专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20120061778A1 Method and Apparatus for Producing Chip Devices, and Chip Device Produced by Means of the Method 有权
标题翻译：用于生产芯片器件的方法和装置，以及通过该方法生产的芯片器件
公开(公告)号：US20120061778A1
公开(公告)日：2012-03-15
申请号：US13228971
申请日：2011-09-09
申请人： Michael Gerner , Hans Krueger , Alois Stelzl
发明人： Michael Gerner , Hans Krueger , Alois Stelzl
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： B81C1/00333
摘要： A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method.
摘要翻译：制造提供具有多个芯片部件的至少一个晶片的芯片器件。将晶片或晶片分离成各个芯片组件和/或分组成芯片组件。单个芯片组件和/或芯片组件组被施加到载体元件，使得在各个芯片组件和/或芯片组件组之间形成具有预定宽度的间隙。将聚合物引入到间隙中以形成由芯片部件和聚合物基体组成的复合元件。复合元件以这样的方式分离，即在每种情况下由芯片部件和聚合物基体的至少一个部分组成的芯片器件形成。本发明还涉及通过该方法制造的芯片器件。

22. 发明授权

US08110962B2 MEMS component and method for production 有权
标题翻译： MEMS组件和生产方法
公开(公告)号：US08110962B2
公开(公告)日：2012-02-07
申请号：US12642357
申请日：2009-12-18
申请人： Christian Bauer , Hans Krueger , Werner Ruile , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Werner Ruile , Alois Stelzl
IPC分类号： H01L29/84
CPC分类号： H03H9/02866 , H03H9/14538
摘要： A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.
摘要翻译： MEMS部件包括芯片，该芯片的后侧具有小于在部件中传播的声波的中心频率处波长的十分之一的粗糙度。用于散射体声波的金属结构设置在芯片的后侧，并且金属结构的材料与芯片的材料声学匹配。

23. 发明申请

US20110114355A1 HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTURING METHOD 有权
标题翻译：电子元件密封外壳和制造方法
公开(公告)号：US20110114355A1
公开(公告)日：2011-05-19
申请号：US12993299
申请日：2009-05-26
申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
IPC分类号： H05K5/06
CPC分类号： H01L23/06 , B81B7/0077 , B81C2203/0136 , H01L23/053 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/00
摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
摘要翻译：施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

24. 发明申请

US20090104415A1 Element with Optical Marking, Manufacturing Method, and Use 有权
标题翻译：具有光学标记，制造方法和使用的元件
公开(公告)号：US20090104415A1
公开(公告)日：2009-04-23
申请号：US12258301
申请日：2008-10-24
申请人： Alexander Schmajew , Hans Krueger , Alois Stelzl
发明人： Alexander Schmajew , Hans Krueger , Alois Stelzl
IPC分类号： B32B7/06 , B32B3/10 , H01L21/311 , B44C1/22
CPC分类号： H01L23/544 , B41M5/24 , H01L23/3171 , H01L23/3192 , H01L2223/54406 , H01L2223/5448 , H01L2924/0002 , Y10T428/24802 , Y10T428/24893 , Y10T428/24901 , H01L2924/00
摘要： A layer combination with a marking is proposed, for example, for a miniaturized electrical component. The layer combination includes a first layer and a different release layer, which is applied on it, on which a pattern is formed by a released pattern-like area. The release area is formed from an inorganic, semiconducting, insulating material, where the pattern produced thereon is machine-readable.
摘要翻译：提出了具有标记的层组合，例如，用于小型化电气部件。层组合包括施加在其上的第一层和不同的剥离层，其上由释放的图案状区域形成图案。释放区域由无机半导体绝缘材料形成，其中在其上产生的图案是机器可读的。

25. 发明授权

US09382110B2 Component and method for producing a component 有权
标题翻译：用于制造组件的组件和方法
公开(公告)号：US09382110B2
公开(公告)日：2016-07-05
申请号：US13818916
申请日：2011-07-29
申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
IPC分类号： H01L21/00 , B81B7/00 , B81C1/00
CPC分类号： B81B7/0077 , B81B2207/093 , B81C1/00269 , B81C1/00333 , B81C2203/0109 , B81C2203/0118 , H01L2224/16225 , H01L2224/8114 , H01L2924/1461 , H01L2924/00
摘要： A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.
摘要翻译：部件包括基板，芯片和框架。框架结合到基板，芯片搁置在框架上。框架和芯片的部件上的密封层被设计成密封由衬底，芯片和金属框架包围的体积。

26. 发明授权

US09165905B2 Method for connecting a plurality of unpackaged substrates 有权
标题翻译：用于连接多个未包装的基底的方法
公开(公告)号：US09165905B2
公开(公告)日：2015-10-20
申请号：US13330422
申请日：2011-12-19
申请人： Hans Krueger , Alexander Schmajew , Alois Stelzl
发明人： Hans Krueger , Alexander Schmajew , Alois Stelzl
IPC分类号： H05K3/02 , H05K3/10 , H01L23/00 , H01L25/065 , H01L25/00 , B81B7/00
CPC分类号： H01L24/94 , B81B7/007 , B81B2207/098 , H01L24/24 , H01L24/82 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/24011 , H01L2224/24051 , H01L2224/24147 , H01L2224/24991 , H01L2224/94 , H01L2225/06513 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/1068 , H01L2924/14 , H01L2924/1461 , Y10T29/49126 , H01L2224/81 , H01L2224/82
摘要： A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks.
摘要翻译：公开了彼此连接的多个未封装的基板。第一基板的第一主区域和/或第一主区域中的阶梯结构包括多个集成电路。阶梯式结构在集成电路之间运行。第一导体轨道从各个集成电路的至少一些接触连接延伸到阶梯式结构。第一基板在第一主区域的一侧连接到另一基板。第一基板从与第一主区域相对的第二主区域切断，使得第一基板被分成多个基板块。每个衬底片具有一个集成电路。第一导体轨迹可在基片之间的间隙中接近。第二导体轨道由第二主区域形成。至少一些第二导体轨道从第二主区域超过衬底片的侧壁延伸，直到第一导体轨迹。

27. 发明授权

US08404516B2 Method for producing a MEMS package 有权
标题翻译： MEMS封装的制造方法
公开(公告)号：US08404516B2
公开(公告)日：2013-03-26
申请号：US12627707
申请日：2009-11-30
申请人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
发明人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
IPC分类号： H01L21/00
CPC分类号： B81C1/00269 , B81B7/0058 , B81C2203/0136 , B81C2203/019 , H01L24/14 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.
摘要翻译：载体基板具有安装位置，在顶侧具有多个电连接焊盘，并且在下侧上与其连接的外部触点。金属框架包围安装位置的连接垫。 MEMS芯片在下侧具有电触点。 MEMS芯片以这样的方式被放置在载体基板的安装位置上，使得MEMS芯片在金属框架上的下侧的边缘区域被安置。使用倒装芯片工艺，MEMS芯片的电触点通过凸块连接到载体衬底的连接焊盘，金属框架连接到MEMS芯片，使得在MEMS芯片和载体衬底之间形成闭合腔。

28. 发明授权

US07544540B2 Encapsulated electrical component and production method 有权
标题翻译：封装电气元件及生产方法
公开(公告)号：US07544540B2
公开(公告)日：2009-06-09
申请号：US11578854
申请日：2005-04-21
申请人： Christian Bauer , Hans Krueger , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Alois Stelzl
IPC分类号： H01L21/44
CPC分类号： H01L21/44 , B81C1/0023 , H01L2224/16225 , H03H3/0072 , H03H9/1057
摘要： A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.
摘要翻译：微电子机械系统（MEMS）部件包括面板，具有包含有源部件结构的底部的芯片，其中芯片通过凸块安装在面板上，框架结构在面板上并且包围芯片的安装位置以及在框架结构和芯片之间封闭接缝的喷墨印刷结构。喷墨印刷结构具有在芯片的下边缘上方的上边缘。

29. 发明授权

US07259041B2 Method for the hermetic encapsulation of a component 有权
标题翻译：组件气密封装的方法
公开(公告)号：US07259041B2
公开(公告)日：2007-08-21
申请号：US10500279
申请日：2002-12-18
申请人： Alois Stelzl , Hans Krueger , Ernst Christl
发明人： Alois Stelzl , Hans Krueger , Ernst Christl
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/552
CPC分类号： H03H9/1078 , H01L21/561 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/15174 , H01L2224/81 , H01L2924/00
摘要： For hermetic encapsulation of a component, which includes a chip with component structures applied on a substrate in a flip-chip construction, a material is applied onto the lower edge of the chip and regions of the substrate abutting the chip, and then a first continuous metal layer is applied on the back side of the chip and on the material, as well as on edge regions of the substrate abutting the material. For hermetic encapsulation, a second sealing metal layer is subsequently applied by a solvent-free process at least on those regions of the first metal layer that cover the material.
摘要翻译：对于包括具有以倒装芯片结构施加在基板上的部件结构的芯片的部件的气密封装，将材料施加到芯片的下边缘和邻接芯片的基板的区域，然后施加第一连续金属层被施加在芯片的背面和材料上，以及与衬底邻接的材料的边缘区域上。为了气密封装，随后通过无溶剂工艺至少在覆盖材料的第一金属层的那些区域上施加第二密封金属层。

30. 发明申请

US20140226285A1 Component and Method for Producing a Component 审中-公开
标题翻译：组件和生产组件的方法
公开(公告)号：US20140226285A1
公开(公告)日：2014-08-14
申请号：US14239990
申请日：2012-08-10
申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Alexander Schmajew
发明人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Alexander Schmajew
IPC分类号： H05K5/06
CPC分类号： H05K5/066 , B81B7/0058 , B81B2207/093 , B81C2203/035 , H01L23/10 , H01L23/3121 , H01L24/16 , H01L2224/1134 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/12042 , H01L2924/1461 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： A component includes a substrate, a chip, and a frame. The frame, the substrate, and the chip enclose a volume. A metal sealing layer is provided which is designed to hermetically seal the volume. The metal sealing layer has a hardened liquid metal or a hardened liquid metal alloy.
摘要翻译：组件包括衬底，芯片和框架。框架，基板和芯片包围一个体积。提供了一种金属密封层，其被设计成气密地密封容积。金属密封层具有硬化液态金属或硬化液态金属合金。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式