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21. 发明授权

US5739773A Vehicular navigation apparatus enabling easy recognition of displayed traffic information 失效
标题翻译：车载导航装置能够容易地识别所显示的交通信息
公开(公告)号：US5739773A
公开(公告)日：1998-04-14
申请号：US748984
申请日：1996-11-14
申请人： Akihiro Morimoto , Masahiro Saiki
发明人： Akihiro Morimoto , Masahiro Saiki
IPC分类号： G09B29/10 , G01C21/00 , G01C21/36 , G08G1/0969 , G08G1/123
CPC分类号： G01C21/3694 , G08G1/0969
摘要： Traffic information items, for instance, jam information items, which are distant from the self vehicle position are displayed in a different manner from traffic information items near the self vehicle position. For example, a colored circle or a proper mark is displayed at a distant region containing traffic information items. Alternatively, part of distant traffic information items are not displayed. In a further alternative, the display color of distant traffic information items is made different from that of near traffic information items.
摘要翻译：交通信息项目例如远离自身车辆位置的堵塞信息项目以与自车辆位置附近的交通信息物品不同的方式显示。例如，在包含交通信息项的远处区域显示彩色圆圈或适当的标记。或者，远程交通信息项目的一部分不显示。在另一替代方案中，远距离交通信息项的显示颜色与近交通信息项的显示颜色不同。

22. 发明授权

US5440096A Welding process with delayed application of full current until after start of arc 失效
标题翻译：焊接过程延迟施加全电流，直到电弧开始
公开(公告)号：US5440096A
公开(公告)日：1995-08-08
申请号：US270578
申请日：1994-07-05
申请人： Nobukazu Ikeda , Hiroshi Morokoshi , Akihiro Morimoto
发明人： Nobukazu Ikeda , Hiroshi Morokoshi , Akihiro Morimoto
IPC分类号： B23K9/00 , B23K9/028 , B23K9/035 , B23K9/067 , B23K9/16 , B23K9/167 , F16L13/02 , B23K9/06
CPC分类号： B23K9/0672 , B23K9/0286 , B23K2201/06
摘要： In an arc welding process for welding pipes used to convey high purity gas, dispersion of particles into the pipes during welding is reduced by discharging an inert back shielding gas into one end of one pipe and holding the welding current at less than the normal welding current for a specified interval after the start of arc, the welding current thereafter being increased to its normal level.
摘要翻译：在用于输送高纯度气体的焊接管的电弧焊接过程中，通过将惰性背面保护气体排放到一个管的一端并将焊接电流保持在小于正常焊接电流在电弧开始之后的指定间隔内，焊接电流此后增加到其正常水平。

23. 发明授权

US08137787B1 Metal material having formed thereon chromium oxide passive film and method for producing the same, and parts contacting with fluid and system for supplying fluid and exhausting gas 失效
标题翻译：在其上形成有氧化铬钝化膜的金属材料及其制造方法，以及与流体接触的部件和用于供应流体和排出气体的系统
公开(公告)号：US08137787B1
公开(公告)日：2012-03-20
申请号：US09889269
申请日：2000-01-13
申请人： Tadahiro Ohmi , Yasuyuki Shirai , Nobukazu Ikeda , Eiji Ideta , Akihiro Morimoto , Tetsutaro Ogushi , Takehisa Konishi
发明人： Tadahiro Ohmi , Yasuyuki Shirai , Nobukazu Ikeda , Eiji Ideta , Akihiro Morimoto , Tetsutaro Ogushi , Takehisa Konishi
IPC分类号： B32B15/04 , B32B9/00 , B32B19/00
CPC分类号： C23C8/02 , C23C26/00 , Y10T428/24322 , Y10T428/24355 , Y10T428/31678
摘要： The object of the present invention is to form a chromium-oxide film, excellent in corrosion resistance, without containing an oxide film of other metal onto the metallic material. The chromium-oxide passivation film, excellent in corrosion resistance, without containing the oxide film of other metal can be formed inexpensively and in a short time, and a fluid supplying system for safely supplying fluid with hard corrosivity is able to be provided. One step of forming the passivation film consisting of a chromium oxide layer by giving heat treatment, in an oxidizing atmosphere, after coating chromium on the metallic material having a surface roughness (Ra) not more than 1.5 μm.
摘要翻译：本发明的目的是形成耐腐蚀性优异的氧化铬膜，而不含金属材料上的其它金属的氧化膜。可以廉价且短时间地形成不含有其它金属的氧化物膜的耐腐蚀性优异的氧化铬钝化膜，能够提供用于安全地供给具有硬腐蚀性的流体的流体供给系统。在表面粗糙度（Ra）不大于1.5μm的金属材料上涂覆铬后，在氧化气氛中进行热处理，形成由氧化铬层构成的钝化膜的一个步骤。

24. 发明授权

US07995001B2 Antenna for portable terminal and portable terminal using same 失效
标题翻译：天线用于便携式终端和便携终端使用相同
公开(公告)号：US07995001B2
公开(公告)日：2011-08-09
申请号：US10546191
申请日：2004-02-17
申请人： Tadahiro Ohmi , Akihiro Morimoto , Fumiaki Nakamura
发明人： Tadahiro Ohmi , Akihiro Morimoto , Fumiaki Nakamura
IPC分类号： H01Q15/00
CPC分类号： H01Q9/0485
摘要： A dielectric resonator antenna which emits an electric wave by having a dielectric body resonate is disclosed. A magnetic material is contained in the electric body, thereby increasing the relative permeability to more than 1 and lowering the relative permittivity. Consequently, the Q-value of the resonance can be lowered while maintaining the rate of wavelength shortening. With this technique, a broadband dielectric resonator antenna can be realized.
摘要翻译：公开了一种通过具有电介质体共振来发射电波的介质谐振器天线。磁性材料被包含在电体中，从而将相对磁导率提高到大于1并降低相对介电常数。因此，可以在保持波长缩短率的同时降低谐振的Q值。利用这种技术，可以实现宽带介质谐振器天线。

25. 发明授权

US07939360B2 Semiconductor device and manufacturing method therefor 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07939360B2
公开(公告)日：2011-05-10
申请号：US12364072
申请日：2009-02-02
申请人： Hiroshi Asami , Yoshihiro Nabe , Akihiro Morimoto
发明人： Hiroshi Asami , Yoshihiro Nabe , Akihiro Morimoto
IPC分类号： H01L21/00 , H01L31/0203
CPC分类号： H01L27/14687 , H01L24/48 , H01L27/14618 , H01L31/0203 , H01L2224/48 , H01L2924/00014 , H01L2924/16195 , H01L2924/181 , H01L2224/48091 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substrate is bonded to the spacer via a second adhesive and disposed above the light-reception area. A first projection having a predetermined height is formed on a surface of the spacer which is on a side of the semiconductor chip, and the first projection abuts on the semiconductor chip.
摘要翻译：一种半导体器件，包括形成有光接收区域的半导体芯片，间隔物和透明基板。间隔物通过第一粘合剂结合到半导体芯片并且围绕光接收区域。透明基板通过第二粘合剂粘合到间隔件上并设置在光接收区域的上方。具有预定高度的第一突起形成在半导体芯片一侧的间隔物的表面上，第一突起抵接在半导体芯片上。

26. 发明授权

US07893345B2 Thermoelectric module device 失效
标题翻译：热电模块装置
公开(公告)号：US07893345B2
公开(公告)日：2011-02-22
申请号：US11753123
申请日：2007-05-24
申请人： Akihiro Morimoto , Takahiro Kimura
发明人： Akihiro Morimoto , Takahiro Kimura
IPC分类号： H01L35/28
CPC分类号： H01L35/10 , H01L35/08 , H01L35/34
摘要： A thermoelectric module device includes a first substrate having inner and outer surfaces, a second substrate having inner and outer surfaces, a Peltier-junction module sandwiched between the inner surfaces of the first and second substrates, the Peltier-junction module being made up of a series of Peltier junctions including a pair of outermost Peltier junctions, a pair of power supply electrodes connected to the pair of the outermost Peltier junctions, respectively, and a metallization layer provided on the outer surface of the second substrate for being soldered to a package, the metallization layer being divided into spaced first and second portions which correspond to the Peltier-junction module and the pair of power supply electrodes, respectively.
摘要翻译：热电模块装置包括具有内表面和外表面的第一基板，具有内表面和外表面的第二基板，夹在第一和第二基板的内表面之间的珀耳帖结模块，珀耳帖结模块由一系列包括一对最外层的珀尔帖接头的珀尔帖接头，分别连接到一对最外层的珀尔帖接头的一对电源电极以及设在第二基板的外表面上用于焊接到封装的金属化层，金属化层分别分别对应于珀耳帖结模块和一对电源电极的间隔开的第一和第二部分。

27. 发明授权

US07815872B2 Reactor for generating moisture and moisture generating and feeding apparatus for which the reactor is employed 有权
标题翻译：用于产生使用反应器的水分和水分产生和进料装置的反应器
公开(公告)号：US07815872B2
公开(公告)日：2010-10-19
申请号：US11570667
申请日：2005-07-04
申请人： Toshirou Nariai , Kouji Kawada , Keiji Hirao , Yukio Minami , Akihiro Morimoto , Nobukazu Ikeda
发明人： Toshirou Nariai , Kouji Kawada , Keiji Hirao , Yukio Minami , Akihiro Morimoto , Nobukazu Ikeda
IPC分类号： B01J8/02 , C01B5/00
CPC分类号： B01J12/007 , B01J2219/00078 , B01J2219/00087 , B01J2219/00096 , B01J2219/00135 , C01B5/00 , F28D2021/0029 , F28F3/02 , H01L21/67017
摘要： A reactor for generating moisture, with which hydrogen and oxygen fed into the reactor contact with a platinum coating catalyst layer to activate reactivity so that hydrogen and oxygen react under conditions of non-combustion, wherein the reactor includes a cooler comprising a heat dissipation body substrate in which a heater insertion hole is made in the center to fix to the outer surface of the reactor structural component on the outlet side and a cooler on the outlet side made up of a plural number of heat dissipation bodies installed vertically in parallel on the part excluding the area where the afore-mentioned heater insertion hole of the heat dissipation body substrate exists, and a part of the heater to heat the reactor is inserted in the heater insertion hole so as to fix to the outer surface of the reactor structural component on the outlet side.
摘要翻译：一种用于产生水分的反应器，通过该反应器将进入反应器的氢气和氧气与铂涂层催化剂层接触以激活反应性，使氢气和氧气在非燃烧条件下反应，其中反应器包括一个包含散热体基体其中在中心处制造加热器插入孔以固定到出口侧的反应堆结构部件的外表面和出口侧的冷却器，该多个散热体垂直并排安装在部件上不包括存在散热体基板的上述加热器插入孔的区域，并且将加热器的加热器的一部分插入加热器插入孔中，以便将反应器结构部件的外表面固定在出口侧。

28. 发明申请

US20100244270A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件和半导体器件的制造方法
公开(公告)号：US20100244270A1
公开(公告)日：2010-09-30
申请号：US12727804
申请日：2010-03-19
申请人： Hiroshi Asami , Masaki Hatano , Akihiro Morimoto
发明人： Hiroshi Asami , Masaki Hatano , Akihiro Morimoto
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L27/14636 , H01L21/486 , H01L23/49827 , H01L24/83 , H01L27/1464 , H01L27/1469 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/00 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01083 , H01L2224/13111 , H01L2924/00012 , H01L2224/13109 , H01L2924/00014
摘要： A semiconductor device includes: a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the component substrate; via holes made in the support plate material; a conducting material filled in the via holes; and a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material.
摘要翻译：半导体器件包括：半导体器件的元件衬底; 设置在所述部件基板的一个表面上的电极焊盘; 增强部件基板的支撑板材料; 在支撑板材料上形成的通孔; 填充在通孔中的导电材料; 以及插入在电极焊盘和导电材料之间并将部件基板和支撑板材料接合的接合部件。

29. 发明申请

US20090272721A1 Athmosphere-Controlled Bonding Apparatus, Bonding Method, and Electronic Device 审中-公开
标题翻译：气氛控制接合设备，接合方法和电子设备
公开(公告)号：US20090272721A1
公开(公告)日：2009-11-05
申请号：US11992667
申请日：2005-09-28
申请人： Tadahiro Ohmi , Akihiro Morimoto
发明人： Tadahiro Ohmi , Akihiro Morimoto
IPC分类号： B23K11/16 , B23K11/00
CPC分类号： H01L24/81 , B23K20/004 , B23K20/02 , B23K20/10 , B23K2101/40 , H01L21/67144 , H01L24/75 , H01L24/78 , H01L24/85 , H01L2224/75 , H01L2224/78 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/85 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H01L2924/3025 , H01L2224/48 , H01L2224/45099
摘要： In a bonding apparatus for bonding under pressure a pressure-bonding portion, the concentration of water in a pressure-bonding portion atmosphere inside the apparatus is set smaller than that in an atmosphere outside the apparatus, thereby enabling pressure bonding under low-temperature and low-pressure conditions. In this case, the amount of adsorbed water on each surface of a bonding metal terminal and a to-be-bonded metal terminal forming the pressure-bonding portion is set to 1×1016 molecules/cm2 or less.
摘要翻译：在压力接合部的接合装置中，设备内部的压接部气氛中的水的浓度设定为小于设备外部的气氛中的水分浓度，从而能够在低温低温下进行压接压力条件。在这种情况下，将形成压接部的接合金属端子和被接合金属端子的各表面上的吸附水量设定为1×1016分/ cm 2以下。

30. 发明授权

US07503180B2 Thermoelectric conversion module and electronic device 有权
标题翻译：热电转换模块和电子设备
公开(公告)号：US07503180B2
公开(公告)日：2009-03-17
申请号：US11389047
申请日：2006-03-27
申请人： Akihiro Morimoto
发明人： Akihiro Morimoto
IPC分类号： F25B21/02
CPC分类号： H01L35/32 , F25B21/02 , H01S5/02208 , H01S5/02248 , H01S5/02284 , H01S5/02415 , H01S5/0683
摘要： A thermoelectric conversion module includes a first insulated substrate formed in a plate shape, a second insulated substrate formed in a plate shape, the first insulated substrate and the second insulated substrate are provided so as to be paired, plural thermoelectric elements provided between the insulated substrates so as to be joined thereto, a first object joined to the first insulated substrate in a manner where the first object is cooled and a second object joined to the second insulated substrate in a manner where the second object is heated, wherein a thickness of the first insulated substrate is set on the basis of a linear expansion of the first object, and a thickness of the second insulated substrates is set on the basis of a linear expansion of the second object.
摘要翻译：热电转换模块包括以板状形成的第一绝缘基板，形成为板状的第二绝缘基板，第一绝缘基板和第二绝缘基板成对配置，设置在绝缘基板之间的多个热电元件以与第一物体接合的方式，以第一物体被冷却的方式接合到第一绝缘基板的第一物体和以第二物体被加热的方式接合到第二绝缘基板的第二物体，其中，基于第一物体的线性膨胀来设定第一绝缘基板，并且基于第二物体的线性膨胀来设定第二绝缘基板的厚度。

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