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21. 发明授权

US07459375B2 Transfer method for forming a silicon-on-plastic wafer 失效
标题翻译：用于形成硅塑料晶片的转移方法
公开(公告)号：US07459375B2
公开(公告)日：2008-12-02
申请号：US11891502
申请日：2007-08-10
申请人： Jer-Shen Maa , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
发明人： Jer-Shen Maa , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
IPC分类号： H01L21/44
CPC分类号： H01L21/26506 , H01L21/187 , H01L21/6835 , H01L2221/6835 , H01L2221/68368 , Y10S438/977
摘要： A method of fabricating a silicon-on-plastic layer via layer transfer includes depositing a layer of SiGe on a silicon substrate; depositing a layer of silicon; implanting splitting hydrogen ions into the silicon substrate; bonding a glass substrate to the silicon layer; splitting the wafer; removing the silicon layer and a portion of the SiGe layer; depositing a dielectric on the silicon side of the silicon-on-glass wafer; applying adhesive and bonding a plastic substrate to the silicon side of the silicon-on-glass wafer; removing the glass from the glass side of the bonded, silicon-on-glass wafer to form a silicon-on-plastic wafer; and completing a desired IC device on the silicon-on-plastic. Multi-level structure may be fabricated according to the method of the invention by repeating the last few steps of the method of the invention.
摘要翻译：通过层转移制造硅塑料层的方法包括在硅衬底上沉积SiGe层; 沉积一层硅; 将氢离子注入硅衬底; 将玻璃基板结合到硅层; 分裂晶片; 去除所述硅层和所述SiGe层的一部分; 在玻璃上硅晶片的硅侧沉积电介质; 施加粘合剂并将塑料基板粘合到硅玻璃晶片的硅侧; 从接合的硅玻璃晶片的玻璃面上移除玻璃以形成硅 - 硅晶片; 并在塑料硅胶上完成所需的IC器件。可以通过重复本发明方法的最后几个步骤，根据本发明的方法制造多层结构。

22. 发明授权

US07413939B2 Method of growing a germanium epitaxial film on insulator for use in fabrication of CMOS integrated circuit 有权
标题翻译：在绝缘体上生长用于制造CMOS集成电路的锗外延膜的方法
公开(公告)号：US07413939B2
公开(公告)日：2008-08-19
申请号：US11149891
申请日：2005-06-10
申请人： Sheng Teng Hsu , Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet
发明人： Sheng Teng Hsu , Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet
IPC分类号： H01L21/00 , H01L21/84
CPC分类号： H01L21/8221 , H01L21/84 , H01L27/0688 , H01L27/1203 , H01L29/78684
摘要： A method of fabricating a silicon-germanium CMOS includes preparing a silicon substrate wafer; depositing an insulating layer on the silicon substrate wafer; patterning and etching the insulating layer; depositing a layer of polycrystalline germanium on the insulating layer and on at least a portion of the silicon substrate wafer; patterning and etching the polycrystalline germanium; encapsulating the polycrystalline germanium with an insulating material; rapidly thermally annealing the wafer at a temperature sufficient to melt the polycrystalline germanium; cooling the wafer to promote liquid phase epitaxy of the polycrystalline germanium, thereby forming a single crystal germanium layer; and completing the CMOS device.
摘要翻译：制造硅 - 锗CMOS的方法包括制备硅衬底晶片; 在硅衬底晶片上沉积绝缘层; 图案化和蚀刻绝缘层; 在所述绝缘层和所述硅衬底晶片的至少一部分上沉积多晶锗层; 图案化和蚀刻多晶锗; 用绝缘材料封装多晶锗; 在足以熔化多晶锗的温度下快速热退火晶片; 冷却晶片以促进多晶锗的液相外延，从而形成单晶锗层; 并完成CMOS设备。

23. 发明申请

US20080173895A1 Gallium nitride on silicon with a thermal expansion transition buffer layer 审中-公开
标题翻译：具有热膨胀过渡缓冲层的硅上的氮化镓
公开(公告)号：US20080173895A1
公开(公告)日：2008-07-24
申请号：US11657149
申请日：2007-01-24
申请人： Jer-Shen Maa , Tingkai Li , Douglas J. Tweet , Gregory M. Stecker , Sheng Teng Hsu
发明人： Jer-Shen Maa , Tingkai Li , Douglas J. Tweet , Gregory M. Stecker , Sheng Teng Hsu
IPC分类号： H01L29/267 , H01L21/20
CPC分类号： H01L29/267 , H01L21/02381 , H01L21/02433 , H01L21/0245 , H01L21/02458 , H01L21/02502 , H01L21/0251 , H01L21/0254 , H01L21/02656 , H01L29/045 , H01L29/2003
摘要： A method is provided for forming a matching thermal expansion interface between silicon (Si) and gallium nitride (GaN) films. The method provides a (111) Si substrate with a first thermal expansion coefficient (TEC), and forms a silicon-germanium (SiGe) film overlying the Si substrate. A buffer layer is deposited overlying the SiGe film. The buffer layer may be aluminum nitride (AlN) or aluminum-gallium nitride (AlGaN). A GaN film is deposited overlying the buffer layer having a second TEC, greater than the first TEC. The SiGe film has a third TEC, with a value in between the first and second TECs. In one aspect, a graded SiGe film may be formed having a Ge content ratio in a range of about 0% to 50%, where the Ge content increases with the graded SiGe film thickness.
摘要翻译：提供了一种在硅（Si）和氮化镓（GaN）膜之间形成匹配的热膨胀界面的方法。该方法提供具有第一热膨胀系数（TEC）的（111）Si衬底，并且形成覆盖Si衬底的硅 - 锗（SiGe）膜。沉积SiGe膜上的缓冲层。缓冲层可以是氮化铝（AlN）或铝 - 氮化镓（AlGaN）。沉积GaN缓冲层，其具有大于第一TEC的第二TEC。 SiGe电影拥有第三个TEC，其值在第一和第二TEC之间。一方面，可以形成具有Ge含量比在约0％至50％的范围内的等级SiGe膜，其中Ge含量随着梯度SiGe膜厚度而增加。

24. 发明申请

US20080121805A1 Ge short wavelength infrared imager 有权
标题翻译： Ge短波长红外成像仪
公开(公告)号：US20080121805A1
公开(公告)日：2008-05-29
申请号：US11592465
申请日：2006-11-04
申请人： Douglas J. Tweet , Jer-Shen Maa , Jong-Jan Lee , Sheng Teng Hsu
发明人： Douglas J. Tweet , Jer-Shen Maa , Jong-Jan Lee , Sheng Teng Hsu
IPC分类号： H01L31/028 , H01L31/18
CPC分类号： H01L31/1055 , H01L27/14643 , H01L27/14689
摘要： A germanium (Ge) short wavelength infrared (SWIR) imager and associated fabrication process are provided. The imager comprises a silicon (Si) substrate with doped wells. An array of pin diodes is formed in a relaxed Ge-containing film overlying the Si substrate, each pin diode having a flip-chip interface. There is a Ge/Si interface, and a doped Ge-containing buffer interposed between the Ge-containing film and the Ge/Si interface. An array of Si CMOS readout circuits is bonded to the flip-chip interfaces. Each readout circuit has a zero volt diode bias interface.
摘要翻译：提供锗（Ge）短波长红外（SWIR）成像器和相关制造工艺。该成像器包括具有掺杂阱的硅（Si）衬底。在位于Si衬底上的松弛的含Ge膜中形成一个pin二极管阵列，每个pin二极管具有倒装芯片接口。存在Ge / Si界面和插入含Ge膜和Ge / Si界面之间的含掺杂Ge的缓冲层。 Si CMOS读出电路阵列结合到倒装芯片接口。每个读出电路都具有零伏二极管偏置接口。

25. 发明授权

US07361528B2 Germanium infrared sensor for CMOS imagers 有权
标题翻译：锗红外传感器用于CMOS成像器
公开(公告)号：US07361528B2
公开(公告)日：2008-04-22
申请号：US11069422
申请日：2005-02-28
申请人： Jong-Jan Lee , Jer-Shen Maa , Sheng Teng Hsu , Douglas J. Tweet
发明人： Jong-Jan Lee , Jer-Shen Maa , Sheng Teng Hsu , Douglas J. Tweet
IPC分类号： H01L21/00 , H01L21/8238 , H01L21/46 , H01L21/44
CPC分类号： H01L27/14634 , H01L27/14649 , H01L27/14689 , H01L27/1469 , H01L31/028 , H01L31/103 , H01L31/1804 , H01L31/1808 , H01L31/1864 , Y02E10/547 , Y02P70/521
摘要： A method of fabricating a germanium infrared sensor for a CMOS imager includes preparation of a donor wafer, including: ion implantation into a silicon wafer to form a P+ silicon layer; growing an epitaxial germanium layer on the P+silicon layer, forming a silicon-germanium interface; cyclic annealing; and implanting hydrogen ions to a depth at least as deep as the P+ silicon layer to form a defect layer; preparing a handling wafer, including: fabricating a CMOS integrated circuit on a silicon substrate; depositing a layer of refractory metal; treating the surfaces of the donor wafer and the handling wafer for bonding; bonding the handling wafer and the donor wafer to form a bonded structure; splitting the bonded structure along the defect layer; depositing a layer of indium tin oxide on the germanium layer; completing the IR sensor.
摘要翻译：制造用于CMOS成像器的锗红外传感器的方法包括：制备施主晶片，包括：离子注入到硅晶片中以形成P +硅层; 在P +硅层上生长外延锗层，形成硅 - 锗界面; 循环退火; 以及将氢离子注入至少与P +硅层一样深的深度以形成缺陷层; 制备处理晶片，包括：在硅衬底上制造CMOS集成电路; 沉积难熔金属层; 处理供体晶片的表面和用于结合的处理晶片; 结合处理晶片和施主晶片以形成结合结构; 沿着缺陷层分离粘结结构; 在锗层上沉积一层氧化铟锡; 完成IR传感器。

26. 发明授权

US07361526B2 Germanium photo detector having planar surface through germanium epitaxial overgrowth 有权
标题翻译：锗光电检测器具有通过锗外延过度生长的平面
公开(公告)号：US07361526B2
公开(公告)日：2008-04-22
申请号：US11353802
申请日：2006-02-13
申请人： Jer-Shen Maa , Jong-Jan Lee , Sheng Teng Hsu , Douglas J. Tweet
发明人： Jer-Shen Maa , Jong-Jan Lee , Sheng Teng Hsu , Douglas J. Tweet
IPC分类号： H01L21/00
CPC分类号： H01L31/1808 , H01L21/02532 , H01L21/02576 , H01L21/02647 , H01L31/105 , Y02E10/50
摘要： A method of fabricating a germanium photo detector includes preparing a silicon substrate wafer and depositing and planarizing a silicon oxide layer on the silicon substrate. Contact holes are formed in the silicon oxide layer. An N+ epitaxial germanium layer is grown on the silicon oxide layer and in the contact holes. An N+ germanium layer is formed by ELO. The structure is smoothed and thinned. An intrinsic germanium layer is grown on the N+ epitaxial germanium layer. A P+ germanium layer is formed on the intrinsic germanium layer and a silicon oxide overcoat is deposited. A window is opened through the silicon oxide overcoat to the P+ germanium layer. A layer of conductive material is deposited on the silicon oxide overcoat and in the windows therein. The conductive material is etched to form individual sensing elements.
摘要翻译：制造锗光电检测器的方法包括制备硅衬底晶片并在硅衬底上沉积并平面化氧化硅层。在氧化硅层中形成接触孔。在氧化硅层和接触孔中生长N +外延锗层。 N +锗层由ELO形成。结构平滑和变薄。内在锗层生长在N +外延锗层上。在本征锗层上形成P +锗层，并沉积氧化硅外涂层。通过氧化硅外涂层向P +锗层打开窗口。一层导电材料沉积在氧化硅外涂层和其中的窗口中。蚀刻导电材料以形成各个感测元件。

27. 发明授权

US07358107B2 Method of fabricating a germanium photo detector on a high quality germanium epitaxial overgrowth layer 有权
标题翻译：在高质量锗外延生长层上制造锗光电探测器的方法
公开(公告)号：US07358107B2
公开(公告)日：2008-04-15
申请号：US11260955
申请日：2005-10-27
申请人： Jer-Shen Maa , Jong-Jan Lee , Sheng Teng Hsu , Douglas J. Tweet
发明人： Jer-Shen Maa , Jong-Jan Lee , Sheng Teng Hsu , Douglas J. Tweet
IPC分类号： H01L21/00
CPC分类号： H01L31/1808 , H01L21/02532 , H01L21/02576 , H01L21/02647 , H01L31/105 , Y02E10/50
摘要： A method of fabricating a germanium photo detector includes preparing a silicon substrate; depositing and planarizing a silicon oxide layer; forming contact holes in the silicon oxide layer which communicate with the underlying silicon substrate; growing an epitaxial germanium layer of a first type on the silicon oxide layer and in the contact holes; growing an intrinsic germanium layer on the epitaxial germanium layer and any exposed silicon oxide layer; growing a germanium layer of a second type on the intrinsic germanium layer and any exposed silicon oxide layer; depositing a layer of covering material take from the group of materials consisting of polysilicon, polysilicon-germanium and In2O3—SnO2; and etching the covering material to form individual sensing elements.
摘要翻译：制造锗光电检测器的方法包括制备硅衬底; 沉积和平坦化氧化硅层; 在氧化硅层中形成与底层硅衬底连通的接触孔; 在氧化硅层和接触孔中生长第一类型的外延锗层; 在外延锗层和任何暴露的氧化硅层上生长内在的锗层; 在内部锗层和任何暴露的氧化硅层上生长第二类型的锗层; 沉积一层覆盖材料取自由多晶硅，多晶硅 - 锗和In 2 N 3 O 3 -SnO 2 2组成的材料组。并蚀刻覆盖材料以形成单独的感测元件。

28. 发明授权

US07247545B2 Fabrication of a low defect germanium film by direct wafer bonding 失效
标题翻译：通过直接晶片接合制造低缺陷锗膜
公开(公告)号：US07247545B2
公开(公告)日：2007-07-24
申请号：US10985444
申请日：2004-11-10
申请人： Jer-Shen Maa , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
发明人： Jer-Shen Maa , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L21/76254 , H01L21/02052 , H01L21/02381 , H01L21/0245 , H01L21/02502 , H01L21/02532 , H01L21/0262
摘要： A method of fabricating a low defect germanium thin film includes preparing a silicon wafer for germanium deposition; forming a germanium film using a two-step CVD process, annealing the germanium thin film using a multiple cycle process; implanting hydrogen ions; depositing and smoothing a layer of tetraethylorthosilicate oxide (TEOS); preparing a counter wafer; bonding the germanium thin film to a counter wafer to form a bonded structure; annealing the bonded structure at a temperature of at least 375° C. to facilitate splitting of the bonded wafer; splitting the bonded structure to expose the germanium thin film; removing any remaining silicon from the germanium thin film surface along with a portion of the germanium thin film defect zone; and incorporating the low-defect germanium thin film into the desired end-product device.
摘要翻译：制造低缺陷锗薄膜的方法包括制备用于锗沉积的硅晶片; 使用两步CVD工艺形成锗膜，使用多循环工艺退火锗薄膜; 植入氢离子; 沉积和平滑一层四乙基原硅酸盐氧化物（TEOS）; 准备一个反晶圆; 将锗薄膜结合到对置晶片上以形成结合结构; 在至少375℃的温度下对接合结构进行退火以促进键合晶片的分裂; 分离粘结结构以暴露锗薄膜; 从锗薄膜表面除去锗薄膜缺陷区的一部分剩余的硅; 并将低缺陷锗薄膜并入期望的最终产品装置中。

29. 发明授权

US07138309B2 Integration of biaxial tensile strained NMOS and uniaxial compressive strained PMOS on the same wafer 有权
标题翻译：将双轴拉伸应变NMOS和单轴压应变PMOS集成在同一晶圆上
公开(公告)号：US07138309B2
公开(公告)日：2006-11-21
申请号：US11039542
申请日：2005-01-19
申请人： Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet , Sheng Teng Hsu
发明人： Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet , Sheng Teng Hsu
IPC分类号： H01L21/8234 , H01L21/8238
CPC分类号： H01L29/7842 , H01L21/76254 , H01L21/823807 , H01L21/823814 , H01L21/823828 , H01L21/84 , H01L27/1203
摘要： A method of fabricating a biaxial tensile strained layer for NMOS fabrication and a uniaxial compressive strained layer for PMOS fabrication on a single wafer for use in CMOS ICs, includes preparing a silicon substrate for CMOS fabrication; depositing, patterning and etching a first and second insulating layers; removing a portion of the second insulating layer from a PMOS active area; depositing a layer of epitaxial silicon on the PMOS active area; removing a portion of the second insulating layer from an NMOS active area; growing an epitaxial silicon layer and growing an epitaxial SiGe layer on the NMOS active area; implanting H2+ ions; annealing the wafer to relax the SiGe layer; removing the remaining second insulating layer from the wafer; growing a layer of silicon; finishing a gate module; depositing a layer of SiO2 to cover the NMOS wafer; etching silicon in the PMOS active area; selectively growing a SiGe layer on the PMOS active area; wherein the silicon layer in the NMOS active area is under biaxial tensile strain, and the silicon layer in the PMOS active area is uniaxial compressive strained; and completing the CMOS device.
摘要翻译：制造用于NMOS制造的双轴拉伸应变层的方法和用于CMOS IC的单个晶片上的用于PMOS制造的单轴压缩应变层包括制备用于CMOS制造的硅衬底; 沉积，图案化和蚀刻第一和第二绝缘层; 从PMOS有源区域去除所述第二绝缘层的一部分; 在PMOS有源区上沉积一层外延硅; 从NMOS有源区域去除所述第二绝缘层的一部分; 生长外延硅层并在NMOS有源区上生长外延SiGe层; 注入H 2 O 2 + + / - +离子; 退火晶片以松弛SiGe层; 从晶片上去除剩余的第二绝缘层; 生长一层硅; 完成门模块; 沉积SiO 2层以覆盖NMOS晶片; 蚀刻PMOS有源区中的硅; 在PMOS有源区上选择性地生长SiGe层; 其中所述NMOS有源区中的硅层处于双轴拉伸应变下，并且所述PMOS有源区中的硅层是单轴压缩应变的; 并完成CMOS设备。

30. 发明授权

US07071042B1 Method of fabricating silicon integrated circuit on glass 失效
标题翻译：在玻璃上制造硅集成电路的方法
公开(公告)号：US07071042B1
公开(公告)日：2006-07-04
申请号：US11073163
申请日：2005-03-03
申请人： Jer-Shen Maa , Sheng Teng Hsu , Jong-Jan Lee , Douglas J. Tweet
发明人： Jer-Shen Maa , Sheng Teng Hsu , Jong-Jan Lee , Douglas J. Tweet
IPC分类号： H01L21/84
CPC分类号： H01L29/66757 , H01L27/12 , H01L29/78603 , H01L29/78606
摘要： A method of fabricating a silicon integrated circuit on a glass substrate includes preparing a glass substrate; fabricating a silicon layer on the glass substrate; implanting ions into the active areas of the silicon layer; covering the silicon layer with a heat pad material; activating the ions in the silicon layer by annealing while maintaining the glass substrate at a temperature below that of the thermal stability of the glass substrate; removing the heat pad material; and completing the silicon integrated circuit.
摘要翻译：在玻璃基板上制造硅集成电路的方法包括制备玻璃基板; 在玻璃基板上制造硅层; 将离子注入硅层的有源区; 用加热垫材料覆盖硅层; 通过退火激活硅层中的离子，同时将玻璃基板保持在低于玻璃基板的热稳定性的温度; 去除热垫材料; 并完成硅集成电路。

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