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    • 21. 发明申请
    • Infrared inspection apparatus, infrared inspecting method and manufacturing method of semiconductor wafer
    • 红外线检测装置,半导体晶片的红外检查方法及制造方法
    • US20060278831A1
    • 2006-12-14
    • US11447997
    • 2006-06-07
    • Norihisa MatsumotoShigeru Matsuno
    • Norihisa MatsumotoShigeru Matsuno
    • G01N21/59
    • G01N21/9501G01N21/59G01N21/9505
    • An infrared inspection apparatus includes: an infrared light source operable to irradiate an inspection object with infrared rays; an infrared lens operable to collect infrared rays which have passed through the inspection object; an infrared camera operable to receive the infrared rays collected by the infrared lens and to convert the infrared rays received into an electric signal to be output; a monitor operable to receive the electric signal from the infrared camera and to convert the electric signal into an image signal and to display an image based on the image signal; and an infrared ray leakage preventing member in at least one of a light path between the infrared light source and a periphery of the inspection object and a light path between the periphery of the inspection object and the infrared lens to prevent infrared rays from the infrared light source from reaching the infrared lens without passing through the inspection object.
    • 红外检查装置包括:红外光源,其可操作以用红外线照射检查对象; 红外透镜,其可操作以收集已经通过检查对象的红外线; 红外摄像机,其可操作以接收由红外线透镜收集的红外线,并将接收到的红外线转换成要输出的电信号; 监视器,其可操作以从所述红外摄像机接收电信号,并将所述电信号转换为图像信号并基于所述图像信号显示图像; 以及在所述红外线光源与所述检查对象周围的光路中的至少一个中的红外线泄漏防止部件以及所述被检查物体的周围与所述红外线透镜之间的光路,以防止来自所述红外线的红外线 来源到达红外透镜而不通过检查对象。