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21. 发明授权

US08183592B2 Light emitting device having a pluralilty of light emitting cells and package mounting the same 有权
标题翻译：具有多个发光单元的发光器件和安装它们的封装
公开(公告)号：US08183592B2
公开(公告)日：2012-05-22
申请号：US13239132
申请日：2011-09-21
申请人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L33/00 , H01L51/40 , H01L21/44
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
摘要翻译：发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。多个发光单元被接合到副安装座基板。从发光单元产生的热可以容易地消散，从而可以减少发光器件上的热负荷。由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

22. 发明授权

US08070983B2 Luminescent material 有权
标题翻译：发光材料
公开(公告)号：US08070983B2
公开(公告)日：2011-12-06
申请号：US11024722
申请日：2004-12-30
申请人： Gundula Roth , Walter Tews , Chung Hoon Lee
发明人： Gundula Roth , Walter Tews , Chung Hoon Lee
IPC分类号： C09K11/55
CPC分类号： C09K11/7734 , C09K11/58 , C09K11/592 , C09K11/66 , C09K11/665 , C09K11/666 , C09K11/7457 , C09K11/753 , C09K11/756 , C09K11/757 , C09K11/758 , C09K11/7706 , C09K11/7707 , C09K11/7709 , C09K11/7714 , C09K11/7735 , C09K11/7737 , C09K11/7738 , C09K11/7739 , C09K11/774 , C09K11/7742 , C09K11/7783 , C09K11/7792
摘要： This invention relates to luminescent materials for ultraviolet light or visible light excitation containing lead and/or copper doped chemical compounds. The luminescent material is composed of one or more than one compounds of aluminate type, silicate type, antimonate type, germanate/or germanate-silicate type, and/or phosphate type. Accordingly, the present invention is a good possibility to substitute earth alkaline ions by lead and copper for a shifting of the emission bands to longer or shorter wave length, respectively. Luminescent compounds containing copper and/or lead with improved luminescent properties and also with improved stability against water, humidity as well as other polar solvents are provided. The present invention is to provide lead and/or copper doped luminescent compounds, which has high color temperature range about 2,000K to 8,000K or 10,000K and CRI over 90.
摘要翻译：本发明涉及含有铅和/或铜掺杂化合物的紫外光或可见光激发用发光材料。发光材料由一种或多种铝酸盐型，硅酸盐型，锑酸盐型，锗酸盐或/或锗酸盐 - 硅酸盐型和/或磷酸盐型的化合物组成。因此，本发明很有可能用铅和铜代替碱土离子，将发射带分别移动到更长或更短的波长。提供含有铜和/或铅的发光化合物，其具有改善的发光性能，并且还具有改善的对水，湿度以及其它极性溶剂的稳定性。本发明提供铅和/或铜掺杂的发光化合物，其具有大约2000K至8,000K或10,000K的高色温，以及90以上的CRI。

23. 发明授权

US07842219B2 Mold for forming a molding member and method of fabricating a molding member using the same 有权
标题翻译：用于形成模制构件的模具和使用其形成模制构件的方法
公开(公告)号：US07842219B2
公开(公告)日：2010-11-30
申请号：US11995196
申请日：2006-06-26
申请人： Jung Hwa Jung , Chung Hoon Lee
发明人： Jung Hwa Jung , Chung Hoon Lee
IPC分类号： B29C45/14 , B29C45/26 , H01L21/56
CPC分类号： H01L21/565 , B29C33/10 , B29C39/006 , B29C39/10 , B29C39/26 , B29C45/14655 , B29C45/34 , B29L2011/00 , H01L23/49861 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2924/00014
摘要： There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.
摘要翻译：提供了用于形成模制构件的模具和使用其形成模制构件的方法。模具包括上表面和具有外周表面和由外周围包围的凹面的下表面。注射和排出孔从上表面延伸到下表面。因此，在模具和包装件联接成使得排出孔向上指向之后，可以通过从注射孔注入成型材料而在包装上形成成型构件，由此可以防止气泡被捕获模制构件。

24. 发明申请

US20100213468A1 LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME 有权
标题翻译：具有多个发光单元的发光装置及其制造方法
公开(公告)号：US20100213468A1
公开(公告)日：2010-08-26
申请号：US12774525
申请日：2010-05-05
申请人： Chung Hoon Lee , Hong San Kim , James S. Speck
发明人： Chung Hoon Lee , Hong San Kim , James S. Speck
IPC分类号： H01L33/02 , H01L33/48 , H01L33/62
CPC分类号： H01L27/153 , H01L33/62 , H01L33/64 , H01L2224/48095 , H01L2224/73265 , H01L2924/01012 , H01L2924/01079
摘要： Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source. In addition, since the semi-insulating buffer layer is employed, it is possible to prevent an increase in a leakage current through the thermally conductive substrate and between the light emitting cells.
摘要翻译：公开了具有多个发光单元的发光器件。发光器件包括具有高于蓝宝石衬底的热导率的导热衬底，例如SiC衬底。多个发光单元串联连接在导热基板上。同时，在导热基板和发光单元之间插入半绝缘缓冲层。例如，半绝缘缓冲层可以由AlN或半绝缘GaN形成。由于采用具有高于蓝宝石基板的导热性的导热性基板，所以与以往的蓝宝石基板相比，能够提高散热性能，从而能够增大驱动下的发光元件的最大光输出高压交流电源。此外，由于采用了半绝缘缓冲层，因此可以防止通过导热基板和发光单元之间的漏电流的增加。

25. 发明授权

US07361940B2 Leadframe and packaged light emitting diode 有权
标题翻译：引线框和封装发光二极管
公开(公告)号：US07361940B2
公开(公告)日：2008-04-22
申请号：US11178144
申请日：2005-07-08
申请人： Do Hyung Kim , Chung Hoon Lee , Keon Young Lee
发明人： Do Hyung Kim , Chung Hoon Lee , Keon Young Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L23/4334 , H01L24/48 , H01L25/0753 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2924/00014 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.
摘要翻译：被配置为与诸如发光二极管（LED）的电子设备一起使用的引线框架包括用于支撑散热器的散热器支撑环。外框架与散热器支撑环间隔开，并且包围散热器支撑环。至少一个支撑引线连接散热器支撑环和外框。分离的引线从外框架朝向散热器支撑环延伸，并且与散热器支撑环间隔开。可以在散热器之后通过注射成型形成的封装体插入引线框架中。

26. 发明授权

US06858888B2 Stress control of semiconductor microstructures for thin film growth 有权
标题翻译：用于薄膜生长的半导体微结构的应力控制
公开(公告)号：US06858888B2
公开(公告)日：2005-02-22
申请号：US10302777
申请日：2002-11-22
申请人： Amit Lal , Max G. Lagally , Chung Hoon Lee , Paul Powell Rugheimer
发明人： Amit Lal , Max G. Lagally , Chung Hoon Lee , Paul Powell Rugheimer
IPC分类号： B81B3/00 , B81C1/00 , H01L29/04 , H01L29/786 , H01L29/80 , H01L29/82 , H01L31/036 , H01L31/112
CPC分类号： B81C1/00666 , B81C2201/0167 , B82Y10/00 , B82Y30/00 , H01L29/78603 , H01L29/78639 , Y10S438/962
摘要： A suspended semiconductor film is anchored to a substrate at at least two opposed anchor positions, and film segments are deposited on the semiconductor film adjacent to one or more of the anchor positions to apply either tensile or compressive stress to the semiconductor film between the film segments. A crystalline silicon film may be anchored to the substrate and have tensile stress applied thereto to reduce the lattice mismatch between the silicon and a silicon-germanium layer deposited onto the silicon film. By controlling the level of stress in the silicon film, the size, density and distribution of quantum dots formed in a high germanium content silicon-germanium film deposited on the silicon film can be controlled.
摘要翻译：悬浮的半导体膜在至少两个相对的锚固位置处锚定到基底，并且膜部分沉积在与一个或多个锚定位置相邻的半导体膜上，以将拉伸或压缩应力施加到膜段之间的半导体膜。结晶硅膜可以锚定到基底并且施加拉伸应力以减小硅和沉积在硅膜上的硅 - 锗层之间的晶格失配。通过控制硅膜中的应力水平，可以控制沉积在硅膜上的高锗含量硅 - 锗膜中形成的量子点的尺寸，密度和分布。

27. 发明授权

US08963173B2 Light emitting device having strontium oxyorthosilicate type phosphors 有权
标题翻译：具有氧化硅酸锶型荧光体的发光器件
公开(公告)号：US08963173B2
公开(公告)日：2015-02-24
申请号：US12972996
申请日：2010-12-20
申请人： Chung Hoon Lee , Walter Tews , Gundula Roth , Detlef Starick
发明人： Chung Hoon Lee , Walter Tews , Gundula Roth , Detlef Starick
IPC分类号： H01L29/20 , C09K11/77 , H01L33/50 , H01L33/64
CPC分类号： C09K11/7734 , H01L33/50 , H01L33/647 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Exemplary embodiments of the present invention relate to light emitting devices including strontium oxyorthosilicate-type phosphors. The light emitting device includes a light emitting diode, which emits light in the UV or visible range, and phosphors disposed around the light emitting diode to absorb light emitted from the light emitting diode and emit light having a different wavelength from the absorbed light. The phosphors include an oxyorthosilicate phosphor having a general formula of Sr3-x-y-zCaxMIIySiO5: Euz with a calcium molar fraction in the range of 0
摘要翻译：本发明的示例性实施例涉及包括氧化硅酸锶型磷光体的发光器件。发光装置包括发射紫外或可见光范围的光的发光二极管，以及设置在发光二极管周围的荧光体，以吸收从发光二极管发出的光并发射具有与吸收光不同的波长的光。磷光体包括具有通式Sr3-x-y-zCaxMIIySiO5：Euz的氧化正硅酸盐荧光体，钙摩尔分数在0

28. 发明授权

US08610138B2 LED package having an array of light emitting cells coupled in series 有权
公开(公告)号：US08610138B2
公开(公告)日：2013-12-17
申请号：US13296735
申请日：2011-11-15
申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuok Jung Choi
发明人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuok Jung Choi
IPC分类号： H01L33/64
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

29. 发明授权

US08575594B2 Light emitting diode having a barrier layer with a superlattice structure 有权
标题翻译：具有超晶格结构的阻挡层的发光二极管
公开(公告)号：US08575594B2
公开(公告)日：2013-11-05
申请号：US13406313
申请日：2012-02-27
申请人： Chung Hoon Lee , Ki Bum Nam , Dae Sung Kal
发明人： Chung Hoon Lee , Ki Bum Nam , Dae Sung Kal
IPC分类号： H01L29/06
CPC分类号： H01L33/32 , H01L33/06 , H01L33/16
摘要： A light emitting diode (LED) for minimizing crystal defects in an active region and enhancing recombination efficiency of electrons and holes in the active region includes non-polar GaN-based semiconductor layers grown on a non-polar substrate. The semiconductor layers include a non-polar N-type semiconductor layer, a non-polar P-type semiconductor layer, and non-polar active region layers positioned between the N-type semiconductor layer and the P-type semiconductor layer. The non-polar active region layers include a well layer and a barrier layer with a superlattice structure.
摘要翻译：用于最小化有源区中的晶体缺陷并提高有源区中的电子和空穴的复合效率的发光二极管（LED）包括在非极性衬底上生长的非极性GaN基半导体层。半导体层包括非极性N型半导体层，非极性P型半导体层和位于N型半导体层和P型半导体层之间的非极性有源区。非极性有源区层包括阱层和具有超晶格结构的势垒层。

30. 发明授权

US08536612B2 Light emitting device having a pluralilty of light emitting cells and package mounting the same 有权
标题翻译：具有多个发光单元的发光器件和安装它们的封装
公开(公告)号：US08536612B2
公开(公告)日：2013-09-17
申请号：US13152566
申请日：2011-06-03
申请人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L29/18 , H01L23/48 , H01L33/00
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
摘要翻译：公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。多个发光单元被接合到副安装座基板。因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

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