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    • 21. 发明申请
    • Method for producing foamed products based on aromatic polyester resin with low melting point
    • 一种低熔点芳香族聚酯树脂发泡产品生产方法
    • US20050043419A1
    • 2005-02-24
    • US10751454
    • 2004-01-06
    • Yeon-Soo KimDeog-Jae JoTae-Kyung Kim
    • Yeon-Soo KimDeog-Jae JoTae-Kyung Kim
    • C08J9/06C08J9/00C08J9/04
    • C08J9/04C08J2201/03C08J2367/02
    • The present invention concerns a method for producing a foamed product based on aromatic polyester resin, wherein at least one of IPA, DEG, TEG and PEG is selected and copolymerized at the step of aromatic polyester polymerization to produce aromatic polyester resin with a low melting point whose melting point ranges 80 to 180□. The resin is then cross-linked by means of an organic peroxide cross-link agent, subject to melt mixing at a temperature ranging 80 to 180□ and then foamed in order to produce a foamed product based on aromatic polyester resin of a low melting point, excellent in thermal resistance, foaming magnification, strength, etc. The aromatic polyester resin represented by polyethyleneterephthalate is known excellent in chemical properties such as chemical resistance, solvent resistance, weather resistance, etc., and physical properties such as thermal resistance, dimension stability, rigidity, gas barrier capability, etc., and thus widely used for packaging electric/electronic parts, films, bottle containers and the like.
    • 本发明涉及一种制备基于芳族聚酯树脂的发泡产品的方法,其中选择IPA,DEG,TEG和PEG中的至少一种,并在芳族聚酯聚合步骤中共聚以产生具有低熔点的芳族聚酯树脂 其熔点范围为80〜180□。 然后通过有机过氧化物交联剂将树脂交联,在80-180℃的温度下进行熔融混合,然后发泡,以便产生基于低熔点的芳族聚酯树脂的发泡产品 耐热性,发泡倍率,强度等优异。以聚对苯二甲酸乙二醇酯为代表的芳族聚酯树脂,其耐化学性,耐溶剂性,耐气候性等化学性能以及耐热性,尺寸稳定性, ,刚性,阻气性等,因此广泛用于包装电气/电子部件,膜,瓶容器等。
    • 30. 发明申请
    • Magnetic circuit apparatus and method
    • 磁路装置及方法
    • US20060197388A1
    • 2006-09-07
    • US11071844
    • 2005-03-02
    • Tae-Kyung Kim
    • Tae-Kyung Kim
    • H02K41/00
    • F16K31/0631H01F7/081H01F7/1607
    • An improved magnetic circuit apparatus and method for manufacturing is disclosed. In one embodiment, the improved magnetic circuit includes an upper assembly and a lower assembly. A selected amount of magnetic flux-enhancing material is disposed within an air gap formed between the upper and lower assemblies, thereby focusing magnetic flux between the assemblies. The magnetic flux-enhancing material reduces magnetic flux loss across the air gap, and thereby eliminates post assembly calibration of the magnetic circuit. When the upper assembly and the lower assembly are fitted together, no calibration is required to tune the magnetic circuit to specified tolerances.
    • 公开了一种改进的磁路装置和制造方法。 在一个实施例中,改进的磁路包括上部组件和下部组件。 选择量的磁通增强材料设置在形成在上部和下部组件之间的气隙内,从而在组件之间聚焦磁通量。 磁通增强材料降低了气隙上的磁通量损耗,从而消除了磁路的组装后校准。 当上部组件和下部组件安装在一起时,不需要校准来将磁路调谐到指定的公差。