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    • 21. 发明授权
    • Flux spraying system and method
    • 助焊剂喷涂系统及方法
    • US08202565B2
    • 2012-06-19
    • US12603647
    • 2009-10-22
    • Yun-Qi LiuJie GeLei Nie
    • Yun-Qi LiuJie GeLei Nie
    • C23C16/52B05D5/00B23K1/20B05C11/00B05B15/04B05B3/00
    • H05K3/0091B23K3/082H05K3/3489H05K2203/1366
    • A flux spraying system controls a flux sprayer to selectively spray soldering flux onto a printed circuit board (PCB) by a fixture. The fixture is disposed between the PCB and the flux sprayer, and comprises a plurality of openings corresponding to target areas of the PCB. The flux spraying system comprises a statistic module, a calculation module, and a control module. The statistic module records attributes of the fixture to determine spraying areas on the fixture. The calculation module calculates movement parameters of the flux sprayer, a movement length during a movement period and spraying segments of the flux sprayer, and spray duration of the flux sprayer based on the movement length during one movement period and the spraying segments of the flux sprayer. The control module directs the flux sprayer to coat the target areas of the PCB through the openings of the fixture.
    • 焊剂喷射系统控制助焊剂喷雾器以通过夹具选择性地将焊剂喷射到印刷电路板(PCB)上。 夹具设置在PCB和助焊剂喷涂器之间,并且包括对应于PCB的目标区域的多个开口。 助熔喷涂系统包括统计模块,计算模块和控制模块。 统计模块记录夹具的属性,以确定夹具上的喷涂区域。 计算模块基于一个运动期间的移动长度和助焊剂喷雾器的喷射段,计算助焊剂喷射器的移动参数,移动期间的移动长度和喷雾段的助焊剂喷雾器的喷雾持续时间 。 控制模块引导助焊剂喷涂器通过夹具的开口涂覆PCB的目标区域。