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21. 发明授权

US08330239B2 Shielding for a micro electro-mechanical device and method therefor 有权
标题翻译：微机电装置的屏蔽及其方法
公开(公告)号：US08330239B2
公开(公告)日：2012-12-11
申请号：US12432289
申请日：2009-04-29
申请人： Jinbang Tang , Lianjun Liu
发明人： Jinbang Tang , Lianjun Liu
IPC分类号： G01L9/00
CPC分类号： B81B7/0064 , B81B2201/0257 , B81B2207/017 , H01L24/12 , H01L24/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H04R19/005 , H04R19/04 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A device comprises a conductive substrate, a micro electromechanical systems (MEMS) structure, and a plurality of bond pads. The conductive substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed over the first side of the conductive substrate. The plurality of bond pads are formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. The conductive substrate and plurality of bond pads function to provide electrostatic shielding to the MEMS structure.
摘要翻译：一种器件包括导电衬底，微机电系统（MEMS）结构和多个接合焊盘。导电基板具有第一侧和第二侧，第二侧与第一侧相对。 MEMS结构形成在导电衬底的第一侧上。多个接合焊盘形成在导电衬底的第一侧上并电耦合到导电衬底的第一侧。导电衬底和多个接合焊盘用于向MEMS结构提供静电屏蔽。

22. 发明申请

US20120056308A1 METHOD OF FORMING AN ELECTROMECHANICAL TRANSDUCER DEVICE 有权
标题翻译：形成机电传感器装置的方法
公开(公告)号：US20120056308A1
公开(公告)日：2012-03-08
申请号：US13320579
申请日：2010-06-15
申请人： Francois Perruchot , Lianjun Liu , Sergio Pacheco , Emmanuel Defay , Patrice Rey
发明人： Francois Perruchot , Lianjun Liu , Sergio Pacheco , Emmanuel Defay , Patrice Rey
IPC分类号： H01L29/66 , H01L21/66
CPC分类号： B81C1/00666 , B81B2203/0118 , B81C2201/0167 , B81C2201/0169
摘要： A method of forming an electromechanical transducer device comprises forming on a fixed structure a movable structure and an actuating structure of the electromechanical transducer device, wherein the movable structure is arranged in operation of the electromechanical transducer device to be movable in relation to the fixed structure in response to actuation of the actuating structure. The method further comprises providing a stress trimming layer on at least part of the movable structure, after providing the stress trimming layer, releasing the movable structure from the fixed structure to provide a released electromechanical transducer device, and after releasing the movable structure changing stress in the stress trimming layer of the released electromechanical transducer device such that the movable structure is deflected a predetermined amount relative to the fixed structure when the electromechanical transducer device is in an off state.
摘要翻译：一种形成机电换能器装置的方法包括在固定结构上形成机电换能器装置的可移动结构和致动结构，其中可移动结构被布置成在机电换能器装置的操作中相对于固定结构可移动响应致动结构的致动。该方法还包括在提供应力修剪层之后，在可移动结构的至少一部分上提供应力修剪层，将可移动结构从固定结构释放以提供释放的机电换能器装置，以及在释放可移动结构之后，改变应力释放的机电换能器装置的应力修剪层，使得当机电换能器装置处于关闭状态时，可移动结构相对于固定结构偏转预定量。

23. 发明申请

US20110233693A1 ELECTROMECHANICAL TRANSDUCER DEVICE AND METHOD OF FORMING A ELECTROMECHANICAL TRANSDUCER DEVICE 有权
标题翻译：机电传感器装置及形成机电传感器装置的方法
公开(公告)号：US20110233693A1
公开(公告)日：2011-09-29
申请号：US13128035
申请日：2009-11-25
申请人： François Perruchot , Emmanuel Defay , Patrice Rey , Lianjun Liu , Sergio Pacheco
发明人： François Perruchot , Emmanuel Defay , Patrice Rey , Lianjun Liu , Sergio Pacheco
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： B81B3/0072 , B81B2201/032 , H01L41/0933 , H01L41/094
摘要： A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure comprising at least one mechanical layer having a first thermal response characteristic and a first mechanical stress response characteristic, at least one layer of the actuating structure, the at least one layer having a second thermal response characteristic different to the first thermal response characteristic and a second mechanical stress response characteristic different to the first mechanical stress response characteristic, a first compensation layer having a third thermal response characteristic and a third mechanical stress characteristic, and a second compensation layer having a fourth thermal response characteristic and a fourth mechanical stress response characteristic. The first and second compensation layers are arranged to compensate a thermal effect produced by the different first and second thermal response characteristics of the mechanical structure and the at least one layer of the actuating structure such that movement of the movable structure is substantially independent of variations in temperature and to adjust a stress effect produced by the different first and second stress response characteristics of the mechanical structure and the at least one layer of the actuating structure such that the movable structure is deflected a predetermined amount relative to the substrate when the electromechanical transducer device is in an inactive state.
摘要翻译：形成在半导体衬底上的微型或纳米机电换能器装置包括可移动结构，其被布置成响应于致动结构的致动而是可移动的。可移动结构包括机械结构，其包括具有第一热响应特性和第一机械应力响应特性的至少一个机械层，所述致动结构的至少一层，所述至少一层具有与第一热响应特性和与第一机械应力响应特性不同的第二机械应力响应特性，具有第三热响应特性和第三机械应力特性的第一补偿层，以及具有第四热响应特性的第二补偿层和第四机械应力响应特性。第一和第二补偿层布置成补偿由机械结构和致动结构的至少一个层的不同的第一和第二热响应特性产生的热效应，使得可移动结构的移动基本上与并且调节由所述机械结构和所述致动结构的所述至少一个层的不同的第一和第二应力响应特性产生的应力效应，使得当所述机电换能器装置处于非活动状态。

24. 发明申请

US20110221307A1 ELECTROMECHANICAL TRANSDUCER DEVICE AND METHOD OF FORMING A ELECTROMECHANICAL TRANSDUCER DEVICE 有权
标题翻译：机电传感器装置及形成机电传感器装置的方法
公开(公告)号：US20110221307A1
公开(公告)日：2011-09-15
申请号：US13128032
申请日：2009-11-25
申请人： Lianjun Liu , Sergio Pacheco , Francois Perruchot , Emmanuel Defay , Patrice Rey
发明人： Lianjun Liu , Sergio Pacheco , Francois Perruchot , Emmanuel Defay , Patrice Rey
IPC分类号： H01L41/04
CPC分类号： B81B3/0072 , B81B2201/032 , H01L41/0933 , H01L41/094
摘要： A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure having at least one mechanical layer having a first thermal response characteristic, at least one layer of the actuating structure having a second thermal response characteristic different to the first thermal response characteristic, and a thermal compensation structure having at least one thermal compensation layer. The thermal compensation layer is different to the at least one layer and is arranged to compensate a thermal effect produced by the mechanical layer and the at least one layer of the actuating structure such that the movement of the movable structure is substantially independent of variations in temperature.
摘要翻译：形成在半导体衬底上的微型或纳米机电换能器装置包括可移动结构，其被布置成响应于致动结构的致动而是可移动的。可移动结构包括具有至少一个具有第一热响应特性的机械层的机械结构，至少一层致动结构具有不同于第一热响应特性的第二热响应特性，以及至少具有至少一个热补偿层。热补偿层不同于至少一个层，并且被布置成补偿由机械层和致动结构的至少一个层产生的热效应，使得可移动结构的运动基本上与温度变化无关。

25. 发明申请

US20100276767A1 MEMS MICROPHONE WITH CAVITY AND METHOD THEREFOR 有权
标题翻译：具有孔的MEMS麦克风及其方法
公开(公告)号：US20100276767A1
公开(公告)日：2010-11-04
申请号：US12432377
申请日：2009-04-29
申请人： Lianjun Liu , Douglas G. Mitchell
发明人： Lianjun Liu , Douglas G. Mitchell
IPC分类号： H01L29/84 , H01L21/26
CPC分类号： H04R19/005 , H01L29/84 , H01L2924/14 , H01L2924/30105 , H01L2924/3025
摘要： A device comprises a substrate, a micro electro-mechanical systems (MEMS) structure, and a dielectric film. The substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed on the first side of the substrate. The cavity is formed in the substrate directly opposite the MEMS structure. The cavity has an opening formed on the second side. The dielectric film is attached to the second side of the substrate and completely covering the opening. In one embodiment, the MEMS structure is a diaphragm for a microphone. Another embodiment includes a method for forming the device.
摘要翻译：一种器件包括衬底，微电子机械系统（MEMS）结构和电介质膜。衬底具有第一侧和第二侧，第二侧与第一侧相对。 MEMS结构形成在衬底的第一侧上。空腔形成在与MEMS结构直接相对的基板中。空腔具有形成在第二侧上的开口。电介质膜附着到基片的第二侧并完全覆盖开口。在一个实施例中，MEMS结构是用于麦克风的隔膜。另一实施例包括用于形成装置的方法。

26. 发明授权

US07732991B2 Self-poling piezoelectric MEMs device 有权
标题翻译：自极化压电MEMs器件
公开(公告)号：US07732991B2
公开(公告)日：2010-06-08
申请号：US11864266
申请日：2007-09-28
申请人： Lianjun Liu
发明人： Lianjun Liu
IPC分类号： H01L41/08
CPC分类号： B81B3/0086 , B81B2201/0235 , B81B2203/0118 , H01H57/00 , H01H2057/006 , H01L41/094 , H01L41/257
摘要： A self-poling piezoelectric based MEMS device is configured for piezoelectric actuation in response to application of a device operating voltage. The MEMS device comprises a beam, a first electrode disposed on the beam, a layer of piezoelectric material having a self-poling thickness disposed overlying a portion of the first electrode, and a second electrode overlying the layer of piezoelectric material. The layer of piezoelectric material is self-poled in response to application of the device operating voltage across the first and second electrodes. In addition, the self-poled piezoelectric material has a poling direction established according to a polarity orientation of the device operating voltage as applied across the first and second electrodes.
摘要翻译：响应于器件工作电压的应用，自极化基于压电的MEMS器件被配置为用于压电致动。 MEMS器件包括光束，设置在光束上的第一电极，具有设置在第一电极的一部分上的自极化厚度的压电材料层和覆盖在压电材料层上的第二电极。响应于在第一和第二电极上施加器件工作电压，压电材料层是自极化的。此外，自极化压电材料具有根据施加在第一和第二电极上的器件工作电压的极性取向而建立的极化方向。

27. 发明授权

US07663196B2 Integrated passive device and method of fabrication 有权
标题翻译：集成无源器件及其制造方法
公开(公告)号：US07663196B2
公开(公告)日：2010-02-16
申请号：US11673015
申请日：2007-02-09
申请人： Lianjun Liu , Melvy F. Miller
发明人： Lianjun Liu , Melvy F. Miller
IPC分类号： H01L27/14 , H01L29/82 , H01L29/84 , H01L29/00
CPC分类号： B81C1/00253 , H01L28/10 , H01L28/60
摘要： A device 20 includes substrates 22 and 24 coupled to form a volume 32 between the substrates. A surface 28 of the substrate 22 faces a surface 30 of the substrate 24. A metal-insulator-metal capacitor 34 is formed on one of the surfaces 28 and 30. A conductive element 58 spans between a top electrode 56 of the capacitor 34 and the other surface 28 and 30. Vias 64 and 66 extend through the substrate 22 and are electrically interconnected with the conductive element 58 and a bottom electrode 52 of the capacitor 34. Another device 72 includes an underpass transmission line 92 formed on a surface 80 of a substrate 74 within a volume 84 formed between the substrate 74 and another substrate 76. The line 92 underlies an integrated device 96 formed on a surface 78 of the substrate 74.
摘要翻译：装置20包括联接以在基板之间形成体积32的基板22和24。基板22的表面28面向基板24的表面30.金属 - 绝缘体 - 金属电容器34形成在一个表面28和30上。导电元件58跨越电容器34的顶部电极56和另一个表面28和30.通道64和66延伸穿过基板22，并与导电元件58和电容器34的底部电极52电互连。另一个装置72包括形成在表面80上的地下通道传输线92 形成在衬底74和另一衬底76之间的体积84内的衬底74.线92位于形成在衬底74的表面78上的集成器件96的下面。

28. 发明授权

US07586238B2 Control and testing of a micro electromechanical switch having a piezo element 有权
标题翻译：具有压电元件的微机电开关的控制和测试
公开(公告)号：US07586238B2
公开(公告)日：2009-09-08
申请号：US11465319
申请日：2006-08-17
申请人： Lianjun Liu
发明人： Lianjun Liu
IPC分类号： H01L41/04 , H01H57/00
CPC分类号： H01H59/0009 , H01H1/50 , H01H11/0062 , H01H47/002 , H01H2057/006 , H01H2201/02
摘要： A micro electromechanical switch has a movable portion positioned to form an electrical connection between a first electrical contact and a second electrical contact. A piezoelectric electrode is formed on the movable portion. The piezoelectric electrode causes the movable portion to move in response to a driver voltage. A piezo element is formed on the movable portion of the switch. The piezo element is for detecting movement of the movable portion between an open position and a closed position. The piezo element is also used to detect switch bouncing when the switch transitions from the open position to the closed position. In one embodiment, the piezo element is a piezoelectric element and in another embodiment the piezo element is a piezo-resistive element.
摘要翻译：微机电开关具有可移动部分，其被定位成在第一电接触件和第二电接触件之间形成电连接。压电电极形成在可动部分上。压电电极使可动部分响应于驱动器电压而移动。压电元件形成在开关的可移动部分上。压电元件用于检测可动部分在打开位置和关闭位置之间的移动。当开关从打开位置转换到关闭位置时，压电元件还用于检测开关跳动。在一个实施例中，压电元件是压电元件，在另一个实施例中，压电元件是压电元件。

29. 发明申请

US20090195324A1 BALUN TRANSFORMER WITH IMPROVED HARMONIC SUPPRESSION 有权
标题翻译： BALUN变压器具有改进的谐波抑制
公开(公告)号：US20090195324A1
公开(公告)日：2009-08-06
申请号：US12025315
申请日：2008-02-04
申请人： Qiang Li , Jonathan K. Abrokwah , Olin L. Hartin , Lianjun Liu
发明人： Qiang Li , Jonathan K. Abrokwah , Olin L. Hartin , Lianjun Liu
IPC分类号： H03H5/00 , H01F7/06
CPC分类号： H01F19/04 , H03H7/1775 , H03H7/42 , H03H2001/0064 , Y10T29/4902
摘要： An electronic assembly includes a substrate (66), a balun transformer (42) formed on the substrate (66) and including a first winding (50) and a second winding (52), each having respective first and second ends, and a reaction circuit component (48) formed on the substrate (66) and electrically coupled to the second winding (52) between the first and second ends thereof. The balun transformer (42) and the reaction circuit component (48) jointly form a harmonically suppressed balun transformer having a fundamental frequency, and the reaction circuit component (48) is tuned such that the harmonically suppressed balun transformer resonates at a selected harmonic of the fundamental frequency.
摘要翻译：电子组件包括衬底（66），形成在衬底（66）上并包括第一绕组（50）和第二绕组（52）的平衡不平衡变压器（42），每个具有相应的第一和第二端，以及反应电路部件（48），形成在所述基板（66）上并且在所述第一和第二端之间电连接到所述第二绕组（52）。平衡 - 不平衡变压器（42）和反应电路部件（48）共同形成具有基频的谐波抑制平衡不平衡变压器，并且调谐反应电路部件（48），使得谐波抑制的平衡不平衡变压器以所选择的谐波谐振基频

30. 发明授权

US07567782B2 Re-configurable impedance matching and harmonic filter system 有权
标题翻译：可重配置阻抗匹配和谐波滤波系统
公开(公告)号：US07567782B2
公开(公告)日：2009-07-28
申请号：US11494821
申请日：2006-07-28
申请人： Lianjun Liu , Melvy F. Miller
发明人： Lianjun Liu , Melvy F. Miller
IPC分类号： H04B1/04
CPC分类号： H04B1/0458 , H04B1/0067
摘要： Methods and apparatus are provided to enable a transceiver (200) or transmitter including a single PA line-up (210) to transmit signals having frequencies in two or more different frequency bands, and/or having two or more different modulation types, and/or having two or more different RF power levels. The single PA line-up includes at least one variable matching circuit (216) and a variable harmonic filter (240) to tune match and tune filter communication signals prior to transmission. The variable matching circuit and the variable harmonic filter each include at least one variable capacitive element (2160 and 2400) that switches ON/OFF depending on whether a low frequency signal or a high frequency signal is being transmitted. Each variable capacitive element includes separate direct current and radio frequency terminals to enable the single PA line-up to change signal modulation and/or RF power levels in addition to frequencies.
摘要翻译：提供了方法和装置，以使包括单个PA阵列（210）的收发机（200）或发射机能够发送具有两个或多个不同频带中的频率和/或具有两个或多个不同调制类型的频率，和/ 或具有两个或更多个不同的RF功率电平。单个PA阵列包括至少一个可变匹配电路（216）和可变谐波滤波器（240），以在传输之前调谐匹配和调谐滤波器通信信号。可变匹配电路和可变谐波滤波器各自包括至少一个可变电容元件（2160和2400），其根据是否正在发送低频信号或高频信号来接通/断开。每个可变电容元件包括单独的直流电和射频终端，以使得单个PA阵列除频率之外还能改变信号调制和/或RF功率电平。

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