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    • 24. 发明授权
    • Isolation with offset deep well implants
    • 隔离与偏移深井植入物
    • US08034699B2
    • 2011-10-11
    • US12464206
    • 2009-05-12
    • James W. AdkissonAndres BryantMark D. JaffeAlain Loiseau
    • James W. AdkissonAndres BryantMark D. JaffeAlain Loiseau
    • H01L21/425
    • H01L29/1083H01L21/26513H01L21/823892
    • A method implants impurities into well regions of transistors. The method prepares a first mask over a substrate and performs a first shallow well implant through the first mask to implant first-type impurities to a first depth of the substrate. The first mask is removed and a second mask is prepared over the substrate. The method performs a second shallow well implant through the second mask to implant second-type impurities to the first depth of the substrate and then removes the second mask. A third mask is prepared over the substrate. The third mask has openings smaller than openings in the first mask and the second mask. A first deep well implant is performed through the third mask to implant the first-type impurities to a second depth of the substrate, the second depth of the substrate being greater than the first depth of the substrate. The third mask is removed and a fourth mask is prepared over the substrate, the fourth mask has openings smaller than the openings in the first mask and the second mask. Then, a second deep well implant is performed through the fourth mask to implant the second-type impurities to the second depth of the substrate.
    • 一种方法是将杂质掺入晶体管的阱区。 该方法在衬底上制备第一掩模,并且通过第一掩模执行第一浅阱注入,以将第一类型杂质注入到衬底的第一深度。 去除第一个掩模,并在衬底上制备第二个掩模。 该方法通过第二掩模执行第二浅井注入,以将第二类型杂质植入衬底的第一深度,然后移除第二掩模。 在衬底上制备第三个掩模。 第三掩模具有比第一掩模和第二掩模中的开口小的开口。 通过第三掩模执行第一深孔注入,以将第一类型的杂质注入衬底的第二深度,衬底的第二深度大于衬底的第一深度。 去除第三掩模并在衬底上制备第四掩模,第四掩模具有小于第一掩模和第二掩模中的开口的开口。 然后,通过第四掩模进行第二深孔注入,以将第二类型的杂质植入到衬底的第二深度。
    • 27. 发明申请
    • INTEGRATED CIRCUIT DEVICE WITH SERIES-CONNECTED FIELD EFFECT TRANSISTORS AND INTEGRATED VOLTAGE EQUALIZATION AND METHOD OF FORMING THE DEVICE
    • 具有串联场效应晶体管和集成电压均衡的集成电路装置及其形成方法
    • US20110068399A1
    • 2011-03-24
    • US12563195
    • 2009-09-21
    • Andres BryantEdward J. Nowak
    • Andres BryantEdward J. Nowak
    • H01L29/786H01L29/78H01L21/336
    • H01L21/845H01L21/84H01L27/1203H01L27/1211
    • Disclosed is an integrated circuit device having series-connected planar or non-planar field effect transistors (FETs) with integrated voltage equalization and a method of forming the device. The series-connected FETs comprise gates positioned along a semiconductor body to define the channel regions for the series-connected FETs. Source/drain regions are located within the semiconductor body on opposing sides of the channel regions such that each portion of the semiconductor body between adjacent gates comprises one source/drain region for one field effect transistor abutting another source/drain region for another field effect transistor. Integrated voltage equalization is achieved through a conformal conductive layer having a desired resistance and positioned over the series-connected FETs such that it is electrically isolated from the gates, but in contact with the source/drain regions within the semiconductor body.
    • 公开了具有集成电压均衡的具有串联的平面或非平面场效应晶体管(FET)的集成电路器件和形成器件的方法。 串联连接的FET包括沿着半导体本体定位的门,以限定用于串联连接的FET的沟道区。 源极/漏极区域位于沟道区域的相对侧上的半导体本体内,使得相邻栅极之间的半导体本体的每个部分包括用于一个场效应晶体管的一个源极/漏极区域,用于与另一个场效应晶体管的另一个源极/漏极区域相邻接 。 集成电压均衡通过具有期望电阻的并行导电层实现,并且位于串联连接的FET上,使得其与栅极电隔离,但与半导体本体内的源极/漏极区域接触。
    • 28. 发明授权
    • MugFET with stub source and drain regions
    • MugFET具有短路源极和漏极区域
    • US07902000B2
    • 2011-03-08
    • US12132865
    • 2008-06-04
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L29/72
    • H01L29/785H01L29/66803
    • The present invention provides a semiconductor device that includes at least one semiconductor Fin structure atop the surface of a substrate; the semiconducting fin structure including a channel of a first conductivity type and source/drain regions of a second conductivity type, the source/drain regions present at each end of the semiconductor fin structure; a gate structure immediately adjacent to the semiconductor fin structure, a dielectric spacer abutting each sidewall of the gate structure wherein the each end of the fin structure extends a dimension that is less than about ¼ a length of the Si-containing fin structure from a sidewall of the dielectric spacer; and a semiconductor region to the each end of the semiconductor fin structure, wherein the semiconductor region to the each end of the semiconductor fin structure is separated from the gate structure by the dielectric spacer.
    • 本发明提供一种半导体器件,其包括在衬底的表面上方的至少一个半导体鳍结构; 所述半导体鳍结构包括第一导电类型的沟道和第二导电类型的源极/漏极区,所述源/漏区存在于所述半导体鳍结构的每个端部处; 靠近半导体鳍片结构的栅极结构,邻接栅极结构的每个侧壁的电介质间隔物,其中翅片结构的每个端部从侧壁延伸小于约含有Si的鳍结构的长度的尺寸 的电介质间隔物; 以及到半导体鳍片结构的每一端的半导体区域,其中半导体鳍片结构的每个端部的半导体区域通过电介质间隔物与栅极结构分离。
    • 29. 发明授权
    • Dense chevron non-planar field effect transistors and method
    • 密集V形非平面场效应晶体管及方法
    • US07847320B2
    • 2010-12-07
    • US11939574
    • 2007-11-14
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • Brent A. AndersonAndres BryantEdward J. Nowak
    • H01L29/80
    • H01L27/0207H01L21/823412H01L29/785
    • Disclosed are embodiments of semiconductor structure and a method of forming the semiconductor structure that simultaneously maximizes device density and avoids contacted-gate pitch and fin pitch mismatch, when multiple parallel angled fins are formed within a limited area on a substrate and then traversed by multiple parallel gates (e.g., in the case of stacked, chevron-configured, CMOS devices). This is accomplished by using, not a minimum lithographic fin pitch, but rather by using a fin pitch that is calculated as a function of a pre-selected contacted-gate pitch, a pre-selected fin angle and a pre-selected periodic pattern for positioning the fins relative to the gates within the limited area. Thus, the disclosed structure and method allow for the conversion of a semiconductor product design layout with multiple, stacked, planar FETs in a given area into a semiconductor product design layout with multiple, stacked, chevron-configured, non-planar FETs in the same area.
    • 公开了半导体结构的实施例以及形成半导体结构的方法,其同时使器件密度最大化并避免接触栅极间距和鳍片间距失配,当在衬底上的有限区域内形成多个平行的有角度的鳍片然后穿过多个平行 门(例如,在堆叠,人字形配置的CMOS设备的情况下)。 这是通过使用而不是最小光刻鳍间距来实现的,而是通过使用根据预先选择的接触栅间距,预选翅片角和预选择的周期性图案计算的鳍间距来实现 在有限的区域内相对于门定位翅片。 因此,所公开的结构和方法允许将具有给定区域中的多个堆叠的平面FET的半导体产品设计布局转换成具有多个,堆叠的,人造V形的非平面FET的半导体产品设计布局 区。