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21. 发明授权

US06229708B1 Multi-axis microprocess or docking mechanism 失效
标题翻译：多轴微处理或对接机制
公开(公告)号：US06229708B1
公开(公告)日：2001-05-08
申请号：US09276336
申请日：1999-03-25
申请人： John Saunders Corbin, Jr. , David Allen Hall , Kenneth Carl Larsen , Mark Wayne Mueller , Peter Matthew Thomsen
发明人： John Saunders Corbin, Jr. , David Allen Hall , Kenneth Carl Larsen , Mark Wayne Mueller , Peter Matthew Thomsen
IPC分类号： H05K700
CPC分类号： H05K7/1431
摘要： A mechanism has a subassembly that contains a microprocessor. The mechanism allows the microprocessor to be easily installed through frontal or rear access into a rack drawer and subsequently docked into a receiving assembly. The docking mechanism is multi-axis in that installation of the subassembly occurs along a single axis, but docking of the microprocessor occurs along an axis that is normal to the installation axis. Actuation of the installation mechanism is accomplished with a front-to-rear motion which sequentially provides a power connection to the microprocessor and displaces it in a vertical motion. This vertical motion registers and mates the microprocessor with the assembly. The microprocessor is preloaded in its final latched position to restrain it from shock and vibration events while supporting the assembly in a fixed and stable position.
摘要翻译：机构具有包含微处理器的子组件。该机构允许微处理器通过正面或后部访问容易地安装到机架抽屉中，并随后对接到接收组件中。对接机构是多轴的，因为子组件的安装沿着单个轴线发生，但是微处理器沿着垂直于安装轴线的轴发生。安装机构的启动是通过前后运动完成的，其顺序地提供到微处理器的电力连接并以垂直运动来移位。该垂直运动将微处理器与组件对齐并配合。微处理器预先装载在其最终的锁定位置，以将其组装在一个固定和稳定的位置上，以防止其受到冲击和振动。

22. 发明授权

US5713690A Apparatus for attaching heatsinks 失效
标题翻译：用于连接散热器的装置
公开(公告)号：US5713690A
公开(公告)日：1998-02-03
申请号：US653893
申请日：1996-05-28
申请人： John Saunders Corbin, Jr. , Ciro Neal Ramirez
发明人： John Saunders Corbin, Jr. , Ciro Neal Ramirez
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , Y10T403/47 , Y10T403/477
摘要： A method and apparatus for attaching heatsinks having a disproportional size relative to the electronic component to which they are attached. In general, the apparatus comprises variable-length attaching means for attaching each corner of the heatsink to the circuit card while maintaining sufficient contact with the electronic component. The variable-length attaching means includes a post and a receiving well. Both the post and receiving well include attaching means, such as threads and nuts, for attachment to the heatsink and circuit board, respectively. The variable-length attaching means accommodates height variations between parts, establishes high structural integrity after assembly, controls static and dynamic loading of the solder columns, allows for module re-work while re-using the heatsink and card, and provides adequate protection from shock, vibration, and handling.
摘要翻译：一种用于连接相对于它们所连接的电子部件具有不成比例尺寸的散热器的方法和装置。通常，该装置包括可变长度的附接装置，用于将散热器的每个角连接到电路卡，同时保持与电子部件的充分接触。可变长度附接装置包括柱和接收井。柱和接收井都分别包括用于附接到散热器和电路板的附接装置，例如螺纹和螺母。可变长度的连接装置适应部件之间的高度变化，在组装之后建立高结构完整性，控制焊料柱的静态和动态负载，允许模块在重新使用散热器和卡片时重新工作，并提供足够的防震保护，振动和处理。

23. 发明授权

US06504105B1 Solder ball connections and assembly process 失效
标题翻译：焊球连接和组装过程
公开(公告)号：US06504105B1
公开(公告)日：2003-01-07
申请号：US08640645
申请日：1996-05-01
申请人： John Acocella , Donald Ray Banks , Joseph Angelo Benenati , Thomas Caulfield , Karl Grant Hoebener , David P. Watson , John Saunders Corbin, Jr.
发明人： John Acocella , Donald Ray Banks , Joseph Angelo Benenati , Thomas Caulfield , Karl Grant Hoebener , David P. Watson , John Saunders Corbin, Jr.
IPC分类号： H05K103
CPC分类号： B23K1/0008 , B23K1/0016 , B23K2101/36 , B23K2101/40 , B23K2101/42 , H01L21/4853 , H01L21/486 , H01L23/488 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L2224/81191 , H01L2224/814 , H01L2924/00013 , H01L2924/09701 , H05K1/114 , H05K3/3436 , H05K3/3452 , H05K3/3478 , H05K3/42 , H05K3/429 , H05K2201/0215 , H05K2201/10234 , H05K2201/10734 , H05K2201/10992 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0415 , H05K2203/0455 , H05K2203/082 , Y02P70/613 , Y10T29/49126 , Y10T29/49144 , H01L2224/29099 , H01L2924/014
摘要： High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.
摘要翻译：高熔点温度Pb / Sn 95/5焊球通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底底部的铜焊盘上。通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊锡球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。该结构被回流以同时熔化球的两侧的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。该过程导致在高温循环下更可靠的结构。此外，为了进一步提高可靠性，将球制成为尽可能大的I / O间距，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。

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