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21. 发明申请

US20080310123A1 Toolless Configuration Of A Computer Enclosure 有权
标题翻译：计算机外壳的无工具配置
公开(公告)号：US20080310123A1
公开(公告)日：2008-12-18
申请号：US12121350
申请日：2008-05-15
申请人： David W. Sherrod , Michael E. Taylor , Joseph R. Allen , John P. Franz
发明人： David W. Sherrod , Michael E. Taylor , Joseph R. Allen , John P. Franz
IPC分类号： H05K7/18
CPC分类号： H05K7/1488
摘要： Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.
摘要翻译：包括用于计算机机箱的无工具配置的实施例。装置的至少一个实施例包括被配置为支撑多个部件的计算机机壳，所述计算机机壳包括多个分隔壁，所述分隔壁包括第一开口和第二开口。一些实施例包括分配器，其被配置用于插入到计算机外壳中并且在分隔壁之间，分隔器包括用于与第一开口联接的第一突出部，该分隔器包括用于与第二开口联接的第二突出部，分隔器还包括锁定将分配器锁定在计算机外壳内的适当位置。

22. 发明授权

US06858792B2 Tool-less coupling assembly 有权
标题翻译：无工具联轴器组件
公开(公告)号：US06858792B2
公开(公告)日：2005-02-22
申请号：US10324693
申请日：2002-12-19
申请人： John P. Franz , Wade D. Vinson , Joseph R. Allen , David W. Deis
发明人： John P. Franz , Wade D. Vinson , Joseph R. Allen , David W. Deis
IPC分类号： H01L23/40 , H01L23/26 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may include a plate and a lever coupled to the plate.
摘要翻译：本发明的实施例通过提供一种无需工具的杠杆致动的，坚固但耐受的，高负荷传递的低轮廓部件保持组件来克服现有技术的缺陷，用于将部件耦合在一起。组件可以包括板和耦合到板的杆。

23. 发明申请

US20140269240A1 DRIVE CARRIER SUBSTRATE 审中-公开
标题翻译：驱动载体基板
公开(公告)号：US20140269240A1
公开(公告)日：2014-09-18
申请号：US14349687
申请日：2011-10-25
申请人： Andrew James Phelan , John P. Franz , Michael S. Bunker
发明人： Andrew James Phelan , John P. Franz , Michael S. Bunker
IPC分类号： F21V23/00 , G11B33/10 , F21V21/14
CPC分类号： F21V23/005 , F21V21/14 , G06F1/187 , G11B33/10 , G11B33/122
摘要： A drive carrier includes a substrate, a computing device located on the substrate, an electrical interface located on the substrate, and a light source located on the substrate and communicatively coupled to the computing device. The computing device is to control illumination of the light source.
摘要翻译：驱动载体包括衬底，位于衬底上的计算设备，位于衬底上的电接口以及位于衬底上并且可通信地耦合到计算设备的光源。计算装置是控制光源的照明。

24. 发明申请

US20140240915A1 KEYING SOLUTION 审中-公开
标题翻译：关键解决方案
公开(公告)号：US20140240915A1
公开(公告)日：2014-08-28
申请号：US14350371
申请日：2011-11-01
申请人： Andrew James Phelan , John P. Franz , James Jeffery Schulze , Kelly K. Smith , Everett R. Salinas
发明人： Andrew James Phelan , John P. Franz , James Jeffery Schulze , Kelly K. Smith , Everett R. Salinas
IPC分类号： G06F1/18
CPC分类号： G06F1/187 , G06F1/182 , G11B33/128
摘要： A drive carrier includes a bezel and opposing sidewalls connected to the bezel. At least one of the opposing sidewalls includes a plurality of slots that form at least part of a keying solution, and a dimension of at least two of the plurality of slots is not the same.
摘要翻译：驱动器托架包括边框和相对的侧壁，所述相对侧壁连接到挡板。相对侧壁中的至少一个包括形成密钥解决方案的至少一部分的多个槽，并且多个槽中的至少两个槽的尺寸不相同。

25. 发明申请

US20090016010A1 COMPONENT LAYOUT IN AN ENCLOSURE 有权
标题翻译：附件中的组件布局
公开(公告)号：US20090016010A1
公开(公告)日：2009-01-15
申请号：US12138622
申请日：2008-06-13
申请人： WADE D. VINSON , John P. Franz , Arthur K. Farnsworth , David W. Sherrod
发明人： WADE D. VINSON , John P. Franz , Arthur K. Farnsworth , David W. Sherrod
IPC分类号： G06F1/20 , G06F1/16
CPC分类号： G11B33/142 , G11B33/124 , H05K7/1487
摘要： An electronic module includes an enclosure having front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.
摘要翻译：电子模块包括具有前表面和后表面的外壳。电子电路板位于外壳中，处理器安装在电子电路板上。数据存储设备位于外壳中，使得处理器位于数据存储设备和电子电路板之间。

26. 发明申请

US20080303360A1 INSULATED BEARING MOTOR ASSEMBLY 审中-公开
标题翻译：绝缘轴承电机总成
公开(公告)号：US20080303360A1
公开(公告)日：2008-12-11
申请号：US12100300
申请日：2008-04-09
申请人： Wade D. Vinson , John P. Franz , George A. Ozuna
发明人： Wade D. Vinson , John P. Franz , George A. Ozuna
IPC分类号： H02K5/15 , H02K5/20
CPC分类号： H02K9/06 , H02K5/15 , H02K5/1732 , H02K5/20
摘要： A motor with improved bearing life has a shaft rotatably supported by a pair bearings. The motor further has a stator and a rotor, wherein one of the stator and the rotor is mounted to the shaft and the other of the stator and the rotor surrounds the shaft so that the stator and rotor can rotate with respect to one another. The motor has one or more features to protect at least one of the bearings from heat emitted by at least one of the stator and the rotor.
摘要翻译：轴承寿命延长的电机具有由一对轴承可旋转地支撑的轴。电动机还具有定子和转子，其中定子和转子中的一个安装到轴上，定子和转子中的另一个围绕轴，使得定子和转子可以相对于彼此旋转。电动机具有一个或多个特征以保护至少一个轴承不受定子和转子中的至少一个所发出的热量的影响。

27. 发明授权

US07035096B2 Locking mechanism for removable components 有权
标题翻译：可移动部件的锁定机构
公开(公告)号：US07035096B2
公开(公告)日：2006-04-25
申请号：US10698605
申请日：2003-10-31
申请人： John P. Franz , Wade D. Vinson , Nicholas Holian
发明人： John P. Franz , Wade D. Vinson , Nicholas Holian
IPC分类号： G06F1/16
CPC分类号： G11B33/126 , G06F1/184 , G06F1/187 , G11B33/128 , H05K7/1411 , Y10T70/5009
摘要： According to certain embodiments, the present technique provides a locking mechanism for coupling and uncoupling a removable component coupleable to and uncoupleable from a computing device. The exemplary locking mechanism includes a first member selectively positionable between secured and unsecured configurations of the removable component with respect to the computer device. The exemplary locking mechanism also includes a second member positionable between first and second configurations, wherein the first configuration extends the second member through the first member in the second configuration to secure the first member.
摘要翻译：根据某些实施例，本技术提供了一种锁定机构，用于联接和解耦可耦合到计算设备并且与其不可分离的可拆卸部件。示例性的锁定机构包括可相对于计算机设备选择性地定位在可拆卸部件的固定和不安全构造之间的第一构件。示例性的锁定机构还包括可定位在第一和第二构造之间的第二构件，其中第一构型在第二构型中通过第一构件延伸第二构件以固定第一构件。

28. 发明授权

US06724628B2 Blindmate heat sink assembly 有权
标题翻译：盲人散热器组件
公开(公告)号：US06724628B2
公开(公告)日：2004-04-20
申请号：US10036165
申请日：2001-12-26
申请人： John P. Franz , Wade David Vinson
发明人： John P. Franz , Wade David Vinson
IPC分类号： H05K720
CPC分类号： H01L23/544 , H01L23/40 , H01L2223/54473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.
摘要翻译：散热器和处理器组件，可以轻松地从电路板安装和卸载而无需工具。散热器组件的一个优选实施例包括散热器部件，连接到散热器的基座的对准保持架，并具有用于可释放地附接处理器的连接点。散热器组件还包括多个对准销和对准突片，其固定到散热器的底部并且与专门设计的插座和电路板接合以便对准配合部件。处理器芯片安装在散热器上，然后将组合的组件安装到安装有电路板的插座上。对准机构提供了一种在不使用工具的情况下安装处理器的方法，或者必须将处理器引脚手动对准插座插座。

29. 发明授权

US09529395B2 Liquid temperature control cooling 有权
标题翻译：液体温度控制冷却
公开(公告)号：US09529395B2
公开(公告)日：2016-12-27
申请号：US14376138
申请日：2012-03-12
申请人： John P. Franz , Michael L. Sabotta , Tahir Cader , David A. Moore
发明人： John P. Franz , Michael L. Sabotta , Tahir Cader , David A. Moore
IPC分类号： G06F1/20 , H05K7/20 , F28D15/02
CPC分类号： G06F1/20 , F28D15/0275 , G06F1/206 , H05K7/20772 , H05K7/20781
摘要： Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack (100, 200a, 200b) can include a number of electronic devices (102, 202) in the electronics rack (100, 200a, 200b), a panel (108-1, 108-2, 208-1, 224-1, 224-2) that extends from a roof (226) to a floor (228) inside the electronics rack (100, 200a, 200b), where a face of the panel (108-1, 108-2, 208-1, 224-1, 224-2) is parallel to a direction in which the number of electronic devices (100, 200a, 200b) slide into the electronics rack (100, 200a, 200b) and perpendicular to a front of the electronics rack, and a heat receiving structure (112, 212, 312, 412) that is integrated into the panel (108-1, 108-2, 208-1, 224-1, 224-2) and that is thermally coupled to the number of electronic devices (102, 202) through the panel (108-1, 108-2, 208-1, 224-1, 224-2), where the heat receiving structure (112, 212, 312, 412) can include a liquid flow compartment (330, 442) an input (216, 316, 416) to receive cool liquid into the liquid flow compartment (330, 442), and a control valve (214, 314, 414-1, 414-2, 414-3, 414-4) to release warm liquid from the liquid flow compartment (330, 442).
摘要翻译：本公开的实例可以包括用于液体温度控制冷却的方法和系统。用于电子机架（100,200a，200b）的液体温度控制冷却系统的示例可以包括电子机架（100,200a，200b）中的多个电子设备（102,202），面板（108-1 ，108-2,208-1,224-1,224-2），其从所述电子机架（100,200a，200b）内部的屋顶（226）延伸到地板（228），其中所述面板 108-1,108-2,208-1,224-1,224-2）平行于电子设备（100,200a，200b）的数量滑入电子机架（100,200a，200b）的方向）和垂直于所述电子机架的前部的热接收结构（112,212,312,412），其被集成到所述面板（108-1,108-2,208-1,224-1,224-212）中， 2），并且其通过面板（108-1,108-2,208-1,224-1,224-2）热耦合到电子设备（102,202）的数量，其中热接收结构（112），212,312,412）可以包括液体流动隔室（330,442），输入端（216,316,416）以将冷却液体接收到液体流动室（330,442）和用于从液体流动室（330,442）释放温热液体的控制阀（214,314,414-1,414-2,414-3,414-4）。

30. 发明申请

US20150003009A1 RACK COOLING SYSTEM WITH A COOLING SECTION 审中-公开
标题翻译：具有冷却段的机架冷却系统
公开(公告)号：US20150003009A1
公开(公告)日：2015-01-01
申请号：US14376137
申请日：2012-03-12
申请人： David A. Moore , Michael L. Sabotta , John P. Franz , Tahir Cader
发明人： David A. Moore , Michael L. Sabotta , John P. Franz , Tahir Cader
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20736 , G06F1/20 , H05K7/20754 , H05K7/20781
摘要： Examples of the present disclosure may include methods and systems for cooling electronic components housed in a rack. An example system for cooling a rack may include a frame (100, 200a, 200b, 200c, 300a, 300b, 300c, 450, 452, 454) including a number of dividers (108-1, 208-1, 308-1, 408-1) internal to the rack that define a plurality of sections (104, 106, 112, 204, 206, 212, 304, 306, 312, 404-1, 404-2, 406-1, 406-2, 412-1, 412-2) within the rack. Moreover, an example system for cooling electronic components housed in a rack may further include a number of electronics sections (104, 106, 204, 206, 304, 306, 404-1, 404-2, 406-1, 406-2, 412-2) including at least a first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414), and a number of cooling sections (112, 212, 312, 412-1) including at least a first cooling system (102, 202, 402) that cools at least the first number of electronic components (114-1, 114-2, 214-1, 214-2, 214-3, 214-4, 214-5, 214-6, 214-7, 214-8, 314-1, 314-2, 414) via heat transfer through the number of dividers(108-1, 208-1, 308-1, 408-1).
摘要翻译：本公开的示例可以包括用于冷却容纳在机架中的电子部件的方法和系统。用于冷却机架的示例性系统可以包括包括多个分配器（108-1,208-1,308-1,40）的框架（100,200a，200b，200c，300a，300b，300c，450,452,454）（104,106,112,204,206,212,304,306,312,404-1,404-2,406-1,406-2,412）的所述机架内部定位多个部分 -1,412-2）。此外，用于冷却容纳在机架中的电子部件的示例性系统还可以包括多个电子部分（104,106,204,206,304,306,404-1,404-2,406-1,406-2，包括至少第一数量的电子部件（114-1,114-2,214-1,214-2,214-3,214-4,214-5,214-6,214-7，包括至少冷却至少第一冷却系统（102,202,402）的冷却部分（112,212,312,412-1）第一数量的电子部件（114-1,114-2,214-1,214-2,214-3,214-4,214-5,214-6,214-7,214-8,314-1），314-2,414），经由分配器（108-1,208-1,308-1,408-1）的数量的热传递。

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