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    • 25. 发明授权
    • Array substrate, manufacturing method thereof and display device
    • 阵列基板及其制造方法以及显示装置
    • US09570473B2
    • 2017-02-14
    • US14429928
    • 2014-05-26
    • BOE TECHNOLOGY GROUP CO., LTD.HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Kai Wang
    • H01L27/12G02F1/1345G02F1/1333
    • H01L27/124G02F1/133345G02F1/13458H01L27/1248H01L27/1259
    • An array substrate, a manufacturing method thereof and a display device are disclosed. The manufacturing method of an array substrate including: forming patterns including a thin film transistor, a gate wiring and a data wiring on the base substrate; the gate wiring and the data wiring are located in a PAD area; forming patterns of an insulating spacing layer, a first transparent electrode and a passivation layer, and forming a first via hole and a second via hole in areas corresponding to the gate wiring and the data wiring respectively to expose the gate wiring and the data wiring; a thickness of the insulating spacing layer in the PAD area on the array substrate is less than that of the insulating spacing layer in other areas. Therefore, the connection electrode can make better contact with the corresponding signal lines to avoid abnormal rubbing mura.
    • 公开了阵列基板,其制造方法和显示装置。 阵列基板的制造方法包括:在基底基板上形成包括薄膜晶体管,栅极布线和数据布线的图案; 栅极布线和数据布线位于PAD区域中; 形成绝缘间隔层,第一透明电极和钝化层的图案,并分别在与栅极布线和数据布线对应的区域中形成第一通孔和第二通孔,以露出栅极布线和数据布线; 阵列基板上的PAD区域中的绝缘间隔层的厚度小于其它区域中的绝缘间隔层的厚度。 因此,连接电极可以与相应的信号线更好地接触,以避免异常摩擦。