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21. 发明申请

US20130150997A1 METHOD AND SYSTEM FOR TOOL CONDITION MONITORING 审中-公开
标题翻译：工具条件监测方法与系统
公开(公告)号：US20130150997A1
公开(公告)日：2013-06-13
申请号：US13314850
申请日：2011-12-08
申请人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Po-Feng Tsai , Chia-Tong Ho , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00
CPC分类号： C23C16/52 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.
摘要翻译：公开了一种用于从刀具状态监测的在线测量数据中去除控制动作效果的方法和系统。一种示例性方法包括确定有助于在线测量的控制动作效果，其中在线测量指示由处理工具处理的晶片的晶片特性; 并且在没有控制动作效应贡献的情况下评估在线测量来确定过程工具的状况。

22. 发明授权

US09159597B2 Real-time calibration for wafer processing chamber lamp modules 有权
标题翻译：晶圆处理室灯模块的实时校准
公开(公告)号：US09159597B2
公开(公告)日：2015-10-13
申请号：US13471583
申请日：2012-05-15
申请人： Chih-Tien Chang , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Chih-Tien Chang , Sunny Wu , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： F26B3/30 , F27B5/14 , C23C14/00 , C23C16/00 , H01L21/67 , H05B1/02
CPC分类号： H01L22/26 , H01L21/324 , H01L21/67115 , H01L21/67248 , H05B1/0233
摘要： An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer processing chamber. The apparatus further includes radiant heating elements disposed in different zones and operable to heat different portions of a wafer located within the wafer processing chamber. The apparatus further includes sensors disposed outside the wafer processing chamber and operable to monitor energy from the radiant heating elements disposed in the different zones. The apparatus further includes a computer configured to utilize the sensors to characterize the radiant heating elements disposed in the different zones and to provide a calibration for the radiant heating elements disposed in the different zones such that a substantially uniform temperature profile is maintained across a surface of the wafer.
摘要翻译：公开了一种装置，系统和方法。示例性装置包括晶片处理室。该设备还包括设置在不同区域中的辐射加热元件，其可操作以加热位于晶片处理室内的晶片的不同部分。该装置还包括设置在晶片处理室外部的传感器，其可操作以监测来自设置在不同区域中的辐射加热元件的能量。该装置还包括计算机，其被配置为利用传感器来表征设置在不同区域中的辐射加热元件，并且为放置在不同区域中的辐射加热元件提供校准，使得基本上均匀的温度分布保持在晶圆。

23. 发明授权

US09727049B2 Qualitative fault detection and classification system for tool condition monitoring and associated methods 有权
公开(公告)号：US09727049B2
公开(公告)日：2017-08-08
申请号：US13603079
申请日：2012-09-04
申请人： Chia-Tong Ho , Po-Feng Tsai , Jung-Chang Chen , Tze-Liang Lee , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
发明人： Chia-Tong Ho , Po-Feng Tsai , Jung-Chang Chen , Tze-Liang Lee , Jo Fei Wang , Jong-I Mou , Chin-Hsiang Lin
IPC分类号： G06F19/00 , G05B19/4065
CPC分类号： G05B19/4065 , G05B2219/37252 , G05B2219/45031
摘要： The present disclosure provides various methods for tool condition monitoring, including systems for implementing such monitoring. An exemplary method includes receiving data associated with a process performed on wafers by an integrated circuit manufacturing process tool; and monitoring a condition of the integrated circuit manufacturing process tool using the data. The monitoring includes evaluating the data based on an abnormality identification criterion, an abnormality filtering criterion, and an abnormality threshold to determine whether the data meets an alarm threshold. The method may further include issuing an alarm when the data meets the alarm threshold.

24. 发明申请

US20110112678A1 ADVANCED PROCESS CONTROL FOR NEW TAPEOUT PRODUCT 有权
标题翻译：新型贴片产品的先进工艺控制
公开(公告)号：US20110112678A1
公开(公告)日：2011-05-12
申请号：US12616681
申请日：2009-11-11
申请人： Chih-Wei Hsu , Yu-Jen Cheng , Wen-Pin Liu , Shun-Ping Wang , Shin-Rung Lu , Jo Fei Wang , Jong-I Mou , Andy Tsen , Chun-Hsien Lin
发明人： Chih-Wei Hsu , Yu-Jen Cheng , Wen-Pin Liu , Shun-Ping Wang , Shin-Rung Lu , Jo Fei Wang , Jong-I Mou , Andy Tsen , Chun-Hsien Lin
IPC分类号： G06F17/50
CPC分类号： H01L21/67253 , G05B19/41865 , H01L21/67276 , Y02P90/20
摘要： The present disclosure provides a semiconductor manufacturing method. The method includes providing product data of a product, the product data including a sensitive product parameter; searching existing products according to the sensitive product parameter to identify a relevant product from the existing products; determining an initial value of a processing model parameter to the product using corresponding data of the relevant product; assigning the initial value of the processing model parameter to a processing model associated with a manufacturing process; thereafter, tuning a processing recipe using the processing model; and performing the manufacturing process to a semiconductor wafer using the processing recipe.
摘要翻译：本发明提供一种半导体制造方法。该方法包括提供产品的产品数据，产品数据包括敏感产品参数; 根据敏感产品参数搜索现有产品，从现有产品中识别相关产品; 使用相关产品的相应数据确定产品的处理模型参数的初始值; 将处理模型参数的初始值分配给与制造过程相关联的处理模型; 此后，使用该处理模型调整处理配方; 以及使用所述处理配方对所述半导体晶片进行制造处理。

25. 发明授权

US08239056B2 Advanced process control for new tapeout product 有权
标题翻译：新的流片产品的高级过程控制
公开(公告)号：US08239056B2
公开(公告)日：2012-08-07
申请号：US12616681
申请日：2009-11-11
申请人： Chih-Wei Hsu , Yu-Jen Cheng , Wen-Pin Liu , Shun-Ping Wang , Shin-Rung Lu , Jo Fei Wang , Jong-I Mou , Andy Tsen , Chun-Hsien Lin
发明人： Chih-Wei Hsu , Yu-Jen Cheng , Wen-Pin Liu , Shun-Ping Wang , Shin-Rung Lu , Jo Fei Wang , Jong-I Mou , Andy Tsen , Chun-Hsien Lin
IPC分类号： G06F19/00
CPC分类号： H01L21/67253 , G05B19/41865 , H01L21/67276 , Y02P90/20
摘要： The present disclosure provides a semiconductor manufacturing method. The method includes providing product data of a product, the product data including a sensitive product parameter; searching existing products according to the sensitive product parameter to identify a relevant product from the existing products; determining an initial value of a processing model parameter to the product using corresponding data of the relevant product; assigning the initial value of the processing model parameter to a processing model associated with a manufacturing process; thereafter, tuning a processing recipe using the processing model; and performing the manufacturing process to a semiconductor wafer using the processing recipe.
摘要翻译：本发明提供一种半导体制造方法。该方法包括提供产品的产品数据，产品数据包括敏感产品参数; 根据敏感产品参数搜索现有产品，从现有产品中识别相关产品; 使用相关产品的相应数据确定产品的处理模型参数的初始值; 将处理模型参数的初始值分配给与制造过程相关联的处理模型; 此后，使用该处理模型调整处理配方; 以及使用所述处理配方对所述半导体晶片进行制造处理。

26. 发明授权

US09102033B2 Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process 有权
标题翻译：多头化学机械抛光工艺的目标厚度和表面轮廓均匀性控制的装置和方法
公开(公告)号：US09102033B2
公开(公告)日：2015-08-11
申请号：US12953584
申请日：2010-11-24
申请人： Keung Hui , Jin-Ning Sung , Huang Soon Kang , Yen-Di Tsen , Jong-I Mou
发明人： Keung Hui , Jin-Ning Sung , Huang Soon Kang , Yen-Di Tsen , Jong-I Mou
IPC分类号： B24B1/00 , B24B51/00 , B24B37/005 , B24B37/04 , B24B37/10 , B24B49/02 , H01L21/66
CPC分类号： H01L21/30625 , B24B37/005 , B24B37/042 , B24B37/107 , B24B49/02 , B24B49/04 , B24B49/16 , B24B51/00 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method for providing target thickness and surface profile uniformity control of a multi-head chemical mechanical polishing (CMP) process is disclosed. An exemplary method includes providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface profiles of the at least two wafers; determining a CMP polishing recipe for each of the at least two wafers based on the operation mode; and performing the CMP process on the at least two wafers based on the determined CMP polishing recipes.
摘要翻译：公开了一种用于提供多头化学机械抛光（CMP）工艺的目标厚度和表面轮廓均匀性控制的装置和方法。一种示例性方法包括提供至少两个晶片; 确定所述至少两个晶片中的每一个的表面轮廓; 基于所述至少两个晶片的表面轮廓确定用于化学机械抛光（CMP）工艺的操作模式; 基于所述操作模式确定所述至少两个晶片中的每一个的CMP抛光配方; 以及基于所确定的CMP抛光配方在所述至少两个晶片上执行CMP处理。

27. 发明授权

US08627251B2 Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes 有权
标题翻译：自动检测半导体晶片制造工艺的故障模式的系统和方法
公开(公告)号：US08627251B2
公开(公告)日：2014-01-07
申请号：US13455186
申请日：2012-04-25
申请人： Jui-Long Chen , Hui-Yun Chao , Yen-Di Tsen , Jong-I Mou
发明人： Jui-Long Chen , Hui-Yun Chao , Yen-Di Tsen , Jong-I Mou
IPC分类号： G06F17/50
CPC分类号： H01L22/20 , H01L22/10 , H01L22/12 , H01L22/14 , H01L2924/0002 , Y10T29/41 , H01L2924/00
摘要： A system and method of automatically detecting failure patterns for a semiconductor wafer process is provided. The method includes receiving a test data set collected from testing a plurality of semiconductor wafers, forming a respective wafer map for each of the wafers, determining whether each respective wafer map comprises one or more respective objects, selecting the wafer maps that are determined to comprise one or more respective objects, selecting one or more object indices for selecting a respective object in each respective selected wafer map, determining a plurality of object index values in each respective selected wafer map, selecting an object in each respective selected wafer map, determining a respective feature in each of the respective selected wafer, classifying a respective pattern for each of the respective selected wafer maps and using the respective wafer fingerprints to adjust one or more parameters of the semiconductor fabrication process.
摘要翻译：提供了一种自动检测半导体晶片工艺的故障模式的系统和方法。该方法包括接收从测试多个半导体晶片收集的测试数据集，为每个晶片形成相应的晶片图，确定每个相应的晶片图是否包括一个或多个相应的对象，选择被确定为包括的晶片图一个或多个相应的对象，选择一个或多个对象索引，用于在每个相应的选定的晶片图中选择相应的对象，确定每个相应选择的晶片图中的多个对象索引值，在每个相应选定的晶片图中选择一个对象，各个所选晶片中的每一个的相应特征，对各个所选晶片图中的每一个分类各自的图案，并使用相应的晶片指纹来调整半导体制造工艺的一个或多个参数。

28. 发明申请

US20120129431A1 APPARATUS AND METHOD FOR TARGET THICKNESS AND SURFACE PROFILE UNIFORMITY CONTROL OF MULTI-HEAD CHEMICAL MECHANICAL POLISHING PROCESS 有权
标题翻译：目标厚度和表面轮廓的设备和方法多头化学机械抛光过程的均匀性控制
公开(公告)号：US20120129431A1
公开(公告)日：2012-05-24
申请号：US12953584
申请日：2010-11-24
申请人： KEUNG HUI , Jin-Ning Sung , Huang Soon Kang , Yen-Di Tsen , Jong-I Mou
发明人： KEUNG HUI , Jin-Ning Sung , Huang Soon Kang , Yen-Di Tsen , Jong-I Mou
IPC分类号： B24B1/00 , B24B51/00
CPC分类号： H01L21/30625 , B24B37/005 , B24B37/042 , B24B37/107 , B24B49/02 , B24B49/04 , B24B49/16 , B24B51/00 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and method for providing target thickness and surface profile uniformity control of a multi-head chemical mechanical polishing (CMP) process is disclosed. An exemplary method includes providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface profiles of the at least two wafers; determining a CMP polishing recipe for each of the at least two wafers based on the operation mode; and performing the CMP process on the at least two wafers based on the determined CMP polishing recipes.
摘要翻译：公开了一种用于提供多头化学机械抛光（CMP）工艺的目标厚度和表面轮廓均匀性控制的装置和方法。一种示例性方法包括提供至少两个晶片; 确定所述至少两个晶片中的每一个的表面轮廓; 基于所述至少两个晶片的表面轮廓确定用于化学机械抛光（CMP）工艺的操作模式; 基于所述操作模式确定所述至少两个晶片中的每一个的CMP抛光配方; 以及基于所确定的CMP抛光配方在所述至少两个晶片上执行CMP处理。

29. 发明申请

US20110042006A1 E-CHUCK WITH AUTOMATED CLAMPED FORCE ADJUSTMENT AND CALIBRATION 有权
标题翻译：具有自动钳位力调整和校准的电动自行车
公开(公告)号：US20110042006A1
公开(公告)日：2011-02-24
申请号：US12938610
申请日：2010-11-03
申请人： Jo Fei Wang , Sunny Wu , Jong-I Mou
发明人： Jo Fei Wang , Sunny Wu , Jong-I Mou
IPC分类号： H01L21/46 , G06F19/00 , H01L21/465
CPC分类号： H01L21/6831 , H01L22/20 , H01L2924/0002 , Y10S438/909 , H01L2924/00
摘要： The present disclosure describes a semiconductor manufacturing apparatus. The apparatus includes a processing chamber designed to perform a process to a wafer; an electrostatic chuck (E-chuck) configured in the processing chamber and designed to secure the wafer, wherein the E-chuck includes an electrode and a dielectric feature formed on the electrode; a tuning structure designed to hold the E-chuck to the processing chamber by clamping forces, wherein the tuning structure is operable to dynamically adjust the clamping forces; a sensor integrated with the E-chuck and sensitive to the clamping forces; and a process control module for controlling the tuning structure to adjust the clamping forces based on pre-measurement data from the wafer and sensor data from the sensor.
摘要翻译：本公开描述了一种半导体制造装置。该设备包括设计成对晶片执行处理的处理室; 配置在所述处理室中并设计成固定所述晶片的静电卡盘（E卡盘），其中所述E卡盘包括形成在所述电极上的电极和电介质特征; 调谐结构，其被设计成通过夹紧力将所述E卡盘保持在所述处理室中，其中所述调谐结构可操作以动态地调节所述夹紧力; 与E型卡盘集成并对夹紧力敏感的传感器; 以及过程控制模块，用于基于来自晶片的预测量数据和来自传感器的传感器数据来控制调谐结构以调整夹紧力。

30. 发明授权

US08404572B2 Multi-zone temperature control for semiconductor wafer 有权
标题翻译：半导体晶圆的多区域温度控制
公开(公告)号：US08404572B2
公开(公告)日：2013-03-26
申请号：US12370746
申请日：2009-02-13
申请人： Chun-Lin Chang , Hsin-Hsien Wu , Zin-Chang Wei , Chi-Ming Yang , Chyi-Shyuan Chern , Jun-Lin Yeh , Jih-Jse Lin , Jo-Fei Wang , Ming-Yu Fan , Jong-I Mou
发明人： Chun-Lin Chang , Hsin-Hsien Wu , Zin-Chang Wei , Chi-Ming Yang , Chyi-Shyuan Chern , Jun-Lin Yeh , Jih-Jse Lin , Jo-Fei Wang , Ming-Yu Fan , Jong-I Mou
IPC分类号： H01L21/425
CPC分类号： H01L22/20 , H01L21/67248 , H01L21/67253 , H01L22/12
摘要： An apparatus includes a process chamber configured to perform an ion implantation process. A cooling platen or electrostatic chuck is provided within the process chamber. The cooling platen or electrostatic chuck is configured to support a semiconductor wafer. The cooling platen or electrostatic chuck has a plurality of temperature zones. Each temperature zone includes at least one fluid conduit within or adjacent to the cooling platen or electrostatic chuck. At least two coolant sources are provided, each fluidly coupled to a respective one of the fluid conduits and configured to supply a respectively different coolant to a respective one of the plurality of temperature zones during the ion implantation process. The coolant sources include respectively different chilling or refrigeration units.
摘要翻译：一种装置包括被配置为执行离子注入工艺的处理室。在处理室内设有冷却台板或静电吸盘。冷却台板或静电卡盘构造成支撑半导体晶片。冷却台板或静电卡盘具有多个温度区域。每个温度区域包括在冷却压板或静电卡盘内或附近的至少一个流体导管。提供至少两个冷却剂源，每个冷却剂源流体耦合到相应的一个流体导管，并且构造成在离子注入过程期间将分别不同的冷却剂供应到多个温度区中的相应的一个温度区。冷却剂源分别包括不同的冷却或制冷装置。

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