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    • 23. 发明授权
    • Multi-die integrated current sensor
    • US10914765B1
    • 2021-02-09
    • US16527636
    • 2019-07-31
    • Allegro MicroSystems, LLC
    • Wade BussingAlexander Latham
    • G01R15/20H01L43/02H01L43/08H01L43/06
    • A current sensor can include a lead frame. The lead frame can include a first lead and a second lead, wherein the first and second leads are coupled together at a first junction region of the lead frame, wherein the current sensor is operable to sense a magnetic field generated by a first current passing through the first junction region. The current sensor can further include a first die disposed proximate to the lead frame. The first die can include a first magnetic field sensing element disposed on a surface of the first die, a first circuit coupled to the first magnetic field sensing element for generating a first signal indicative of a first current, and a first node coupled to the first signal. The current sensor can further include a second die disposed proximate to the lead frame. The second die can include a second magnetic field sensing element disposed on a surface of the second die, a second circuit coupled to the second magnetic field sensing element for generating a second signal indicative of the first current passing through the first junction region or indicative of a second current passing through the lead frame and a second node coupled to the second signal.