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21. 发明授权

US07154751B2 Interface module-mounted LSI package 失效
公开(公告)号：US07154751B2
公开(公告)日：2006-12-26
申请号：US10920365
申请日：2004-08-18
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/367 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1305 , H01L2924/15311 , H01L2924/00
摘要： An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.

22. 发明申请

US20060038287A1 LSI package equipped with interface module, interface module and connection holding mechanism 失效
公开(公告)号：US20060038287A1
公开(公告)日：2006-02-23
申请号：US11203959
申请日：2005-08-16
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： H01L23/34
CPC分类号： G02B6/3817 , G02B6/389 , G02B6/423 , G02B6/4246 , G02B6/4292 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： I an LSI package, an interface module includes with an interposer having a signal processing LSI mounted thereon and has electric connection terminals for connection to a mounting board and a transmission line for transmitting a high-speed signal to an external wiring. An electric connection terminal is formed in each of the interposer and the interface module for electrically connecting the interposer and the interface module to each other by the mechanical contact, and a fixing holder is mounted for allowing the electric connection terminals to hold the electric connection between the interposer and the interface module. Thus, it is possible to suppress the increase in the manufacturing cost that is caused by the complex construction of the assembly.

23. 发明申请

US20050231911A1 Interface module-mounted LSI package 失效
标题翻译：接口模块安装的LSI封装
公开(公告)号：US20050231911A1
公开(公告)日：2005-10-20
申请号：US10920365
申请日：2004-08-18
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H05K7/20 , H01L21/00 , H01L21/50 , H01L23/36 , H01L23/367 , H01L23/467 , H01L23/498
CPC分类号： H01L23/467 , H01L23/367 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1305 , H01L2924/15311 , H01L2924/00
摘要： An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.
摘要翻译：接口模块安装的LSI封装具有内置基板，其具有信号处理LSI，用于信号传输的接口模块，机械地连接到插入器并且电连接到信号处理LSI，以及与两个信号接触的散热器处理LSI和接口模块，并辐射信号处理LSI和接口模块的热量。 LSI封装具有间隙，其作为用于信号处理LSI的散热部分和用于接口模块的散热部分之间的热电阻部分。

24. 发明授权

US06687272B2 Semiconductor laser device 有权
标题翻译：半导体激光器件
公开(公告)号：US06687272B2
公开(公告)日：2004-02-03
申请号：US10244386
申请日：2002-09-17
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： H01S304
CPC分类号： H01S5/02292 , H01S5/02248 , H01S5/02272 , H01S5/0683
摘要： A semiconductor laser device comprising a mount substrate, a semiconductor laser element, and a total reflection mirror. The substrate includes an n-type Si substrate, an i-type Si layer deposited on a part of the Si substrate, and a p-type Si layer deposited on the Si layer. The Si substrate and Si layers constitute a pin photodiode. A part of the sides of the Si layers is a sloping surface. The laser element is mounted on the substrate and has a light-emitting surface opposing the sloping surface. The mirror is provided on a part of the sloping surface. It reflects and outputs a central part of a light beam emitted from the laser element. It guides the remaining part of the light beam to the photodiode.
摘要翻译：一种半导体激光装置，包括安装基板，半导体激光元件和全反射镜。衬底包括n型Si衬底，沉积在Si衬底的一部分上的i型Si层和沉积在Si层上的p型Si层。 Si衬底和Si层构成引脚光电二极管。 Si层的一部分侧面是倾斜表面。激光元件安装在基板上并且具有与倾斜表面相对的发光表面。镜子设在倾斜表面的一部分上。它反射并输出从激光元件发射的光束的中心部分。它将光束的剩余部分引导到光电二极管。

25. 发明授权

US07554806B2 Interface module-mounted LSI package 失效
标题翻译：接口模块安装的LSI封装
公开(公告)号：US07554806B2
公开(公告)日：2009-06-30
申请号：US11779964
申请日：2007-07-19
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/367 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1305 , H01L2924/15311 , H01L2924/00
摘要： An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.
摘要翻译：接口模块安装的LSI封装具有内置基板，其具有信号处理LSI，用于信号传输的接口模块，机械地连接到插入器并且电连接到信号处理LSI，以及与两个信号接触的散热器处理LSI和接口模块，并辐射信号处理LSI和接口模块的热量。 LSI封装具有间隙，其作为用于信号处理LSI的散热部分和用于接口模块的散热部分之间的热电阻部分。

26. 发明申请

US20080298745A1 OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME 失效
标题翻译：光学模块及其制造方法
公开(公告)号：US20080298745A1
公开(公告)日：2008-12-04
申请号：US12130585
申请日：2008-05-30
申请人： Hiroshi HAMASAKI , Hideto Furuyama , Hideo Numata
发明人： Hiroshi HAMASAKI , Hideto Furuyama , Hideo Numata
IPC分类号： G02B6/26
CPC分类号： G02B6/4212 , G02B6/4239 , G02B6/4249 , H01L2224/48091 , H01L2924/00014
摘要： An optical module, including: an optical transmission line holding member having an optical semiconductor element mounting surface, an electrical interconnection layer formed on the mounting surface, and an optical transmission line guide hole with an opening on the mounting surface; an optical transmission line inserted into the guide hole; an optical semiconductor element, mounted on the mounting surface, having an electrode and a light-receiving or light-emitting area on a surface facing the mounting surface; an electrical connection portion which electrically connects the electrode and the interconnection layer, formed between the semiconductor element and the mounting surface; a first resin filling a space around the connection portion between the semiconductor element and the mounting surface; and a second resin filling a gap between the optical transmission line and the semiconductor element, with a property different from that of the first resin, and a method of manufacturing the module.
摘要翻译：一种光学模块，包括：具有光学半导体元件安装表面的光学传输线保持构件，形成在安装表面上的电互连层，以及在安装表面上具有开口的光学传输线引导孔; 插入导孔的光传输线; 安装在所述安装面上的光学半导体元件，在面向所述安装面的表面上具有电极和受光或发光区域; 电连接部，其将形成在所述半导体元件和所述安装面之间的所述电极和所述配线层电连接; 填充半导体元件与安装表面之间的连接部分周围的空间的第一树脂; 以及填充光传输线与半导体元件之间的间隙的第二树脂，具有与第一树脂不同的性质，以及制造该模块的方法。

27. 发明授权

US07394665B2 LSI package provided with interface module and method of mounting the same 失效
标题翻译： LSI封装提供了接口模块及其安装方法
公开(公告)号：US07394665B2
公开(公告)日：2008-07-01
申请号：US10778030
申请日：2004-02-17
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K7/1092 , G02B6/43 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/49109 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15192 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H05K1/0263 , H05K2201/10189 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： In a circuit module package arranged on a mounting board, a circuit module has signal input and output terminals and is mounted on an interposer. The interposer is provided with first signal terminals electrically connected to the signal input and output terminals of the circuit module, second electric terminals for electrically connecting the circuit module to the mounting board, internal wirings electrically connected to the first signal terminals, and first coupling parts electrically connected to the internal wirings. An interface module is provided with a signal transmission line for transmitting the signals and second coupling parts electrically connected to the transmission line. The second coupling part is electrically and mechanically connected to the first coupling parts, respectively.
摘要翻译：在布置在安装板上的电路模块封装中，电路模块具有信号输入和输出端子并且安装在插入器上。插入器设置有电连接到电路模块的信号输入和输出端子的第一信号端子，用于将电路模块电连接到安装板的第二电端子，电连接到第一信号端子的内部布线，以及第一耦合部件电连接到内部布线。接口模块设置有用于传输信号的信号传输线和电连接到传输线的第二耦合部分。第二耦合部分分别电连接和机械连接到第一耦合部分。

28. 发明授权

US07352935B2 Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system 有权
标题翻译：光电转换头，具有接口模块的LSI封装，光电转换头的制造方法以及光互连系统
公开(公告)号：US07352935B2
公开(公告)日：2008-04-01
申请号：US11204168
申请日：2005-08-16
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/26 , G02B6/36 , G02B6/00
CPC分类号： G02B6/25 , G02B6/255 , G02B6/4202 , G02B6/4292 , G02B6/43
摘要： In an optoelectronic conversion header, a ferrule holds an optical waveguide in a predetermined position so that an end face of the optical waveguide protrudes from an mounting surface of the ferrule. An electric wire is provided on the mounting surface of the ferrule, a optical semiconductor device is mounted on the mounting surface of the ferrule and electrically connected to the electric wire. From the end face of the optical waveguide, an optical signal is transferred in a transfer direction and the mounting surface of the ferrule is so arranged as to be deviated two degrees or more from a plane vertical to the transfer direction.
摘要翻译：在光电转换头部中，套圈将光波导保持在预定位置，使得光波导的端面从套圈的安装面突出。在套圈的安装面上设置有电线，在套圈的安装面上安装光电半导体装置，与电线电连接。从光波导的端面，沿传送方向传送光信号，并且套圈的安装表面被布置成从垂直于传送方向的平面偏离两度或更多。

29. 发明授权

US07192199B2 Optical semiconductor module and method of manufacturing the same 有权
标题翻译：光半导体模块及其制造方法
公开(公告)号：US07192199B2
公开(公告)日：2007-03-20
申请号：US11012273
申请日：2004-12-16
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/4212 , G02B6/3867 , G02B6/4239 , G02B6/4249
摘要： In an optical semiconductor module, a transparent resin spacer is interposed between an optical guide and a semiconductor device. As a result, the optical semiconductor module is formed of the minimum required members so as to suppress the influence given by the reflected light. Also, the optical semiconductor module can be manufactured without employing the manufacturing step of a high cost.
摘要翻译：在光学半导体模块中，透明树脂隔板插入在光导和半导体器件之间。结果，光半导体模块由最小要求的部件形成，以便抑制由反射光产生的影响。此外，可以在不采用高成本的制造步骤的情况下制造光学半导体模块。

30. 发明申请

US20060268522A1 Interface module-mounted LSI package 失效
公开(公告)号：US20060268522A1
公开(公告)日：2006-11-30
申请号：US11496446
申请日：2006-08-01
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/367 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/1305 , H01L2924/15311 , H01L2924/00
摘要： An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.

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