反相器或J反相器)的阻抗反相分布常数线路(33),所述阻抗反相电路(K反相器或J反相器) 负载(6)匹配补偿负载(6)的阻抗(ZLL,Z,S),并输出预设的输入信号(SI 1,SI 2) 通过缩小电抗补偿分布常数线(31)和四分之一波长传输线(32)的线路长度,可以在使阻抗匹配电路(7a)小型化的同时进行带宽调整。