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21. 发明授权

US06891724B2 Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD 失效
标题翻译：使用碳纳米管和CVD增加热界面的导热性
公开(公告)号：US06891724B2
公开(公告)日：2005-05-10
申请号：US10170313
申请日：2002-06-12
申请人： David S. De Lorenzo , Stephen W. Montgomery , Robert J. Fite
发明人： David S. De Lorenzo , Stephen W. Montgomery , Robert J. Fite
IPC分类号： H01L23/373 , H05K7/20
CPC分类号： H01L23/3732 , B82Y10/00 , H01L23/373 , H01L2924/0002 , Y10S977/833 , Y10T428/24975 , Y10T428/30 , H01L2924/00
摘要： The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.
摘要翻译：本发明涉及一种形成集成电路封装的结构和工艺，该集成电路封装利用具有固定在该层的表面上的碳纳米管排列阵列的热界面材料层。热界面材料是通过化学气相沉积金刚石沉积的。碳纳米管通过CVDD表面上的等离子体放电处理而形成，也可以在模具的表面上形成。

22. 发明授权

US06643132B2 Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system 失效
标题翻译：机箱级热接口组件，用于从计算机系统的电子部件传输热量
公开(公告)号：US06643132B2
公开(公告)日：2003-11-04
申请号：US10039003
申请日：2002-01-04
申请人： Barrett M. Faneuf , David S. De Lorenzo
发明人： Barrett M. Faneuf , David S. De Lorenzo
IPC分类号： H05K720
CPC分类号： H05K7/20809 , G06F1/20
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

23. 发明授权

US08068054B2 Receiver with means for ensuring bona fide of received signals 有权
标题翻译：接收机具有确保收到信号的真实性的手段
公开(公告)号：US08068054B2
公开(公告)日：2011-11-29
申请号：US12012470
申请日：2008-02-02
申请人： Peter Levin , David S. De Lorenzo , Per K. Enge , Sherman C. Lo
发明人： Peter Levin , David S. De Lorenzo , Per K. Enge , Sherman C. Lo
IPC分类号： G01S19/03 , G01S19/09 , G01S19/32
CPC分类号： G01S19/21 , G01S19/29
摘要： A receiver that receives a plurality of signals that are modulated with a common carrier, where each signal of said signals originates at a different source and experiences a transit delay and Doppler frequency shift before reaching the receiver, and where the transit delay and Doppler frequency shift are related to position and movement of each of the respective sources. The receiver includes means, such as a directional antenna, to ensure that the received signals are bona fide, or at least not subject to the same bogus signal or signals to which a second receiver may be subjected.
摘要翻译：接收器，其接收由公共载波调制的多个信号，其中所述信号的每个信号源于不同的源，并且在到达接收机之前经历传输延迟和多普勒频移，并且其中传输延迟和多普勒频移与各个源的位置和移动有关。接收机包括诸如定向天线的装置，以确保所接收的信号是真实的，或者至少不受第二接收机可能遭受的相同的虚假信号或信号的影响。

24. 发明申请

US20100284442A1 Authenticating a signal based on an unknown component thereof 有权
标题翻译：基于其未知分量验证信号
公开(公告)号：US20100284442A1
公开(公告)日：2010-11-11
申请号：US12012416
申请日：2008-02-02
申请人： Peter Levin , David S. De Lorenzo , Per K. Enge , Sherman C. Lo
发明人： Peter Levin , David S. De Lorenzo , Per K. Enge , Sherman C. Lo
IPC分类号： H04L27/06 , H04B1/707
CPC分类号： H04B1/707 , H04B2201/70715
摘要： Authentication of a signal, signalA, that is provided as having been received from a source at a first global location by comparing it to a signal that is received from the source at a second global location, signalB, where signalB contains an unknown signal that is unique to the source, and determining that signalA contains the same unknown signal that is contained in signalB.
摘要翻译：通过将其与在第二全局位置处的源接收的信号进行比较而被提供为从第一全局位置的源接收的信号的信号A，信号B，其中信号B包含未知信号，并且确定信号A包含与signalB中包含的相同的未知信号。

25. 发明授权

US07233491B2 Frame-level thermal interface component for transfer of heat from an electronic component of a computer system 有权
标题翻译：用于从计算机系统的电子部件传送热量的帧级热接口部件
公开(公告)号：US07233491B2
公开(公告)日：2007-06-19
申请号：US11415559
申请日：2006-05-01
申请人： Barrett M. Faneuf , David S. De Lorenzo
发明人： Barrett M. Faneuf , David S. De Lorenzo
IPC分类号： H05K7/20
CPC分类号： H05K7/20809
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

26. 发明授权

US06493233B1 PCB-to-chassis mounting schemes 失效
标题翻译： PCB到机箱安装方案
公开(公告)号：US06493233B1
公开(公告)日：2002-12-10
申请号：US09934871
申请日：2001-08-21
申请人： David S. De Lorenzo , Casey R. Winkel
发明人： David S. De Lorenzo , Casey R. Winkel
IPC分类号： H05K714
CPC分类号： H05K3/325 , H05K7/142
摘要： A method and assembly for mounting printed circuit boards (PCBs) to a chassis. In one embodiment, a plurality of internally-threaded mounting posts are secured (e.g., press-fit) to the chassis and the PCB includes a plurality of holes into which the mounting posts extend. Each hole includes a pair of keepout pads to isolate internal PCB circuitry (other than ground planes) from electric contact with the assembly components. A threaded faster is used to secure the assembly. In another embodiment, a collar is added to the assembly and the extending portion of the post is elongated such that it extends into the collar, providing additional thread engagement for thinner PCBs. In a third embodiment, hat-section components are secured (e.g., via wave soldering) over respective holes in the PCB. The hat-section component includes a counterbore through which the threaded fastener passes and is sized to receive a portion of a threaded standoff.
摘要翻译：用于将印刷电路板（PCB）安装到底盘的方法和组件。在一个实施例中，多个内螺纹安装柱固定（例如压配合）到底盘，并且PCB包括多个孔，安装柱延伸到该孔中。每个孔包括一对保护板，用于将内部PCB电路（除接地平面）与电气接触部件组装在一起。更快的螺纹用于固定组件。在另一个实施例中，将套环添加到组件中并且柱的延伸部分是细长的，使得其延伸到套环中，为更薄的PCB提供额外的螺纹接合。在第三实施例中，帽部分部件通过PCB中的各个孔固定（例如通过波峰焊）。帽部分部件包括一个沉孔，螺纹紧固件通过该沉孔穿过，并且其尺寸被设计成接收螺纹支座的一部分。

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